| Patent | Date |
|---|
Conductive Feature With Non-uniform Critical Dimension And Method Of Manufacturing The Same
App 20220310487 - SHIH; SHING-YIH ; et al. | 2022-09-29 |
Semiconductor Device With Redistribution Structure And Method For Fabricating The Same
App 20220310545 - SHIH; SHING-YIH | 2022-09-29 |
Semiconductor structure
Grant 11,450,556 - Shih , et al. September 20, 2 | 2022-09-20 |
Method For Fabricating Semiconductor Device With Protection Layers
App 20220285240 - HUANG; TSE-YAO ; et al. | 2022-09-08 |
Method For Fabricating Semiconductor Device With Heat Dissipation Features
App 20220278078 - SHIH; SHING-YIH | 2022-09-01 |
Semiconductor Device With Heat Dissipation Unit And Method For Fabricating The Same
App 20220238487 - SHIH; SHING-YIH | 2022-07-28 |
Method For Fabricating Semiconductor Device With Etch Stop Layer Having Greater Thickness
App 20220199494 - SHIH; SHING-YIH | 2022-06-23 |
Semiconductor device structure with bottle-shaped through silicon via and method for forming the same
Grant 11,355,464 - Shih , et al. June 7, 2 | 2022-06-07 |
Semiconductor device
Grant 11,342,333 - Shih , et al. May 24, 2 | 2022-05-24 |
Manufacturing Method Of Semiconductor Structure
App 20220148915 - Shih; Shing-Yih ; et al. | 2022-05-12 |
Semiconductor Device Structure With Bottle-shaped Through Silicon Via And Method For Forming The Same
App 20220148995 - Shih; Shing-Yih ; et al. | 2022-05-12 |
Semiconductor device with recessed pad layer and method for fabricating the same
Grant 11,329,028 - Shih May 10, 2 | 2022-05-10 |
Semiconductor Device With Etch Stop Layer Having Greater Thickness And Method For Fabricating The Same
App 20220139805 - SHIH; Shing-Yih | 2022-05-05 |
Semiconductor structure including a first substrate and a second substrate and a buffer structure in the second substrate
Grant 11,322,458 - Shih May 3, 2 | 2022-05-03 |
Conductive Feature With Non-uniform Critical Dimension And Method Of Manufacturing The Same
App 20220130736 - SHIH; Shing-Yih ; et al. | 2022-04-28 |
Semiconductor device with decoupling unit and method for fabricating the same
Grant 11,315,869 - Huang , et al. April 26, 2 | 2022-04-26 |
Semiconductor assembly and method of manufacturing the same
Grant 11,315,904 - Shih April 26, 2 | 2022-04-26 |
Semiconductor device
Grant 11,309,312 - Shih April 19, 2 | 2022-04-19 |
Semiconductor device having through silicon vias and method of manufacturing the same
Grant 11,309,254 - Shih April 19, 2 | 2022-04-19 |
Semiconductor device with composite passivation structure and method for preparing the same
Grant 11,302,629 - Shih April 12, 2 | 2022-04-12 |
Semiconductor device with protection layers and method for fabricating the same
Grant 11,302,608 - Huang , et al. April 12, 2 | 2022-04-12 |
Conductive Via Structure
App 20220102165 - SHIH; Shing-Yih | 2022-03-31 |
Method Of Manufacturing A Semiconductor Package Including A First Sub-package Stacked Atop A Second Sub-package
App 20220102328 - SHIH; Shing-Yih | 2022-03-31 |
Method Of Forming Semiconductor Structure
App 20220102290 - SHIH; Shing-Yih | 2022-03-31 |
Liner for through-silicon via
Grant 11,289,370 - Shih , et al. March 29, 2 | 2022-03-29 |
Method Of Forming Semiconductor Structure
App 20220093462 - SHIH; Chiang-Lin ; et al. | 2022-03-24 |
Semiconductor device and method for fabricating the same
Grant 11,282,781 - Huang , et al. March 22, 2 | 2022-03-22 |
Semiconductor Structure And Method Of Forming The Same
App 20220084884 - SHIH; Chiang-Lin ; et al. | 2022-03-17 |
Method For Fabricating Semiconductor Device With Recessed Pad Layer
App 20220084987 - Shih; Shing-Yih | 2022-03-17 |
Method For Manufacturing Semiconductor Structure Having Via Through Bonded Wafers
App 20220077068 - SHIH; SHING-YIH | 2022-03-10 |
Semiconductor Device With Composite Passivation Structure And Method For Preparing The Same
App 20220077056 - SHIH; SHING-YIH | 2022-03-10 |
Semiconductor Device With Protection Layers And Method For Fabricating The Same
App 20220077025 - HUANG; TSE-YAO ; et al. | 2022-03-10 |
Semiconductor Device Having Through Silicon Vias
App 20220077071 - SHIH; SHING-YIH | 2022-03-10 |
Method For Preparing Semiconductor Device Structure With Air Gap
App 20220059398 - SHIH; SHING-YIH | 2022-02-24 |
Semiconductor Device And Method For Fabricating The Same
App 20220059542 - SHIH; SHING-YIH | 2022-02-24 |
Method Of Manufacturing Semiconductor Package
App 20220059497 - SHIH; SHING-YIH | 2022-02-24 |
Semiconductor device structure with air gap for reducing capacitive coupling
Grant 11,251,128 - Shih February 15, 2 | 2022-02-15 |
Method For Preparing Semiconductor Package Structure
App 20220045012 - SHIH; SHING-YIH | 2022-02-10 |
Manufacturing Method Of Semiconductor Package
App 20220045036 - Shih; Shing-Yih | 2022-02-10 |
Semiconductor Device With Connecting Structure And Method For Fabricating The Same
App 20220044996 - SHIH; SHING-YIH | 2022-02-10 |
Semiconductor Structure Having Via Through Bonded Wafers And Manufacturing Method Thereof
App 20220037256 - SHIH; SHING-YIH | 2022-02-03 |
Semiconductor Device With Recessed Pad Layer And Method For Fabricating The Same
App 20220037287 - SHIH; Shing-Yih | 2022-02-03 |
Semiconductor package including a first sub-package stacked atop a second sub-package
Grant 11,239,217 - Shih February 1, 2 | 2022-02-01 |
Semiconductor Structure
App 20220028734 - Shih; Shing-Yih ; et al. | 2022-01-27 |
Semiconductor Device With Protection Layers And Method For Fabricating The Same
App 20220013425 - HUANG; TSE-YAO ; et al. | 2022-01-13 |
Semiconductor device structure with air gap and method for forming the same
Grant 11,222,811 - Shih January 11, 2 | 2022-01-11 |
Semiconductor Structure And Method Of Forming The Same
App 20220005758 - HUANG; Sheng-Fu ; et al. | 2022-01-06 |
Semiconductor structure and method of forming the same
Grant 11,217,525 - Huang , et al. January 4, 2 | 2022-01-04 |
Semiconductor device and method for fabricating the same
Grant 11,211,287 - Huang , et al. December 28, 2 | 2021-12-28 |
Semiconductor Device With Protection Layers And Method For Fabricating The Same
App 20210398879 - HUANG; TSE-YAO ; et al. | 2021-12-23 |
Semiconductor package and manufacturing method thereof
Grant 11,195,823 - Shih December 7, 2 | 2021-12-07 |
Semiconductor structure and fabrication method thereof
Grant 11,189,523 - Shih , et al. November 30, 2 | 2021-11-30 |
Semiconductor structure and manufacturing method thereof
Grant 11,189,563 - Shih November 30, 2 | 2021-11-30 |
Semiconductor Assembly And Method Of Manufacturing The Same
App 20210358889 - SHIH; Shing-Yih | 2021-11-18 |
Semiconductor device with interconnect structure and method for preparing the same
Grant 11,177,194 - Shih November 16, 2 | 2021-11-16 |
Semiconductor Structure And Method Of Forming The Same
App 20210335725 - SHIH; Shing-Yih | 2021-10-28 |
Semiconductor Package And Method Of Manufacturing The Same
App 20210305223 - SHIH; Shing-Yih | 2021-09-30 |
Semiconductor assembly having T-shaped interconnection and method of manufacturing the same
Grant 11,133,251 - Shih September 28, 2 | 2021-09-28 |
Semiconductor Device With Conductive Protrusions And Method For Fabricating The Same
App 20210296174 - SHIH; SHING-YIH | 2021-09-23 |
Semiconductor device with conductive protrusions and method for fabricating the same
Grant 11,127,632 - Shih September 21, 2 | 2021-09-21 |
Semiconductor device with connecting structure having a step-shaped conductive feature and method for fabricating the same
Grant 11,127,628 - Shih September 21, 2 | 2021-09-21 |
Semiconductor Device And Method For Fabricating The Same
App 20210288160 - SHIH; Shing-Yih | 2021-09-16 |
Semiconductor Device With Connecting Structure Having A Step-shaped Conductive Feature And Method For Fabricating The Same
App 20210287937 - SHIH; Shing-Yih | 2021-09-16 |
Semiconductor Assembly Having T-shaped Interconnection And Method Of Manufacturing The Same
App 20210287981 - SHIH; Shing-Yih | 2021-09-16 |
Method for preparing a semiconductor structure
Grant 11,120,996 - Shih September 14, 2 | 2021-09-14 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210272844 - Shih; Shing-Yih ; et al. | 2021-09-02 |
Semiconductor Package And Method Of Manufacturing The Same
App 20210257335 - SHIH; Shing-Yih | 2021-08-19 |
Semiconductor Device With Composite Passivation Structure And Method For Preparing The Same
App 20210257292 - SHIH; Shing-Yih | 2021-08-19 |
Semiconductor Device Having Through Silicon Vias And Method Of Manufacturing The Same
App 20210257304 - SHIH; SHING-YIH | 2021-08-19 |
Semiconductor Device With Connecting Structure And Method For Fabricating The Same
App 20210257290 - SHIH; Shing-Yih | 2021-08-19 |
Semiconductor assembly and method of manufacturing the same
Grant 11,094,662 - Shih August 17, 2 | 2021-08-17 |
Semiconductor Device Structure With Air Gap For Reducing Capacitive Coupling
App 20210249354 - SHIH; SHING-YIH | 2021-08-12 |
Method of manufacturing semiconductor structure
Grant 11,086,222 - Shih , et al. August 10, 2 | 2021-08-10 |
Semiconductor Assembly And Method Of Manufacturing The Same
App 20210242161 - SHIH; SHING-YIH | 2021-08-05 |
Semiconductor structure having buffer under bump pad and manufacturing method thereof
Grant 11,063,012 - Shih July 13, 2 | 2021-07-13 |
Semiconductor device structure with fine patterns forming varied height spacer and method for forming the same
Grant 11,063,006 - Shih July 13, 2 | 2021-07-13 |
Microelectronic Devices And Apparatuses Having A Patterned Surface Structure
App 20210202417 - Shih; Shing-Yih ; et al. | 2021-07-01 |
Semiconductor Device With Interconnect Structure And Method For Preparing The Same
App 20210193559 - Shih; Shing-Yih | 2021-06-24 |
Method of forming three dimensional semiconductor structure
Grant 11,043,469 - Shih June 22, 2 | 2021-06-22 |
Semiconductor Device Structure With Air Gap And Method For Forming The Same
App 20210175116 - SHIH; Shing-Yih | 2021-06-10 |
Apparatuses Including Dummy Dice
App 20210175188 - Shih; Shing-Yih ; et al. | 2021-06-10 |
Semiconductor Device And Method For Fabricating The Same
App 20210175236 - SHIH; SHING-YIH | 2021-06-10 |
Semiconductor structure
Grant 11,031,348 - Shih , et al. June 8, 2 | 2021-06-08 |
Method Of Manufacturing A Semiconductor Structure
App 20210143099 - SHIH; Shing-Yih | 2021-05-13 |
Semiconductor Structure
App 20210125910 - SHIH; Shing-Yih ; et al. | 2021-04-29 |
Semiconductor device and manufacture method thereof
Grant 10,978,338 - Shih April 13, 2 | 2021-04-13 |
Semiconductor Device
App 20210098461 - SHIH; Shing-Yih ; et al. | 2021-04-01 |
Wafer Level Package Utilizing Molded Interposer
App 20210090985 - Shih; Shing-Yih | 2021-03-25 |
Semiconductor structure and manufacturing method thereof
Grant 10,950,538 - Shih March 16, 2 | 2021-03-16 |
Methods of forming microelectronic devices having a patterned surface structure
Grant 10,950,564 - Shih , et al. March 16, 2 | 2021-03-16 |
Methods of forming microelectronic devices including dummy dice
Grant 10,937,749 - Shih , et al. March 2, 2 | 2021-03-02 |
Microelectronic Devices Including Embedded Bridge Interconnect Structures
App 20210050327 - Shih; Shing-Yih | 2021-02-18 |
Semiconductor Device And Manufacturing Method Thereof
App 20210043545 - HUANG; Sheng-Fu ; et al. | 2021-02-11 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210035905 - SHIH; Shing-Yih | 2021-02-04 |
Semiconductor package including hybrid bonding structure and method for preparing the same
Grant 10,910,357 - Shih February 2, 2 | 2021-02-02 |
Semiconductor Device And Method For Fabricating The Same
App 20210028053 - HUANG; TSE-YAO ; et al. | 2021-01-28 |
Semiconductor Device And Method For Fabricating The Same
App 20210028103 - HUANG; TSE-YAO ; et al. | 2021-01-28 |
Semiconductor Structure
App 20210028121 - SHIH; SHING-YIH ; et al. | 2021-01-28 |
Method of forming fine interconnection for a semiconductor device
Grant 10,903,110 - Shih January 26, 2 | 2021-01-26 |
Conductive Via Structure
App 20210020455 - SHIH; Shing-Yih | 2021-01-21 |
Semiconductor Structure
App 20200411367 - SHIH; Shing-Yih ; et al. | 2020-12-31 |
Wafer level package utilizing molded interposer
Grant 10,872,852 - Shih December 22, 2 | 2020-12-22 |
Semiconductor Structure And Fabrication Method Thereof
App 20200395242 - SHIH; Shing-Yih ; et al. | 2020-12-17 |
Microelectronic package utilizing embedded bridge through-silicon-via interconnect component and related methods
Grant 10,833,052 - Shih November 10, 2 | 2020-11-10 |
Semiconductor packages and devices
Grant 10,825,783 - Shih , et al. November 3, 2 | 2020-11-03 |
Semiconductor structure
Grant 10,825,799 - Shih November 3, 2 | 2020-11-03 |
Microelectronic devices including redistribution layers
Grant 10,818,536 - Shih , et al. October 27, 2 | 2020-10-27 |
Electronic device
Grant 10,818,625 - Shih October 27, 2 | 2020-10-27 |
Semiconductor structure and fabrication thereof
Grant 10,811,309 - Shih , et al. October 20, 2 | 2020-10-20 |
Semiconductor Package Structure And Method For Preparing The Same
App 20200303361 - SHIH; SHING-YIH | 2020-09-24 |
Interconnect Structure And Method For Preparing The Same
App 20200286777 - WANG; MAO-YING ; et al. | 2020-09-10 |
Interconnect Structure And Method For Preparing The Same
App 20200286775 - WANG; MAO-YING ; et al. | 2020-09-10 |
Semiconductor structure and method of manufacturing thereof
Grant 10,770,424 - Shih Sep | 2020-09-08 |
Semiconductor package structure and method for preparing the same
Grant 10,763,199 - Shih Sep | 2020-09-01 |
Method of preparing semiconductor structure
Grant 10,763,262 - Shih Sep | 2020-09-01 |
Method For Preparing A Semiconductor Structure
App 20200258755 - A1 | 2020-08-13 |
Semiconductor Package And Manufacturing Method Thereof
App 20200251454 - Kind Code | 2020-08-06 |
Semiconductor Package Structure And Method For Preparing The Same
App 20200203282 - SHIH; SHING-YIH | 2020-06-25 |
Semiconductor Structure
App 20200203315 - SHIH; SHING-YIH | 2020-06-25 |
Semiconductor Package Structure And Method For Preparing The Same
App 20200203267 - SHIH; Shing-Yih | 2020-06-25 |
Method for preparing a semiconductor structure
Grant 10,685,845 - Shih | 2020-06-16 |
Method Of Forming Fine Interconnection For A Semiconductor Device
App 20200185268 - SHIH; Shing-Yih | 2020-06-11 |
Electronic Device And Method Of Manufacturing The Same
App 20200176377 - LIN; Yu-Ting ; et al. | 2020-06-04 |
Semiconductor Structure And Fabrication Thereof
App 20200176307 - SHIH; Shing-Yih ; et al. | 2020-06-04 |
Method Of Manufacturing Semiconductor Structure
App 20200168457 - SHIH; Shing-Yih ; et al. | 2020-05-28 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200168543 - SHIH; Shing-Yih | 2020-05-28 |
Microelectronic Devices Including Redistribution Layers
App 20200168497 - Shih; Shing-Yih ; et al. | 2020-05-28 |
Method Of Preparing Semiconductor Structure
App 20200168615 - SHIH; Shing-Yih | 2020-05-28 |
Method For Preparing A Semiconductor Structure
App 20200144070 - SHIH; Shing-Yih | 2020-05-07 |
Semiconductor package and method for fabricating the same
Grant 10,629,522 - Shih | 2020-04-21 |
Method For Preparing Semiconductor Structures
App 20200090980 - SHIH; SHING-YIH | 2020-03-19 |
Microelectronic package structures including redistribution layers
Grant 10,566,229 - Shih , et al. Feb | 2020-02-18 |
Method for preparing a semiconductor structure
Grant 10,553,433 - Shih Fe | 2020-02-04 |
Method for preparing a semiconductor structure
Grant 10,529,570 - Shih J | 2020-01-07 |
Method of manufacturing semiconductor device
Grant 10,529,586 - Shih J | 2020-01-07 |
Semiconductor package with multiple coplanar interposers
Grant 10,529,689 - Shih J | 2020-01-07 |
Semiconductor Package With Multiple Coplanar Interposers
App 20190378818 - Shih; Shing-Yih | 2019-12-12 |
Methods Of Forming And Operating Microelectronic Devices Including Dummy Chips
App 20190371749 - Shih; Shing-Yih ; et al. | 2019-12-05 |
Method Of Manufacturing Semiconductor Device
App 20190362985 - SHIH; Shing-Yih | 2019-11-28 |
Methods of forming and operating microelectronic devices including dummy chips
Grant 10,446,509 - Shih , et al. Oc | 2019-10-15 |
Method of manufacturing a semiconductor structure
Grant 10,431,492 - Shih , et al. O | 2019-10-01 |
Semiconductor Package And Method For Fabricating The Same
App 20190287889 - Shih; Shing-Yih | 2019-09-19 |
Method for preparing semiconductor structures
Grant 10,410,910 - Shih Sept | 2019-09-10 |
Methods Of Forming Microelectronic Structures Having A Patterned Surface Structure
App 20190273058 - Shih; Shing-Yih ; et al. | 2019-09-05 |
Method of manufacturing semiconductor device
Grant 10,395,976 - Shih , et al. A | 2019-08-27 |
Semiconductor package and method for fabricating the same
Grant 10,381,301 - Shih A | 2019-08-13 |
Semiconductor package with embedded MIM capacitor, and method of fabricating thereof
Grant 10,381,302 - Shih , et al. A | 2019-08-13 |
Methods of forming microelectronic structures having a patterned surface structure
Grant 10,354,966 - Shih , et al. July 16, 2 | 2019-07-16 |
Method of forming dense hole patterns of semiconductor devices
Grant 10,340,149 - Shih , et al. | 2019-07-02 |
Method for preparing a semiconductor pattern having semiconductor structure of different lengths
Grant 10,332,749 - Shih , et al. | 2019-06-25 |
Method For Preparing A Semiconductor Structure
App 20190139767 - SHIH; SHING-YIH | 2019-05-09 |
Semiconductor Structure And Method For Preparing The Same
App 20190139766 - SHIH; SHING-YIH | 2019-05-09 |
Method of forming fine line patterns of semiconductor devices
Grant 10,283,362 - Shih | 2019-05-07 |
Method of forming fine interconnection for semiconductor devices
Grant 10,262,862 - Shih , et al. | 2019-04-16 |
Method For Preparing A Semiconductor Pattern Having Semiconductor Structure Of Different Lengths
App 20190080920 - SHIH; Chiang-Lin ; et al. | 2019-03-14 |
Method Of Forming Fine Island Patterns Of Semiconductor Devices
App 20190074182 - SHIH; Chiang-Lin ; et al. | 2019-03-07 |
Method Of Forming Dense Hole Patterns Of Semiconductor Devices
App 20190074187 - SHIH; Shing-Yih ; et al. | 2019-03-07 |
Method Of Forming Fine Line Patterns Of Semiconductor Devices
App 20190057870 - SHIH; Shing-Yih ; et al. | 2019-02-21 |
Method Of Forming Fine Line Patterns Of Semiconductor Devices
App 20190057871 - SHIH; Shing-Yih | 2019-02-21 |
Method for manufacturing a semiconductor structure
Grant 10,211,061 - Shih Feb | 2019-02-19 |
Method of forming fine island patterns of semiconductor devices
Grant 10,204,783 - Shih , et al. Feb | 2019-02-12 |
Semiconductor Structure And Method For Preparing The Same
App 20190027364 - LIN; JENG-PING ; et al. | 2019-01-24 |
Method for manufacturing a semiconductor device
Grant 10,181,401 - Shih Ja | 2019-01-15 |
Semiconductor pattern having semiconductor structures of different lengths
Grant 10,170,328 - Shih , et al. J | 2019-01-01 |
Semiconductor Devices Comprising Vias And Capacitors
App 20180366540 - Wu; Tieh-Chiang ; et al. | 2018-12-20 |
Method for manufacturing a semiconductor structure
Grant 10,153,161 - Shih Dec | 2018-12-11 |
Method for preparing semiconductor structures
Grant 10,147,611 - Shih , et al. De | 2018-12-04 |
Method for preparing a patterned target layer
Grant 10,147,608 - Shih , et al. De | 2018-12-04 |
Semiconductor package and fabrication method thereof
Grant 10,128,212 - Shih , et al. November 13, 2 | 2018-11-13 |
Methods Of Forming And Operating Semiconductor Devices Including Dummy Chips
App 20180323160 - Shih; Shing-Yih ; et al. | 2018-11-08 |
Methods of fabricating a semiconductor structure
Grant 10,121,849 - Wu , et al. November 6, 2 | 2018-11-06 |
Semiconductor Packages And Devices
App 20180315718 - Shih; Shing-Yih ; et al. | 2018-11-01 |
Method of forming fine island patterns of semiconductor devices
Grant 10,115,594 - Shih , et al. October 30, 2 | 2018-10-30 |
Method for preparing a semiconductor structure having second line patterns and third line patterns formed over first line patterns
Grant 10,090,154 - Lin , et al. October 2, 2 | 2018-10-02 |
Methods Of Forming Semiconductor Structures Having A Patterned Surface Structure
App 20180247906 - Shih; Shing-Yih ; et al. | 2018-08-30 |
Methods of forming semiconductor packages including molding semiconductor chips of the semiconductor packages
Grant 10,056,338 - Shih , et al. August 21, 2 | 2018-08-21 |
Patterning method
Grant 10,049,877 - Shih August 14, 2 | 2018-08-14 |
Semiconductor Package And Method For Fabricating The Same
App 20180226333 - SHIH; Shing-Yih | 2018-08-09 |
Semiconductor devices including dummy chips
Grant 10,043,769 - Shih , et al. August 7, 2 | 2018-08-07 |
Semiconductor package and fabrication method thereof
Grant 10,026,680 - Shih July 17, 2 | 2018-07-17 |
Semiconductor Package With Embedded Mim Capacitor, And Method Of Fabricating Thereof
App 20180190582 - SHIH; Shing-Yih ; et al. | 2018-07-05 |
Semiconductor Package Structures Including Redistribution Layers
App 20180190531 - Shih; Shing-Yih ; et al. | 2018-07-05 |
Semiconductor structure having a patterned surface structure and semiconductor chips including such structures
Grant 10,008,461 - Shih , et al. June 26, 2 | 2018-06-26 |
Semiconductor Package Utilizing Embedded Bridge Through-silicon-via Interconnect Component
App 20180102311 - Shih; Shing-Yih | 2018-04-12 |
Wafer Level Package Utilizing Molded Interposer
App 20180102313 - Shih; Shing-Yih | 2018-04-12 |
Semiconductor package and fabrication method thereof
Grant 9,922,845 - Shih March 20, 2 | 2018-03-20 |
Interposer and semiconductor package
Grant 9,922,924 - Shih March 20, 2 | 2018-03-20 |
Methods of fabricating a semiconductor package structure including at least one redistribution layer
Grant 9,916,999 - Shih , et al. March 13, 2 | 2018-03-13 |
Semiconductor Package And Fabrication Method Thereof
App 20180053708 - Shih; Shing-Yih | 2018-02-22 |
Semiconductor Package And Fabrication Method Thereof
App 20170365580 - Shih; Shing-Yih ; et al. | 2017-12-21 |
Semiconductor Package With Multiple Coplanar Interposers
App 20170323866 - Shih; Shing-Yih | 2017-11-09 |
Semiconductor package with sidewall-protected RDL interposer
Grant 9,786,514 - Shih , et al. October 10, 2 | 2017-10-10 |
Semiconductor package and fabrication method thereof
Grant 9,786,586 - Shih October 10, 2 | 2017-10-10 |
Semiconductor Package With Sidewall-protected Rdl Interposer
App 20170263469 - Shih; Shing-Yih ; et al. | 2017-09-14 |
Wafer level package and fabrication method thereof
Grant 9,761,540 - Shih September 12, 2 | 2017-09-12 |
Semiconductor package and fabrication method thereof
Grant 9,761,559 - Shih , et al. September 12, 2 | 2017-09-12 |
Wafer level package with TSV-less interposer
Grant 9,748,184 - Shih , et al. August 29, 2 | 2017-08-29 |
Semiconductor package with multiple coplanar interposers
Grant 9,721,923 - Shih August 1, 2 | 2017-08-01 |
Method For Manufacturing A Package-on-package Assembly
App 20170213801 - Wu; Tieh-Chiang ; et al. | 2017-07-27 |
Method of fabricating a wafer level package
Grant 9,704,790 - Wu , et al. July 11, 2 | 2017-07-11 |
Semiconductor Structure And Fabricating Method Thereof
App 20170141185 - WU; Tieh-Chiang ; et al. | 2017-05-18 |
Semiconductor Package And Method For Forming The Same
App 20170117232 - SHIH; Shing-Yih ; et al. | 2017-04-27 |
Wafer Level Package With Tsv-less Interposer
App 20170110419 - Shih; Shing-Yih ; et al. | 2017-04-20 |
Semiconductor package with double side molding
Grant 9,613,895 - Shih April 4, 2 | 2017-04-04 |
Multi-chip semiconductor package with via components and method for manufacturing the same
Grant 9,607,967 - Shih March 28, 2 | 2017-03-28 |
Method For Manufacturing A Wafer Level Package
App 20170062240 - Wu; Tieh-Chiang ; et al. | 2017-03-02 |
Method for fabricating wafer level package
Grant 9,576,931 - Shih February 21, 2 | 2017-02-21 |
Semiconductor package with sidewall-protected RDL interposer and fabrication method thereof
Grant 9,570,369 - Shih , et al. February 14, 2 | 2017-02-14 |
Wafer Level Package And Fabrication Method Thereof
App 20160379935 - Shih; Shing-Yih | 2016-12-29 |
Wafer Level Package And Fabrication Method Thereof
App 20160372395 - Shih; Shing-Yih ; et al. | 2016-12-22 |
Package-on-package Assembly And Method For Manufacturing The Same
App 20160365334 - Shih; Shing-Yih ; et al. | 2016-12-15 |
Wafer level package and fabrication method thereof
Grant 9,520,333 - Shih , et al. December 13, 2 | 2016-12-13 |
Connector Structure And Manufacturing Method Thereof
App 20160358868 - SHIH; Shing-Yih ; et al. | 2016-12-08 |
Package Structure And Manufacturing Method Thereof
App 20160358847 - SHIH; Shing-Yih ; et al. | 2016-12-08 |
Wafer Level Package And Fabrication Method Thereof
App 20160358865 - Shih; Shing-Yih ; et al. | 2016-12-08 |
Package-on-package assembly and method for manufacturing the same
Grant 9,449,953 - Shih , et al. September 20, 2 | 2016-09-20 |
Wafer level package and fabrication method thereof
Grant 9,449,935 - Shih , et al. September 20, 2 | 2016-09-20 |
Package-on-package assembly and method for manufacturing the same
Grant 9,437,583 - Shih , et al. September 6, 2 | 2016-09-06 |
Semiconductor structure and manufacturing method thereof
Grant 9,397,048 - Shih , et al. July 19, 2 | 2016-07-19 |
Recess array device
Grant 9,379,197 - Wu , et al. June 28, 2 | 2016-06-28 |
Method of bevel trimming three dimensional semiconductor device
Grant 8,551,881 - Shih , et al. October 8, 2 | 2013-10-08 |
Method for increasing adhesion between polysilazane and silicon nitride
Grant 8,420,541 - Shih , et al. April 16, 2 | 2013-04-16 |
Method For Increasing Adhesion Between Polysilazane And Silicon Nitride
App 20120282777 - SHIH; Shing-Yih ; et al. | 2012-11-08 |
Method For Forming Trench Isolation
App 20120276707 - Shih; Shing-Yih ; et al. | 2012-11-01 |
Method Of Oxidizing Polysilazane
App 20120276714 - Shih; Shing-Yih ; et al. | 2012-11-01 |
Method Of Bevel Trimming Three Dimensional Semiconductor Device
App 20120270394 - Shih; Shing-Yih ; et al. | 2012-10-25 |
Patterning method
Grant 8,216,946 - Shiu , et al. July 10, 2 | 2012-07-10 |
Method for forming a shallow trench isolation
Grant 8,207,065 - Liao , et al. June 26, 2 | 2012-06-26 |
Patterning Method
App 20100323521 - Shiu; Wei-Cheng ; et al. | 2010-12-23 |
Method For Forming A Shallow Trench Isolation
App 20090029556 - Liao; Chien-Mao ; et al. | 2009-01-29 |
Trench isolation structure and method of forming the same
Grant 7,154,159 - Cheng , et al. December 26, 2 | 2006-12-26 |
Trench isolation structure and method of forming the same
App 20050184356 - Cheng, Chien-Chang ; et al. | 2005-08-25 |
Via contact forming method
App 20050101124 - Wu, Chang-Ming ; et al. | 2005-05-12 |
Method to prevent electrical shorts between tungsten interconnects
Grant 6,867,142 - Chen , et al. March 15, 2 | 2005-03-15 |
Method of making a bit line contact device
Grant 6,821,872 - Liao , et al. November 23, 2 | 2004-11-23 |
Method for forming a trench isolation structure
Grant 6,794,266 - Shih , et al. September 21, 2 | 2004-09-21 |
Method for forming shallow trench isolation
Grant 6,743,728 - Ho , et al. June 1, 2 | 2004-06-01 |
Method for forming shallow trench isolation
App 20040058549 - Ho, Tzu En ; et al. | 2004-03-25 |
Method for forming a trench isolation structure
App 20040038493 - Shih, Shing-Yih ; et al. | 2004-02-26 |
Method to prevent electrical shorts between tungsten interconnects
App 20030139058 - Chen, Yi-Nan ; et al. | 2003-07-24 |
Method Of Forming Interconnects
App 20030082899 - Huang, Tse-Yao ; et al. | 2003-05-01 |
| 