| Patent | Date |
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Method of forming metal lines and bumps for semiconductor devices
Grant 7,855,144 - Kim , et al. December 21, 2 | 2010-12-21 |
Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package
Grant 7,825,495 - Ryu , et al. November 2, 2 | 2010-11-02 |
Interconnection structure of integrated circuit chip
Grant 7,732,319 - Jeong , et al. June 8, 2 | 2010-06-08 |
Apparatus for testing objects under controlled conditions
App 20090153171 - Lee; Sang-Sik ; et al. | 2009-06-18 |
Fabrication method of wafer level chip scale packages
Grant 7,524,763 - Kim , et al. April 28, 2 | 2009-04-28 |
Semiconductor Packages And Methods Of Fabricating The Same
App 20090020878 - RYU; Seung-Kwan ; et al. | 2009-01-22 |
Semiconductor Device And Method Of Manufacturing The Same
App 20080185738 - CHUNG; Jae Sik ; et al. | 2008-08-07 |
Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package
App 20080174025 - Ryu; Seung-Kwan ; et al. | 2008-07-24 |
Method of forming metal lines and bumps for semiconductor devices
App 20080076248 - Kim; Soon-bum ; et al. | 2008-03-27 |
Interconnection Structure Of Integrated Circuit Chip
App 20080036081 - JEONG; Se-Young ; et al. | 2008-02-14 |
Wafer level chip scale package having a gap and method for manufacturing the same
Grant 7,312,143 - Park , et al. December 25, 2 | 2007-12-25 |
Interconnection structure of integrated circuit chip
Grant 7,307,342 - Jeong , et al. December 11, 2 | 2007-12-11 |
Chip stack package
App 20070200216 - Kim; Soon-Bum ; et al. | 2007-08-30 |
Wafer level chip scale package having a gap and method for manufacturing the same
App 20070176290 - Park; Myeong-Soon ; et al. | 2007-08-02 |
Wafer Level Chip Scale Package Having Rerouting Layer And Method Of Manufacturing The Same
App 20070164431 - LEE; In Young ; et al. | 2007-07-19 |
Wafer level chip scale package having a gap and method for manufacturing the same
Grant 7,205,660 - Park , et al. April 17, 2 | 2007-04-17 |
Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same
App 20070069320 - Lee; In-Young ; et al. | 2007-03-29 |
Method for manufacturing wafer level chip stack package
Grant 7,151,009 - Kim , et al. December 19, 2 | 2006-12-19 |
Wafer level chip scale package having a gap and method for manufacturing the same
App 20060214293 - Park; Myeong-Soon ; et al. | 2006-09-28 |
Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip
App 20060118972 - Baek; Seung-Duk ; et al. | 2006-06-08 |
Method of forming bump that may reduce possibility of losing contact pad material
App 20060073704 - Jeong; Se-young ; et al. | 2006-04-06 |
Interconnection structure of integrated circuit chip
App 20060060970 - Jeong; Se-Young ; et al. | 2006-03-23 |
Electrode structure of a semiconductor device and method of manufacturing the same
App 20060038291 - Chung; Hyun-soo ; et al. | 2006-02-23 |
Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby
App 20060019467 - Lee; In-Young ; et al. | 2006-01-26 |
Method for manufacturing wafer level chip stack package
App 20050280160 - Kim, Soon-Bum ; et al. | 2005-12-22 |
Fabrication method of wafer level chip scale packages
App 20050277293 - Kim, Soon-Bum ; et al. | 2005-12-15 |
Lead-on-chip semiconductor package and method for making the same
Grant 5,933,708 - Sim , et al. August 3, 1 | 1999-08-03 |
Method of producing a semiconductor wafer using ultraviolet sensitive tape
Grant 5,840,614 - Sim , et al. November 24, 1 | 1998-11-24 |
Method of manufacturing semiconductor chip package
Grant 5,753,532 - Sim May 19, 1 | 1998-05-19 |
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