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name:-0.024534940719604
name:-0.013828992843628
name:-0.00042295455932617
Shiozawa; Masakuni Patent Filings

Shiozawa; Masakuni

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shiozawa; Masakuni.The latest application filed is for "drive device, electronic component carrying device, electronic component inspection device, robot hand, and robot".

Company Profile
0.15.23
  • Shiozawa; Masakuni - Chino JP
  • Shiozawa; Masakuni - Nagano N/A JP
  • Shiozawa; Masakuni - Suwa JP
  • Shiozawa; Masakuni - Sakata JP
  • Shiozawa, Masakuni - Sakata-shi JP
  • Shiozawa, Masakuni - Chino-shi JP
  • Shiozawa, Masakuni - Suwa-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Drive Device, Electronic Component Carrying Device, Electronic Component Inspection Device, Robot Hand, And Robot
App 20140352459 - Matsuzawa; Akira ;   et al.
2014-12-04
Electronic component testing device and electronic component transport method
Grant 8,816,709 - Shiozawa August 26, 2
2014-08-26
Component test apparatus and component transport method
Grant 8,558,570 - Shiozawa , et al. October 15, 2
2013-10-15
Handler And Test Apparatus
App 20130181576 - SHIOZAWA; Masakuni ;   et al.
2013-07-18
Electronic Component Carrying Device And Electronic Component Carrying Method
App 20130027542 - SHIOZAWA; Masakuni
2013-01-31
Electronic Component Testing Device And Electronic Component Transport Method
App 20110279136 - SHIOZAWA; Masakuni
2011-11-17
Component Test Apparatus And Component Transport Method
App 20110268538 - SHIOZAWA; Masakuni ;   et al.
2011-11-03
Component test apparatus and component transport method
Grant 8,008,939 - Shiozawa , et al. August 30, 2
2011-08-30
Component test apparatus having a pair of rotary transport hands
Grant 7,888,928 - Shiozawa , et al. February 15, 2
2011-02-15
Component Test Apparatus And Component Transport Method
App 20090232626 - SHIOZAWA; Masakuni ;   et al.
2009-09-17
Component Test Apparatus
App 20090201040 - SHIOZAWA; Masakuni ;   et al.
2009-08-13
Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device
Grant 7,562,806 - Shiozawa July 21, 2
2009-07-21
Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device
Grant 7,410,826 - Shiozawa August 12, 2
2008-08-12
Method of manufacturing semiconductor device and method of manufacturing electronic device
Grant 7,371,607 - Shiozawa May 13, 2
2008-05-13
Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
App 20070252285 - Shiozawa; Masakuni ;   et al.
2007-11-01
Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
Grant 7,256,072 - Shiozawa , et al. August 14, 2
2007-08-14
Selective packaging of tested semiconductor devices
Grant 7,195,935 - Shiozawa March 27, 2
2007-03-27
Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
App 20060125096 - Shiozawa; Masakuni ;   et al.
2006-06-15
Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device
App 20060096701 - Shiozawa; Masakuni
2006-05-11
Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device
Grant 7,017,636 - Shiozawa March 28, 2
2006-03-28
Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device
App 20060008759 - Shiozawa; Masakuni
2006-01-12
Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device
Grant 6,984,125 - Shiozawa January 10, 2
2006-01-10
Semiconductor devices and method for manufacturing the same, semiconductor device modules, circuit substrates and electronic apparatuses
App 20050263759 - Shiozawa, Masakuni
2005-12-01
Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
App 20050184379 - Shiozawa, Masakuni ;   et al.
2005-08-25
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
App 20050098869 - Shiozawa, Masakuni
2005-05-12
Method of manufacturing semiconductor device and method of manufacturing electronics device
App 20050003587 - Shiozawa, Masakuni
2005-01-06
Electrically conductive material printing apparatus, printing mask cleaning method, and printing mask cleaning program
App 20040237999 - Shiozawa, Masakuni
2004-12-02
Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
App 20040238948 - Shiozawa, Masakuni ;   et al.
2004-12-02
Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device
App 20040002227 - Shiozawa, Masakuni
2004-01-01
Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device
App 20030221853 - Shiozawa, Masakuni
2003-12-04
Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device
App 20030224555 - Shiozawa, Masakuni
2003-12-04
Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making
Grant 6,638,785 - Shiozawa , et al. October 28, 2
2003-10-28
Interconnect substrate, apparatus of applying adhesive material, semiconductor device, circuit board and electronic instrument
Grant 6,566,763 - Shiozawa May 20, 2
2003-05-20
Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making the same
App 20030080424 - Shiozawa, Masakuni ;   et al.
2003-05-01
Adhesive material applying method and semiconductor device manufacturing method
App 20020074617 - Shiozawa, Masakuni
2002-06-20

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