| Patent | Date |
|---|
Flip Chip Semiconductor Package With A Leadframe To Enhance Package Mechanical Stability And Heat Dissipation
App 20220270942 - Charusabha; Nataporn ; et al. | 2022-08-25 |
EMI Shielding for Flip Chip Package with Exposed Die Backside
App 20220246541 - Cho; SungWon ; et al. | 2022-08-04 |
EMI shielding for flip chip package with exposed die backside
Grant 11,342,278 - Cho , et al. May 24, 2 | 2022-05-24 |
Semiconductor device and method of forming MEMS package
Grant 11,319,207 - Lin , et al. May 3, 2 | 2022-05-03 |
Semiconductor Package With Dams
App 20220093482 - Punzalan; Jeffrey ; et al. | 2022-03-24 |
Reliable Semiconductor Packages
App 20220093664 - Punzalan; Jeffrey ; et al. | 2022-03-24 |
Semiconductor Packages With Integrated Shielding
App 20220028798 - SIRINORAKUL; Saravuth ; et al. | 2022-01-27 |
Reliable Semiconductor Packages
App 20210399035 - PUNZALAN; Jeffrey ; et al. | 2021-12-23 |
Reliable Semiconductor Packages
App 20210366963 - SHIM; Il Kwon ; et al. | 2021-11-25 |
Integrated circuit packaging system with shielding and method of manufacture thereof
Grant 11,145,603 - Han , et al. October 12, 2 | 2021-10-12 |
Semiconductor device and method of forming double-sided fan-out wafer level package
Grant 11,127,668 - Shim , et al. September 21, 2 | 2021-09-21 |
Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging
App 20210233815 - Strothmann; Thomas J. ; et al. | 2021-07-29 |
Reliable Semiconductor Packages
App 20210193483 - Shim; IL Kwon ; et al. | 2021-06-24 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
Grant 11,024,561 - Shim , et al. June 1, 2 | 2021-06-01 |
Integrated circuit packaging system with shielding and method of manufacture thereof
Grant 11,024,585 - Han , et al. June 1, 2 | 2021-06-01 |
Semiconductor device and method of using a standardized carrier in semiconductor packaging
Grant 11,011,423 - Strothmann , et al. May 18, 2 | 2021-05-18 |
EMI Shielding for Flip Chip Package with Exposed Die Backside
App 20200395312 - Cho; SungWon ; et al. | 2020-12-17 |
Semiconductor Device and Method of Forming a 3D Interposer System-in-Package Module
App 20200373289 - Yang; DeokKyung ; et al. | 2020-11-26 |
Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
App 20200335478 - Lin; Yaojian ; et al. | 2020-10-22 |
Semiconductor Device and Method of Forming MEMS Package
App 20200325014 - Lin; Yaojian ; et al. | 2020-10-15 |
EMI shielding for flip chip package with exposed die backside
Grant 10,804,217 - Cho , et al. October 13, 2 | 2020-10-13 |
Semiconductor device and method of forming a 3D interposer system-in-package module
Grant 10,797,039 - Yang , et al. October 6, 2 | 2020-10-06 |
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
Grant 10,790,158 - Lin , et al. September 29, 2 | 2020-09-29 |
Semiconductor Device and Method of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units
App 20200294890 - Shim; Il Kwon ; et al. | 2020-09-17 |
Semiconductor device and method of forming embedded wafer level chip scale packages
Grant 10,777,528 - Lin , et al. Sept | 2020-09-15 |
Semiconductor device and method of forming MEMS package
Grant 10,730,745 - Lin , et al. | 2020-08-04 |
Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages
App 20200227383 - Han; Byung Joon ; et al. | 2020-07-16 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
Grant 10,707,150 - Shim , et al. | 2020-07-07 |
Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages
Grant 10,658,330 - Han , et al. | 2020-05-19 |
EMI Shielding for Flip Chip Package with Exposed Die Backside
App 20200051926 - Cho; SungWon ; et al. | 2020-02-13 |
Semiconductor Device and Method of Forming Double-Sided Fan-Out Wafer Level Package
App 20200006215 - Shim; Il Kwon ; et al. | 2020-01-02 |
Semiconductor device and method of forming double-sided fan-out wafer level package
Grant 10,453,785 - Shim , et al. Oc | 2019-10-22 |
Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits
Grant 10,388,612 - Lin , et al. A | 2019-08-20 |
Semiconductor device and method of forming a 3D interposer system-in-package module
Grant 10,388,637 - Kim , et al. A | 2019-08-20 |
Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging
App 20190109048 - Strothmann; Thomas J. ; et al. | 2019-04-11 |
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern
App 20190109015 - Lin; Yaojian ; et al. | 2019-04-11 |
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
Grant 10,242,948 - Shim , et al. | 2019-03-26 |
Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus
Grant 10,217,873 - Han , et al. Feb | 2019-02-26 |
Semiconductor device and method of using a standardized carrier in semiconductor packaging
Grant 10,181,423 - Strothmann , et al. Ja | 2019-01-15 |
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
Grant 10,177,010 - Lin , et al. J | 2019-01-08 |
Semiconductor Device and Method of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units
App 20180331018 - Shim; Il Kwon ; et al. | 2018-11-15 |
Double-sided semiconductor package and dual-mold method of making same
Grant 10,115,672 - Shim , et al. October 30, 2 | 2018-10-30 |
Integrated Circuit Packaging System With Shielding And Method Of Manufacture Thereof
App 20180294235 - Han; Byung Joon ; et al. | 2018-10-11 |
Integrated Circuit Packaging System With Shielding And Method Of Manufacture Thereof
App 20180294236 - Han; Byung Joon ; et al. | 2018-10-11 |
Semiconductor device and method of forming stress relief layer between die and interconnect structure
Grant 10,083,916 - Shim , et al. September 25, 2 | 2018-09-25 |
Semiconductor Device and Method of Forming a 3D Interposer System-in-Package Module
App 20180261569 - Yang; DeokKyung ; et al. | 2018-09-13 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
Grant 10,049,964 - Shim , et al. August 14, 2 | 2018-08-14 |
Integrated circuit packaging system with shielding and method of manufacturing thereof
Grant 9,997,468 - Han , et al. June 12, 2 | 2018-06-12 |
Semiconductor Device and Method of Forming a 3D Interposer System-In-Package Module
App 20180158768 - Kim; OhHan ; et al. | 2018-06-07 |
Semiconductor device and method of forming low profile fan-out package with vertical interconnection units
Grant 9,978,665 - Marimuthu , et al. May 22, 2 | 2018-05-22 |
Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy
Grant 9,934,998 - Han , et al. April 3, 2 | 2018-04-03 |
Double-Sided Semiconductor Package and Dual-Mold Method of Making Same
App 20180076142 - Shim; Il Kwon ; et al. | 2018-03-15 |
Double-sided semiconductor package and dual-mold method of making same
Grant 9,893,017 - Shim , et al. February 13, 2 | 2018-02-13 |
Integrated circuit packaging system with under bump metallization and method of manufacture thereof
Grant 9,865,554 - Shim , et al. January 9, 2 | 2018-01-09 |
Semiconductor Device and Method of Forming Electromagnetic (EM) Shielding for LC Circuits
App 20170330840 - Lin; Yaojian ; et al. | 2017-11-16 |
Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages
App 20170294406 - Han; Byung Joon ; et al. | 2017-10-12 |
Semiconductor Device and Method of Forming Low Profile Fan-Out Package with Vertical Interconnection Units
App 20170271241 - Marimuthu; Pandi C. ; et al. | 2017-09-21 |
Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
App 20170271305 - Lin; Yaojian ; et al. | 2017-09-21 |
Semiconductor Device and Method of Forming MEMS Package
App 20170260043 - Lin; Yaojian ; et al. | 2017-09-14 |
Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits
Grant 9,754,897 - Lin , et al. September 5, 2 | 2017-09-05 |
Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages
Grant 9,721,862 - Han , et al. August 1, 2 | 2017-08-01 |
Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package
Grant 9,721,922 - Marimuthu , et al. August 1, 2 | 2017-08-01 |
Semiconductor device and method of forming low profile fan-out package with vertical interconnection units
Grant 9,704,780 - Marimuthu , et al. July 11, 2 | 2017-07-11 |
Semiconductor device and method of forming embedded wafer level chip scale packages
Grant 9,704,824 - Lin , et al. July 11, 2 | 2017-07-11 |
Semiconductor device and method of forming MEMS package
Grant 9,701,534 - Lin , et al. July 11, 2 | 2017-07-11 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 9,666,500 - Lin , et al. May 30, 2 | 2017-05-30 |
Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging
App 20170133270 - Strothmann; Thomas J. ; et al. | 2017-05-11 |
Semiconductor Device and Method of Forming Semiconductor Die with Active Region Responsive to External Stimulus
App 20170110599 - Han; Byung Joon ; et al. | 2017-04-20 |
Semiconductor device and method of using a standardized carrier in semiconductor packaging
Grant 9,620,413 - Strothmann , et al. April 11, 2 | 2017-04-11 |
Semiconductor Device and Method of Using Substrate Having Base and Conductive Posts to Form Vertical Interconnect Structure in Embedded Die Package
App 20170098610 - Shim; Il Kwon ; et al. | 2017-04-06 |
Semiconductor Device and Method of Singulating Thin Semiconductor Wafer on Carrier Along Modified Region Within Non-Active Region Formed by Irradiating Energy
App 20170092529 - Han; Byung Joon ; et al. | 2017-03-30 |
Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus
Grant 9,564,413 - Han , et al. February 7, 2 | 2017-02-07 |
Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy
Grant 9,559,004 - Han , et al. January 31, 2 | 2017-01-31 |
Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
Grant 9,559,029 - Shim , et al. January 31, 2 | 2017-01-31 |
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
Grant 9,559,039 - Shim , et al. January 31, 2 | 2017-01-31 |
Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus
Grant 9,553,162 - Strothmann , et al. January 24, 2 | 2017-01-24 |
Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant
Grant 9,515,016 - Huang , et al. December 6, 2 | 2016-12-06 |
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern
App 20160351419 - Lin; Yaojian ; et al. | 2016-12-01 |
Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
Grant 9,508,621 - Lin , et al. November 29, 2 | 2016-11-29 |
Integrated Circuit Packaging System With Shielding And Method Of Manufacture Thereof
App 20160300799 - Han; Byung Joon ; et al. | 2016-10-13 |
Double-Sided Semiconductor Package and Dual-Mold Method of Making Same
App 20160300797 - Shim; Il Kwon ; et al. | 2016-10-13 |
Semiconductor Device and Method of Forming MEMS Package
App 20160214857 - Lin; Yaojian ; et al. | 2016-07-28 |
Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages
Grant 9,331,007 - Yoon , et al. May 3, 2 | 2016-05-03 |
Integrated Circuit Packaging System With Under Bump Metallization And Method Of Manufacture Thereof
App 20160099222 - Shim; Il Kwon ; et al. | 2016-04-07 |
Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package
Grant 9,305,854 - Shim , et al. April 5, 2 | 2016-04-05 |
Integrated circuit packaging system with patterned substrate and method of manufacture thereof
Grant 9,299,648 - Shim , et al. March 29, 2 | 2016-03-29 |
Semiconductor Device and Method of Forming Double-Sided Fan-Out Wafer Level Package
App 20160043047 - Shim; Il Kwon ; et al. | 2016-02-11 |
Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
Grant 9,252,066 - Shim , et al. February 2, 2 | 2016-02-02 |
Semiconductor Device and Method of Forming Electromagnetic (EM) Shielding for LC Circuits
App 20150348936 - Lin; Yaojian ; et al. | 2015-12-03 |
Integrated circuit packaging system with under bump metallization and method of manufacture thereof
Grant 9,202,793 - Shim , et al. December 1, 2 | 2015-12-01 |
Semiconductor device and method of forming thermal lid for balancing warpage and thermal management
Grant 9,202,769 - Lin , et al. December 1, 2 | 2015-12-01 |
Integrated circuit package system with locking terminal
Grant 9,177,898 - Shim , et al. November 3, 2 | 2015-11-03 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief
App 20150228552 - Lin; Yaojian ; et al. | 2015-08-13 |
Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant
Grant 9,099,455 - Chow , et al. August 4, 2 | 2015-08-04 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 9,087,930 - Lin , et al. July 21, 2 | 2015-07-21 |
Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure
App 20150179587 - Shim; Il Kwon ; et al. | 2015-06-25 |
Semiconductor Device and Method of Forming Fine Pitch RDL Over Semiconductor Die in Fan-Out Package
App 20150179570 - Marimuthu; Pandi C. ; et al. | 2015-06-25 |
Embedded semiconductor die package and method of making the same using metal frame carrier
Grant 9,059,186 - Shim , et al. June 16, 2 | 2015-06-16 |
Integrated circuit packaging system with substrate and method of manufacture thereof
Grant 9,059,157 - Lin , et al. June 16, 2 | 2015-06-16 |
Integrated circuit package with open substrate and method of manufacturing thereof
Grant 9,034,693 - Shim , et al. May 19, 2 | 2015-05-19 |
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern
App 20150115465 - Lin; Yaojian ; et al. | 2015-04-30 |
Semiconductor device and method of forming stress relief layer between die and interconnect structure
Grant 9,006,888 - Shim , et al. April 14, 2 | 2015-04-14 |
Integrated circuit package system with bonding in via
Grant 9,000,579 - Shim , et al. April 7, 2 | 2015-04-07 |
Integrated circuit package with molded cavity
Grant 8,999,754 - Chow , et al. April 7, 2 | 2015-04-07 |
Semiconductor device and method of bonding different size semiconductor die at the wafer level
Grant 8,993,377 - Koo , et al. March 31, 2 | 2015-03-31 |
Integrated circuit package system with relief
Grant 8,981,548 - Shim , et al. March 17, 2 | 2015-03-17 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
App 20150061124 - Shim; Il Kwon ; et al. | 2015-03-05 |
Integrated circuit packaging system with embedded circuitry and post
Grant 8,957,530 - Shim , et al. February 17, 2 | 2015-02-17 |
Methods of forming solder balls in semiconductor packages
Grant 8,951,834 - Kim , et al. February 10, 2 | 2015-02-10 |
Semiconductor Device and Method of Forming Thermal Lid for Balancing Warpage and Thermal Management
App 20150021754 - Lin; Yaojian ; et al. | 2015-01-22 |
Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
Grant 8,912,648 - Lin , et al. December 16, 2 | 2014-12-16 |
Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
Grant 8,846,454 - Shim , et al. September 30, 2 | 2014-09-30 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief
App 20140246779 - Lin; Yaojian ; et al. | 2014-09-04 |
Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
App 20140183761 - Lin; Yaojian ; et al. | 2014-07-03 |
Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages
App 20140183718 - Han; Byung Joon ; et al. | 2014-07-03 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 8,759,155 - Lin , et al. June 24, 2 | 2014-06-24 |
Semiconductor Device and Method of Forming Low Profile Fan-Out Package with Vertical Interconnection Units
App 20140159251 - Marimuthu; Pandi C. ; et al. | 2014-06-12 |
Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier
App 20140127858 - Shim; Il Kwon ; et al. | 2014-05-08 |
Electronic system with expansion feature
Grant 8,703,541 - Choi , et al. April 22, 2 | 2014-04-22 |
Semiconductor Device and Method of Forming Conductive Ink Layer as Interconnect Structure Between Semiconductor Packages
App 20140103509 - Yoon; Insang ; et al. | 2014-04-17 |
Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging
App 20140091455 - Strothmann; Thomas J. ; et al. | 2014-04-03 |
Integrated circuit package system with interposer
Grant 8,685,792 - Chow , et al. April 1, 2 | 2014-04-01 |
Semiconductor Device and Method of Using Substrate Having Base and Conductive Posts to Form Vertical Interconnect Structure in Embedded Die Package
App 20140077389 - Shim; Il Kwon ; et al. | 2014-03-20 |
Semiconductor Device and Method of Forming RDL Using UV-Cured Conductive Ink Over Wafer Level Package
App 20140054802 - Shim; Il Kwon ; et al. | 2014-02-27 |
Embedded semiconductor die package and method of making the same using metal frame carrier
Grant 8,659,113 - Shim , et al. February 25, 2 | 2014-02-25 |
Semiconductor Device and Method of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units
App 20140048906 - Shim; Il Kwon ; et al. | 2014-02-20 |
Integrated circuit package-on-package stacking system and method of manufacture thereof
Grant 8,643,163 - Shim , et al. February 4, 2 | 2014-02-04 |
Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof
Grant 8,604,602 - Chow , et al. December 10, 2 | 2013-12-10 |
Integrated Circuit Packaging System With Substrate And Method Of Manufacture Thereof
App 20130320525 - Lin; Yaojian ; et al. | 2013-12-05 |
Integrated circuit protruding pad package system and method for manufacturing thereof
Grant 8,587,098 - Chow , et al. November 19, 2 | 2013-11-19 |
Leadframe-based mold array package heat spreader and fabrication method therefor
Grant 8,581,375 - Ramakrishna , et al. November 12, 2 | 2013-11-12 |
Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation
Grant 8,569,872 - Bathan , et al. October 29, 2 | 2013-10-29 |
Dual molded multi-chip package system
Grant 8,558,399 - Ramakrishna , et al. October 15, 2 | 2013-10-15 |
Integrated circuit package system with multi-surface die attach pad
Grant 8,536,689 - Dimaano, Jr. , et al. September 17, 2 | 2013-09-17 |
Semiconductor Device and Method of Forming Semiconductor Die with Active Region Responsive to External Stimulus
App 20130221452 - Strothmann; Thomas J. ; et al. | 2013-08-29 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
App 20130175696 - Lin; Yaojian ; et al. | 2013-07-11 |
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
Grant 8,456,002 - Lin , et al. June 4, 2 | 2013-06-04 |
Semiconductor Device And Method Of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
App 20130113092 - Lin; Yaojian ; et al. | 2013-05-09 |
Integrated circuit package system with warp-free chip
Grant 8,421,197 - Do , et al. April 16, 2 | 2013-04-16 |
Integrated circuit packaging system with flex tape and method of manufacture thereof
Grant 8,421,202 - Shim , et al. April 16, 2 | 2013-04-16 |
Integrated circuit package system for package stacking and method of manufacture therefor
Grant 8,409,920 - Pendse , et al. April 2, 2 | 2013-04-02 |
Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant
App 20130075902 - Chow; Seng Guan ; et al. | 2013-03-28 |
Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant
App 20130075899 - Huang; Rui ; et al. | 2013-03-28 |
Semiconductor Device and Method of Forming Semiconductor Die with Active Region Responsive to External Stimulus
App 20130069252 - Han; Byung Joon ; et al. | 2013-03-21 |
Non-leaded integrated circuit package system
Grant 8,399,968 - Punzalan , et al. March 19, 2 | 2013-03-19 |
Integrated circuit package to package stacking system
Grant 8,395,251 - Shim , et al. March 12, 2 | 2013-03-12 |
Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant
Grant 8,354,304 - Chow , et al. January 15, 2 | 2013-01-15 |
Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant
Grant 8,354,746 - Huang , et al. January 15, 2 | 2013-01-15 |
Semiconductor Device and Method of Singulating Thin Semiconductor Wafer on Carrier Along Modified Region Within Non-Active Region Formed by Irradiating Energy
App 20120286429 - Han; Byung Joon ; et al. | 2012-11-15 |
Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof
Grant 8,309,397 - Shim , et al. November 13, 2 | 2012-11-13 |
Leadframe-based Mold Array Package Heat Spreader And Fabrication Method Therefor
App 20120241929 - Ramakrishna; Kambhampati ; et al. | 2012-09-27 |
Semiconductor device and method of forming an interposer package with through silicon vias
Grant 8,263,439 - Marimuthu , et al. September 11, 2 | 2012-09-11 |
Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure
App 20120223426 - Shim; Il Kwon ; et al. | 2012-09-06 |
Integrated Circuit Package With Molded Cavity
App 20120217659 - Chow; Seng Guan ; et al. | 2012-08-30 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
App 20120217647 - Shim; Il Kwon ; et al. | 2012-08-30 |
Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
App 20120217634 - Shim; Il Kwon ; et al. | 2012-08-30 |
Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier
App 20120199971 - Shim; Il Kwon ; et al. | 2012-08-09 |
Dual Molded Multi-chip Package System
App 20120193805 - Ramakrishna; Kambhampati ; et al. | 2012-08-02 |
Electronic System With Expansion Feature
App 20120193132 - Choi; Haengcheol ; et al. | 2012-08-02 |
Embedded semiconductor die package and method of making the same using metal frame carrier
Grant 8,222,717 - Shim , et al. July 17, 2 | 2012-07-17 |
Leadframe-based mold array package heat spreader and fabrication method therefor
Grant 8,211,753 - Ramakrishna , et al. July 3, 2 | 2012-07-03 |
Semiconductor package heat spreader
Grant 8,207,598 - Ararao , et al. June 26, 2 | 2012-06-26 |
Integrated circuit package system with flashless leads
Grant 8,207,597 - Punzalan , et al. June 26, 2 | 2012-06-26 |
Integrated circuit package with molded cavity
Grant 8,198,735 - Chow , et al. June 12, 2 | 2012-06-12 |
Electronic system with expansion feature
Grant 8,178,392 - Choi , et al. May 15, 2 | 2012-05-15 |
Dual molded multi-chip package system
Grant 8,178,982 - Ramakrishna , et al. May 15, 2 | 2012-05-15 |
Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
App 20120112340 - Lin; Yaojian ; et al. | 2012-05-10 |
Bridge stack integrated circuit package-on-package system
Grant 8,163,600 - Chow , et al. April 24, 2 | 2012-04-24 |
Semiconductor Device and Method of Bonding Different Size Semiconductor Die at the Wafer Level
App 20120074587 - Koo; Jun Mo ; et al. | 2012-03-29 |
Integrated circuit packaging system substrates and method of manufacture thereof
Grant 8,143,107 - Do , et al. March 27, 2 | 2012-03-27 |
Semiconductor packaging system with stacking and method of manufacturing thereof
Grant 8,106,496 - Ramakrishna , et al. January 31, 2 | 2012-01-31 |
Integrated Circuit Package With Open Substrate And Method Of Manufacturing Thereof
App 20120018886 - Shim; Il Kwon ; et al. | 2012-01-26 |
Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure
App 20120018882 - Shim; Il Kwon ; et al. | 2012-01-26 |
Integrated circuit package system with die and package combination
Grant 8,102,040 - Chow , et al. January 24, 2 | 2012-01-24 |
Encapsulant Cavity Integrated Circuit Package System And Method Of Fabrication Thereof
App 20120007217 - Shim; Il Kwon ; et al. | 2012-01-12 |
Semiconductor Device and Method of Forming Compliant Stress Relief Buffer Around Large Array WLCSP
App 20120001325 - Lin; Yaojian ; et al. | 2012-01-05 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
App 20110316171 - Shim; Il Kwon ; et al. | 2011-12-29 |
Integrated Circuit Package System For Package Stacking And Method Of Manufacture Thereof
App 20110306168 - Pendse; Rajendra D. ; et al. | 2011-12-15 |
Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die
Grant 8,072,059 - Shim , et al. December 6, 2 | 2011-12-06 |
Integrated circuit package system with flexible substrate and recessed package
Grant 8,050,047 - Chow , et al. November 1, 2 | 2011-11-01 |
Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant
App 20110254157 - Huang; Rui ; et al. | 2011-10-20 |
Method of forming stress relief layer between die and interconnect structure
Grant 8,039,303 - Shim , et al. October 18, 2 | 2011-10-18 |
Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
Grant 8,034,661 - Lin , et al. October 11, 2 | 2011-10-11 |
Integrated circuit package system with flexible substrate and mounded package
Grant 8,031,475 - Chow , et al. October 4, 2 | 2011-10-04 |
Integrated circuit package with open substrate
Grant 8,030,783 - Shim , et al. October 4, 2 | 2011-10-04 |
Integrated Circuit Protruding Pad Package System And Method For Manufacturing Thereof
App 20110233744 - Chow; Seng Guan ; et al. | 2011-09-29 |
Encapsulant cavity integrated circuit package system and method of fabrication thereof
Grant 8,021,924 - Shim , et al. September 20, 2 | 2011-09-20 |
Wafer level chip scale package system
Grant 8,012,867 - Lee , et al. September 6, 2 | 2011-09-06 |
Integrated Circuit Packaging System Including Non-leaded Package
App 20110204501 - Punzalan; Jeffrey D. ; et al. | 2011-08-25 |
Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant
Grant 7,993,941 - Huang , et al. August 9, 2 | 2011-08-09 |
Integrated circuit protruding pad package system
Grant 7,968,377 - Chow , et al. June 28, 2 | 2011-06-28 |
Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
App 20110147926 - Shim; Il Kwon ; et al. | 2011-06-23 |
Semiconductor package with passive device integration
Grant 7,960,816 - Chow , et al. June 14, 2 | 2011-06-14 |
Integrated Circuit Packaging System With Embedded Circuitry And Post
App 20110127678 - Shim; Il Kwon ; et al. | 2011-06-02 |
Integrated Circuit Package System With Warp-free Chip
App 20110121466 - Do; Byung Tai ; et al. | 2011-05-26 |
Semiconductor Device and Method of Forming Compliant Stress Relief Buffer Around Large Array WLCSP
App 20110121449 - Lin; Yaojian ; et al. | 2011-05-26 |
Integrated circuit packaging system including a non-leaded package
Grant 7,947,534 - Punzalan , et al. May 24, 2 | 2011-05-24 |
Integrated circuit package system with lead structures including a dummy tie bar
Grant 7,936,053 - Punzalan , et al. May 3, 2 | 2011-05-03 |
Integrated circuit package system
Grant 7,928,540 - Shim , et al. April 19, 2 | 2011-04-19 |
Multichip module package and fabrication method
Grant 7,928,564 - Shim , et al. April 19, 2 | 2011-04-19 |
Semiconductor device and method of forming the device using sacrificial carrier
Grant 7,923,295 - Shim , et al. April 12, 2 | 2011-04-12 |
Integrated circuit package system with interconnection support and method of manufacture thereof
Grant 7,901,996 - Bathan , et al. March 8, 2 | 2011-03-08 |
Method of manufacturing integrated circuit package system with warp-free chip
Grant 7,892,894 - Do , et al. February 22, 2 | 2011-02-22 |
Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier
App 20110037154 - Shim; Il Kwon ; et al. | 2011-02-17 |
Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof
Grant 7,888,184 - Shim , et al. February 15, 2 | 2011-02-15 |
Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias
App 20110024916 - Marimuthu; Pandi Chelvam ; et al. | 2011-02-03 |
Encapsulant Cavity Integrated Circuit Package System And Method Of Fabrication Thereof
App 20110018084 - Shim; Il Kwon ; et al. | 2011-01-27 |
Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof
Grant 7,863,108 - Dimaano, Jr. , et al. January 4, 2 | 2011-01-04 |
Array-molded package heat spreader and fabrication method therefor
Grant 7,863,730 - Shim , et al. January 4, 2 | 2011-01-04 |
Integrated circuit package system with an encapsulant cavity and method of fabrication thereof
Grant 7,855,100 - Shim , et al. December 21, 2 | 2010-12-21 |
Embedded semiconductor die package and method of making the same using metal frame carrier
Grant 7,842,542 - Shim , et al. November 30, 2 | 2010-11-30 |
Semiconductor device and method of forming an interposer package with through silicon vias
Grant 7,838,337 - Marimuthu , et al. November 23, 2 | 2010-11-23 |
Integrated Circuit Packaging System With Coin Bonded Interconnects And Method Of Manufacture Thereof
App 20100289142 - Shim; Il Kwon ; et al. | 2010-11-18 |
Integrated Circuit Packaging System With Reinforced Encapsulant Having Embedded Interconnect And Method Of Manufacture Thereof
App 20100289134 - Chow; Seng Guan ; et al. | 2010-11-18 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
App 20100258937 - Shim; Il Kwon ; et al. | 2010-10-14 |
Integrated Circuit Packaging System With Patterned Substrate And Method Of Manufacture Thereof
App 20100224974 - Shim; Il Kwon ; et al. | 2010-09-09 |
Integrated Circuit Packaging System With Flex Tape And Method Of Manufacture Thereof
App 20100224978 - Shim; Il Kwon ; et al. | 2010-09-09 |
Integrated circuit die with pedestal
Grant 7,786,593 - Ararao , et al. August 31, 2 | 2010-08-31 |
Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
Grant 7,767,496 - Shim , et al. August 3, 2 | 2010-08-03 |
Offset integrated circuit package-on-package stacking system
Grant 7,746,656 - Shim , et al. June 29, 2 | 2010-06-29 |
Integrated Circuit Packaging System For Fine Pitch Substrates And Method Of Manufacture Thereof
App 20100155926 - Do; Byung Tai ; et al. | 2010-06-24 |
Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant
App 20100140771 - Huang; Rui ; et al. | 2010-06-10 |
Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant
App 20100144101 - Chow; Seng Guan ; et al. | 2010-06-10 |
Integrated circuit package system with edge connection system
Grant 7,732,907 - Han , et al. June 8, 2 | 2010-06-08 |
Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias
App 20100133704 - Marimuthu; Pandi Chelvam ; et al. | 2010-06-03 |
Integrated circuit packaging system for fine pitch substrates
Grant 7,701,049 - Do , et al. April 20, 2 | 2010-04-20 |
Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
App 20100052135 - Shim; Il Kwon ; et al. | 2010-03-04 |
Integrated Circuit Package System For Package Stacking And Manufacturing Method Thereof
App 20100038768 - Kim; Young Cheol ; et al. | 2010-02-18 |
Integrated Circuit Package With Open Substrate
App 20100038771 - Shim; Il Kwon ; et al. | 2010-02-18 |
Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier
App 20100006994 - Shim; Il Kwon ; et al. | 2010-01-14 |
Integrated Circuit Package System With Lead-frame Paddle Scheme For Single Axis Partial Saw Isolation
App 20100001384 - Bathan; Henry Descalzo ; et al. | 2010-01-07 |
Integrated Circuit Package System With Locking Terminal
App 20090321913 - Shim; Il Kwon ; et al. | 2009-12-31 |
Integrated Circuit Packaging System With Embedded Circuitry And Post, And Method Of Manufacture Thereof
App 20090315170 - Shim; Il Kwon ; et al. | 2009-12-24 |
Semiconductor Package System With Substrate Having Different Bondable Heights At Lead Finger Tips
App 20090309237 - Chow; Seng Guan ; et al. | 2009-12-17 |
Semiconductor Device and Method of Forming Stress Relief Layer Between Die and Interconnect Structure
App 20090309212 - Shim; Il Kwon ; et al. | 2009-12-17 |
Integrated Circuit Package System With Die And Package Combination
App 20090309207 - Chow; Seng Guan ; et al. | 2009-12-17 |
Integrated circuit package with open substrate
Grant 7,626,277 - Shim , et al. December 1, 2 | 2009-12-01 |
Integrated circuit package system including high-density small footprint system-in-package
Grant 7,622,325 - Shim , et al. November 24, 2 | 2009-11-24 |
Stacked semiconductor packages and method therefor
Grant 7,622,800 - Ramakrishna , et al. November 24, 2 | 2009-11-24 |
Integrated circuit package system for package stacking and manufacturing method thereof
Grant 7,622,333 - Kim , et al. November 24, 2 | 2009-11-24 |
Semiconductor Package Heat Spreader
App 20090273062 - Ararao; Virgil Cotoco ; et al. | 2009-11-05 |
Integrated Circuit Package System With Interconnect Support
App 20090250798 - Bathan; Henry D. ; et al. | 2009-10-08 |
Integrated circuit package system with die and package combination
Grant 7,598,606 - Chow , et al. October 6, 2 | 2009-10-06 |
Semiconductor package system with substrate having different bondable heights at lead finger tips
Grant 7,598,599 - Chow , et al. October 6, 2 | 2009-10-06 |
Semiconductor Device and Method of Forming UBM Fixed Relative to Interconnect Structure for Alignment of Semiconductor Die
App 20090236686 - Shim; Il Kwon ; et al. | 2009-09-24 |
Integrated Circuit Packaging System With Etched Ring And Die Paddle And Method Of Manufacture Thereof
App 20090230529 - Dimaano, JR.; Antonio B. ; et al. | 2009-09-17 |
Fabrication method for semiconductor package heat spreaders
Grant 7,575,956 - Ararao , et al. August 18, 2 | 2009-08-18 |
Integrated circuit package system with interconnect support
Grant 7,563,647 - Bathan , et al. July 21, 2 | 2009-07-21 |
Method of fabricating an integrated circuit with etched ring and die paddle
Grant 7,556,987 - Dimaano, Jr. , et al. July 7, 2 | 2009-07-07 |
Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
App 20090170241 - Shim; Il Kwon ; et al. | 2009-07-02 |
Multi-leadframe semiconductor package and method of manufacture
Grant 7,554,179 - Shim , et al. June 30, 2 | 2009-06-30 |
Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-applied Protective Layer
App 20090152715 - Shim; Il Kwon ; et al. | 2009-06-18 |
Integrated Circuit Package-on-package Stacking System And Method Of Manufacture Thereof
App 20090146315 - Shim; Il Kwon ; et al. | 2009-06-11 |
Offset integrated circuit package-on-package stacking system
Grant 7,518,224 - Shim , et al. April 14, 2 | 2009-04-14 |
Integrated Circuit Package System With Warp-free Chip
App 20090079049 - Do; Byung Tai ; et al. | 2009-03-26 |
Integrated circuit leadless package system
Grant 7,498,665 - Alabin , et al. March 3, 2 | 2009-03-03 |
Integrated Circuit Packaging System For Fine Pitch Substrates
App 20090032932 - Do; Byung Tai ; et al. | 2009-02-05 |
Integrated circuit package system with heat sink
Grant 7,479,692 - Dimaano, Jr. , et al. January 20, 2 | 2009-01-20 |
Integrated Circuit Package System With Flexible Substrate And Recessed Package
App 20090016032 - Chow; Seng Guan ; et al. | 2009-01-15 |
Multichip Module Package And Fabrication Method
App 20090014866 - Shim; Il Kwon ; et al. | 2009-01-15 |
Integrated Circuit Package System With Flexible Substrate And Mounded Package
App 20090016033 - Chow; Seng Guan ; et al. | 2009-01-15 |
Semiconductor Packages
App 20080296759 - Ramakrishna; Kambhampati ; et al. | 2008-12-04 |
Integrated Circuit Package System With Relief
App 20080290485 - Shim; Il Kwon ; et al. | 2008-11-27 |
Electronic System With Expansion Feature
App 20080283998 - Choi; Haengcheol ; et al. | 2008-11-20 |
System For Implementing Hard-metal Wire Bonds
App 20080272487 - Shim; Il Kwon ; et al. | 2008-11-06 |
Multichip module package and fabrication method
Grant 7,445,955 - Shim , et al. November 4, 2 | 2008-11-04 |
Semiconductor package with heat sink
Grant 7,446,408 - Shim , et al. November 4, 2 | 2008-11-04 |
Integrated Circuit Package System For Package Stacking
App 20080258289 - Pendse; Rajendra D. ; et al. | 2008-10-23 |
Method of fabricating a 3-D package stacking system
Grant 7,435,619 - Shim , et al. October 14, 2 | 2008-10-14 |
Integrated Circuit Package System With Bonding In Via
App 20080237873 - Shim; Il Kwon ; et al. | 2008-10-02 |
Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides
Grant 7,429,787 - Karnezos , et al. September 30, 2 | 2008-09-30 |
Integrated Circuit Package System With Interposer
App 20080211084 - Chow; Seng Guan ; et al. | 2008-09-04 |
Integrated circuit package system with integrated circuit support
Grant 7,420,265 - Bathan , et al. September 2, 2 | 2008-09-02 |
Etched leadframe flipchip package system
Grant 7,414,318 - Shim , et al. August 19, 2 | 2008-08-19 |
Encapsulant Cavity Integrated Circuit Package System
App 20080179729 - Shim; Il Kwon ; et al. | 2008-07-31 |
Integrated circuit package system with heat sink
Grant 7,400,049 - Shim , et al. July 15, 2 | 2008-07-15 |
Pre-molded leadframe and method therefor
Grant 7,399,658 - Shim , et al. July 15, 2 | 2008-07-15 |
Dual Molded Multi-chip Package System
App 20080157402 - Ramakrishna; Kambhampati ; et al. | 2008-07-03 |
Bridge Stack Integrated Circuit Package-on-package System
App 20080157318 - Chow; Seng Guan ; et al. | 2008-07-03 |
Integrated Circuit Package With Molded Cavity
App 20080157325 - Chow; Seng Guan ; et al. | 2008-07-03 |
Package stacking lead frame system
Grant 7,388,280 - Shim , et al. June 17, 2 | 2008-06-17 |
Integrated circuit package system
Grant 7,378,300 - Marimuthu , et al. May 27, 2 | 2008-05-27 |
Integrated Circuit Package System
App 20080111215 - Shim; Il Kwon ; et al. | 2008-05-15 |
Integrated Circuit Package System With Heat Sink
App 20080111217 - Dimaano; Antonio B. ; et al. | 2008-05-15 |
Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides
Grant 7,372,141 - Karnezos , et al. May 13, 2 | 2008-05-13 |
Method of mounting an integrated circuit package in an encapsulant cavity
Grant 7,364,945 - Shim , et al. April 29, 2 | 2008-04-29 |
Semiconductor package with controlled solder bump wetting
Grant 7,352,055 - Shim , et al. April 1, 2 | 2008-04-01 |
Stackable Multi-chip Package System
App 20080029867 - Kim; Young Cheol ; et al. | 2008-02-07 |
Heat spreader for thermally enhanced semiconductor package
Grant 7,327,025 - Shim , et al. February 5, 2 | 2008-02-05 |
Integrated Circuit Package System With Flashless Leads
App 20080012100 - Punzalan; Jeffrey D. ; et al. | 2008-01-17 |
Integrated Circuit Package System
App 20080001263 - Dimaano; Antonio B. ; et al. | 2008-01-03 |
Stacked semiconductor packages
Grant 7,309,913 - Shim , et al. December 18, 2 | 2007-12-18 |
Integrated Circuit Package System With Edge Connection System
App 20070278660 - Han; Byung Joon ; et al. | 2007-12-06 |
Large die package and method for the fabrication thereof
Grant 7,298,026 - Shim , et al. November 20, 2 | 2007-11-20 |
Etched Leadframe Flipchip Package System
App 20070241432 - Shim; Il Kwon ; et al. | 2007-10-18 |
Stacked Semiconductor Packages And Method Therefor
App 20070228545 - Ramakrishna; Kambhampati ; et al. | 2007-10-04 |
Integrated Circuit Die With Pedestal
App 20070228538 - Ararao; Virgil Cotoco ; et al. | 2007-10-04 |
Integrated circuit package system with adhesive restraint
Grant 7,274,089 - Punzalan , et al. September 25, 2 | 2007-09-25 |
Semiconductor Package System With Substrate Having Different Bondable Heights At Lead Finger Tips
App 20070210422 - Chow; Seng Guan ; et al. | 2007-09-13 |
Integrated circuit package system with exposed interconnects
App 20070190690 - Chow; Seng Guan ; et al. | 2007-08-16 |
3-d Package Stacking System
App 20070187826 - Shim; Il Kwon ; et al. | 2007-08-16 |
Integrated Circuit Package System With Heat Sink
App 20070187839 - Shim; Il Kwon ; et al. | 2007-08-16 |
Integrated Circuit Packaging System Including A Non-leaded Package
App 20070182024 - Punzalan; Jeffrey D. ; et al. | 2007-08-09 |
Wafer Level Chip Scale Package System
App 20070178667 - Lee; Koo Hong ; et al. | 2007-08-02 |
Etched leadframe flipchip package system
Grant 7,250,685 - Shim , et al. July 31, 2 | 2007-07-31 |
Stacked semiconductor packages and method therefor
Grant 7,242,091 - Ramakrishna , et al. July 10, 2 | 2007-07-10 |
Integrated circuit die with pedestal
Grant 7,242,101 - Ararao , et al. July 10, 2 | 2007-07-10 |
Non-leaded Integrated Circuit Package System
App 20070114650 - Punzalan; Jeffrey D. ; et al. | 2007-05-24 |
Integrated Circuit Package System Configured For Singulation
App 20070114645 - Punzalan; Jeffrey D. ; et al. | 2007-05-24 |
Offset Integrated Circuit Package-on-package Stacking System
App 20070108581 - Shim; Il Kwon ; et al. | 2007-05-17 |
Integrated Circuit Leadless Package System
App 20070108567 - Alabin; Leocadio M. ; et al. | 2007-05-17 |
Integrated Circuit Package System With Interconnect Support
App 20070108569 - Bathan; Henry D. ; et al. | 2007-05-17 |
Integrated Circuit Package System With Integrated Circuit Support
App 20070108559 - Bathan; Henry D. ; et al. | 2007-05-17 |
Integrated Circuit Package To Package Stacking System
App 20070108568 - Shim; Il Kwon ; et al. | 2007-05-17 |
Etched Leadframe Flipchip Package System
App 20070108565 - Shim; Il Kwon ; et al. | 2007-05-17 |
Integrated Circuit Package-on-package Stacking System
App 20070108583 - Shim; Il Kwon ; et al. | 2007-05-17 |
Pre-molded Leadframe And Method Therefor
App 20070111379 - Shim; Il Kwon ; et al. | 2007-05-17 |
Integrated Circuit Package System Including High-density Small Footprint System-in-package
App 20070096282 - Shim; IL Kwon ; et al. | 2007-05-03 |
Thin semiconductor package including stacked dies
Grant 7,211,900 - Shin , et al. May 1, 2 | 2007-05-01 |
Pre-molded Leadframe And Method Therefor
App 20070093000 - Shim; Il Kwon ; et al. | 2007-04-26 |
Semiconductor Package With Controlled Solder Bump Wetting
App 20070090537 - Shim; Il Kwon ; et al. | 2007-04-26 |
Integrated circuit package system
App 20070080437 - Marimuthu; Pandi Chelvam ; et al. | 2007-04-12 |
Integrated Circuit Package System With Multi-surface Die Attach Pad
App 20070075404 - Dimaano; Antonio B. JR. ; et al. | 2007-04-05 |
Integrated Circuit Protruding Pad Package System
App 20070063322 - Chow; Seng Guan ; et al. | 2007-03-22 |
Integrated Circuit Package System With Adhesive Restraint
App 20070063320 - Punzalan; Jeffrey D. ; et al. | 2007-03-22 |
Semiconductor package with selective underfill and fabrication method therfor
Grant 7,169,641 - Shim , et al. January 30, 2 | 2007-01-30 |
Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor
Grant 7,153,725 - Wang , et al. December 26, 2 | 2006-12-26 |
Semiconductor package with controlled solder bump wetting and fabrication method therefor
Grant 7,148,086 - Shim , et al. December 12, 2 | 2006-12-12 |
Offset Integrated Circuit Package-on-package Stacking System
App 20060256525 - Shim; Il Kwon ; et al. | 2006-11-16 |
Semiconductor package with selective underfill and fabrication method therfor
App 20060252177 - Shim; Il Kwon ; et al. | 2006-11-09 |
Large die package and method for the fabrication thereof
App 20060249830 - Shim; Il Kwon ; et al. | 2006-11-09 |
Semiconductor Package With Controlled Solder Bump Wetting And Fabrication Method Therefor
App 20060246629 - Shim; IL Kwon ; et al. | 2006-11-02 |
Encapsulant Cavity Integrated Circuit Package System
App 20060220256 - Shim; Il Kwon ; et al. | 2006-10-05 |
Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides
App 20060220209 - Karnezos; Marcos ; et al. | 2006-10-05 |
Semiconductor assembly including chip scale package and second substrate and having exposed substrate surfaces on upper and lower sides
App 20060220210 - Karnezos; Marcos ; et al. | 2006-10-05 |
Integrated Circuit Package System With Die And Package Combination
App 20060197207 - Chow; Seng Guan ; et al. | 2006-09-07 |
Semiconductor Package With Passive Device Integration
App 20060197198 - Chow; Seng Guan ; et al. | 2006-09-07 |
Stacked Semiconductor Packages And Method Therefor
App 20060197205 - Ramakrishna; Kambhampati ; et al. | 2006-09-07 |
Package Stacking Lead Frame System
App 20060186514 - Shim; IL Kwon ; et al. | 2006-08-24 |
Multi-leadframe semiconductor package and method of manufacture
App 20060175689 - Shim; Il Kwon ; et al. | 2006-08-10 |
Stacked die packaging and fabrication method
Grant 7,064,430 - Chow , et al. June 20, 2 | 2006-06-20 |
Chip Scale Package With Open Substrate
App 20060055009 - Shim; Il Kwon ; et al. | 2006-03-16 |
Chip scale package with open substrate
Grant 7,008,820 - Shim , et al. March 7, 2 | 2006-03-07 |
Stacked die packaging and fabrication method
App 20060043559 - Chow; Seng Guan ; et al. | 2006-03-02 |
Multichip Module Package And Fabrication Method
App 20060043560 - SHIM; IL Kwon ; et al. | 2006-03-02 |
Integrated circuit die with pedestal
App 20060012022 - Ararao; Virgil Cotoco ; et al. | 2006-01-19 |
Chip Scale Package With Open Substrate
App 20050277227 - Shim, Il Kwon ; et al. | 2005-12-15 |
Heat spreader for thermally enhanced semiconductor package
App 20050242428 - Shim, Il Kwon ; et al. | 2005-11-03 |
Semiconductor package and method for fabricating the same
App 20050205979 - Shin, Won Sun ; et al. | 2005-09-22 |
Integrated circuit package with keep-out zone overlapping undercut zone
App 20050194698 - Shim, Il Kwon ; et al. | 2005-09-08 |
Semiconductor package with passive device integration
App 20050173783 - Chow, Seng Guan ; et al. | 2005-08-11 |
Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor
App 20050161780 - Wang, Tie ; et al. | 2005-07-28 |
Semiconductor package heat spreaders and fabrication methods therefor
App 20050112796 - Ararao, Virgil Cotoco ; et al. | 2005-05-26 |
Stacked semiconductor packages
App 20050090050 - Shim, Il Kwon ; et al. | 2005-04-28 |
Integrated circuit package
App 20050051907 - Li, Jian Jun ; et al. | 2005-03-10 |
Leadframe-based mold array package heat spreader and fabrication method therefor
App 20050046012 - Ramakrishna, Kambhampati ; et al. | 2005-03-03 |
Array-molded package heat spreader and fabrication method therefor
App 20050046015 - Shim, Il Kwon ; et al. | 2005-03-03 |
Semiconductor device package
App 20050006668 - Ararao, Virgil C. ; et al. | 2005-01-13 |
Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same
App 20040180525 - Shim, Il Kwon ; et al. | 2004-09-16 |
Heat spreader interconnect for thermally enhanced PBGA packages
App 20040155338 - Shim, Il Kwon ; et al. | 2004-08-12 |
| 