Shiraki; Hiroyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shiraki; Hiroyuki.The latest application filed is for "thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing pri".

Company Profile

2.15.16

Shiraki; Hiroyuki - Okinawa JP
SHIRAKI; Hiroyuki - Osaka JP
Shiraki; Hiroyuki - Ichikawa JP
Shiraki; Hiroyuki - Tokyo JP
Shiraki; Hiroyuki - Ichikawa-shi JP
Shiraki; Hiroyuki - Osaki JP
Shiraki, Hiroyuki - Shinagawa JP
Shiraki; Hiroyuki - Kobe JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrode provided with UBM structure having a barrier layer for reducing solder diffusion into the electrode and a method for producing the same Grant 10,347,774 - Kishi , et al. July 9, 2	2019-07-09
Thermosetting Resin Composition, Metal-clad Laminated Plate, Insulating Sheet, Printed Wiring Board, Method Of Manufacturing Pri App 20190181081 - TAMIYA; Hiroki ; et al.	2019-06-13
Radiation detector manufactured by dicing a semiconductor wafer and dicing method therefor Grant 9,755,098 - Kishi , et al. September 5, 2	2017-09-05
Thermosetting Resin Composition, Metal-clad Laminated Plate, Insulating Sheet, Printed Wiring Board, Method Of Manufacturing Printed Wiring Board, And Package Substrate App 20160293538 - TAMIYA; HIROKI ; et al.	2016-10-06
Radiation Detector Manufactured By Dicing A Semiconductor Wafer And Dicing Method Therefor App 20160133776 - KISHI; Noriyuki ; et al.	2016-05-12
Electrode Provided With Ubm Structure And Method For Producing Same App 20150243801 - KISHI; Noriyuki ; et al.	2015-08-27
Detector Element, Radiation Detector, Medical Device, And Method For Producing Such A Detector Element App 20130161773 - DIERRE; Fabrice ; et al.	2013-06-27
Heat treatment jig and heat treatment method for silicon wafer Grant 8,026,182 - Nakada , et al. September 27, 2	2011-09-27
Production method for silicon wafers and silicon wafer Grant 7,670,965 - Nakada , et al. March 2, 2	2010-03-02
Heat Treatment Jig And Heat Treatment Method For Silicon Wafer App 20090127746 - NAKADA; Yoshinobu ; et al.	2009-05-21
Method for producing silicon wafer and silicon wafer Grant 7,521,381 - Nakada , et al. April 21, 2	2009-04-21
Heat treatment jig and heat treatment method for silicon wafer Grant 7,481,888 - Nakada , et al. January 27, 2	2009-01-27
Silicon wafer heat treatment jig, and silicon wafer heat treatment method App 20060208434 - Nakada; Yoshinobu ; et al.	2006-09-21
Aqueous emulsion composition and adherent composition Grant 7,026,369 - Kuroda , et al. April 11, 2	2006-04-11
Gas barrier polyurethane resin Grant 6,979,493 - Uchida , et al. December 27, 2	2005-12-27
Production method for silicon wafers and silicon wafer App 20050130452 - Nakada, Yoshinobu ; et al.	2005-06-16
Polyurethane resin water dispersion and aqueous polyurethane adhesive Grant 6,881,788 - Shimizu , et al. April 19, 2	2005-04-19
Epitaxial wafer Grant 6,818,197 - Ikezawa , et al. November 16, 2	2004-11-16
Method for evaluating the quality of a semiconductor substrate Grant 6,693,286 - Hasegawa , et al. February 17, 2	2004-02-17
Gas barrier polyurethane resin App 20030207122 - Uchida, Takashi ; et al.	2003-11-06
Epitaxial wafer App 20030157341 - Ikezawa, Kazuhiro ; et al.	2003-08-21
Gas barrier polyurethane resin Grant 6,569,533 - Uchida , et al. May 27, 2	2003-05-27
Method and apparatus for evaluating the quality of a semiconductor substrate App 20030094579 - Hasegawa, Takeshi ; et al.	2003-05-22
Polyurethane resin water dispersion and aqueous polyurethane adhesive App 20030060589 - Shimizu, Hyoue ; et al.	2003-03-27
Aqueous emulsion composition and adherent composition App 20030036581 - Kuroda, Kenji ; et al.	2003-02-20
Method and apparatus for evaluating the quality of a semiconductor substrate App 20020045283 - Hasegawa, Takeshi ; et al.	2002-04-18
Semiconductor Device App 20020036517 - Shiraki, Hiroyuki ; et al.	2002-03-28
Powder coating composition Grant 6,239,215 - Morita , et al. May 29, 2	2001-05-29
Primer composition Grant 5,866,657 - Tominaga , et al. February 2, 1	1999-02-02
Urethane acrylate compositions Grant 4,507,458 - Shiraki , et al. March 26, 1	1985-03-26

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