Shih; Po-Cheng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Shih; Po-Cheng.The latest application filed is for "hybrid film scheme for self-aligned contact".
Company Profile
16.36.39
- Shih; Po-Cheng - Hsinchu TW
- SHIH; Po-Cheng - Hsin Chiu City TW
- Shih; Po-Cheng - Hsin Chiu TW
- SHIH; Po-Cheng - Hsinchu City TW
- Shih; Po-Cheng - Hsin-Chu TW
- SHIH; Po-Cheng - Hsin Chu City TW
- Shih; Po-Cheng - Hsnchu TW
- Shih; Po-Cheng - Taipei TW
- Shih; Po-Cheng - Taipei City TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor device having an extra low-k dielectric layer and method of forming the same Grant 11,417,602 - Shih , et al. August 16, 2 | 2022-08-16 |
| Hybrid Film Scheme For Self-aligned Contact App 20220246473 - Lu; Jian-Hong ; et al. | 2022-08-04 |
| Method For Forming Semiconductor Device With Multi-layer Etch Stop Structure App 20220208603 - SHIH; Po-Cheng ; et al. | 2022-06-30 |
| Multi-layer film device and method Grant 11,374,127 - Chang , et al. June 28, 2 | 2022-06-28 |
| Interconnect structure and method Grant 11,328,952 - Chou , et al. May 10, 2 | 2022-05-10 |
| Semiconductor device with multi-layer etch stop structure and method for forming the same Grant 11,282,742 - Shih , et al. March 22, 2 | 2022-03-22 |
| Patterning Interconnects and Other Structures by Photo-Sensitizing Method App 20210265204 - Lo; Wei-Jen ; et al. | 2021-08-26 |
| Low-k dielectric and processes for forming same Grant 11,062,901 - Chou , et al. July 13, 2 | 2021-07-13 |
| Low-k Dielectric and Processes for Forming Same App 20210183646 - Chou; Chia Cheng ; et al. | 2021-06-17 |
| Semiconductor Device With Multi-layer Etch Stop Structure And Method For Forming The Same App 20210118728 - SHIH; Po-Cheng ; et al. | 2021-04-22 |
| Interconnect Structure and Method App 20210074581 - Chou; Chia-Cheng ; et al. | 2021-03-11 |
| Methods for Reducing Dual Damascene Distortion App 20210057340 - Wang; Chao-Chun ; et al. | 2021-02-25 |
| Low-k dielectric and processes for forming same Grant 10,910,216 - Chou , et al. February 2, 2 | 2021-02-02 |
| Interconnect structure and method Grant 10,840,134 - Chou , et al. November 17, 2 | 2020-11-17 |
| Multi-Layer Film Device and Method App 20200357922 - Chang; Yao-Jen ; et al. | 2020-11-12 |
| Methods for reducing dual damascene distortion Grant 10,818,598 - Wang , et al. October 27, 2 | 2020-10-27 |
| Semiconductor Device Having An Extra Low-k Dielectric Layer And Method Of Forming The Same App 20200335449 - SHIH; Po-Cheng ; et al. | 2020-10-22 |
| Multi-layer film device and method Grant 10,727,350 - Chang , et al. | 2020-07-28 |
| Semiconductor device having an extra low-k dielectric layer and method of forming the same Grant 10,707,165 - Shih , et al. | 2020-07-07 |
| Low-k Dielectric and Processes for Forming Same App 20200006059 - Chou; Chia Cheng ; et al. | 2020-01-02 |
| Interconnect Structure and Method App 20190252246 - Chou; Chia-Cheng ; et al. | 2019-08-15 |
| Methods for Reducing Dual Damascene Distortion App 20190244898 - Wang; Chao-Chun ; et al. | 2019-08-08 |
| Methods for reducing dual damascene distortion Grant 10,332,836 - Wang , et al. | 2019-06-25 |
| Low-k Dielectric and Processes for Forming Same App 20190164748 - CHOU; Chia Cheng ; et al. | 2019-05-30 |
| Interconnect structure and method Grant 10,269,627 - Chou , et al. | 2019-04-23 |
| Multi-layer film device and method Grant 10,199,500 - Chang , et al. Fe | 2019-02-05 |
| Low-K dielectric interconnect systems Grant 10,163,691 - Shih , et al. Dec | 2018-12-25 |
| Multi-Layer Film Device and Method App 20180350993 - Chang; Yao-Jen ; et al. | 2018-12-06 |
| Semiconductor Device Having An Extra Low-k Dielectric Layer And Method Of Forming The Same App 20180308801 - SHIH; Po-Cheng ; et al. | 2018-10-25 |
| Methods for Reducing Dual Damascene Distortion App 20180102319 - Wang; Chao-Chun ; et al. | 2018-04-12 |
| Multi-Layer Film Device and Method App 20180040732 - Chang; Yao-Jen ; et al. | 2018-02-08 |
| Low-k Dielectric Interconnect Systems App 20180005882 - SHIH; Po-Cheng ; et al. | 2018-01-04 |
| Interconnect Structure and Method App 20170372948 - Chou; Chia-Cheng ; et al. | 2017-12-28 |
| Methods for reducing dual damascene distortion Grant 9,842,804 - Wang , et al. December 12, 2 | 2017-12-12 |
| Low-k dielectric interconnect systems Grant 9,768,061 - Shih , et al. September 19, 2 | 2017-09-19 |
| Interconnect Structure And Method App 20170256445 - Chou; Chia-Cheng ; et al. | 2017-09-07 |
| Interconnect structure and method Grant 9,754,822 - Chou , et al. September 5, 2 | 2017-09-05 |
| Method of making interconnect structure Grant 9,748,134 - Shih , et al. August 29, 2 | 2017-08-29 |
| Methods for Reducing Dual Damascene Distortion App 20170194253 - Wang; Chao-Chun ; et al. | 2017-07-06 |
| Interconnect structure and method for forming the same Grant 9,373,581 - Shih , et al. June 21, 2 | 2016-06-21 |
| Method Of Making Interconnect Structure App 20160155663 - Shih; Po-Cheng ; et al. | 2016-06-02 |
| Method of forming semiconductor device using remote plasma treatment Grant 9,269,614 - Shih , et al. February 23, 2 | 2016-02-23 |
| Method of making interconnect structure Grant 9,257,331 - Shih , et al. February 9, 2 | 2016-02-09 |
| Method for forming semiconductor device structure Grant 9,236,294 - Chou , et al. January 12, 2 | 2016-01-12 |
| Methods for forming interconnect structures of integrated circuits Grant 9,130,017 - Shih , et al. September 8, 2 | 2015-09-08 |
| High UV curing efficiency for low-k dielectrics Grant 9,093,265 - Shih , et al. July 28, 2 | 2015-07-28 |
| Method For Forming Semiconductor Device Structure App 20150200133 - CHOU; Chia-Cheng ; et al. | 2015-07-16 |
| Method Of Forming Semiconductor Device App 20150170960 - SHIH; Po-Cheng ; et al. | 2015-06-18 |
| Interconnect Structure and Method for Forming the Same App 20150155234 - Shih; Po-Cheng ; et al. | 2015-06-04 |
| High Uv Curing Efficiency For Low-k Dielectrics App 20150104953 - Shih; Po-Cheng ; et al. | 2015-04-16 |
| Interconnect structure and method for forming the same Grant 8,993,442 - Shih , et al. March 31, 2 | 2015-03-31 |
| Interconnect structure and method for forming the same Grant 8,994,178 - Shih , et al. March 31, 2 | 2015-03-31 |
| Low-k Cu barriers in damascene interconnect structures Grant 8,993,435 - Wang , et al. March 31, 2 | 2015-03-31 |
| Interconnect Structure And Method For Forming The Same App 20150056802 - Shih; Po-Cheng ; et al. | 2015-02-26 |
| Method Of Making Interconnect Structure App 20150011084 - SHIH; Po-Cheng ; et al. | 2015-01-08 |
| Surface treatment in the formation of interconnect structure Grant 8,877,083 - Chou , et al. November 4, 2 | 2014-11-04 |
| Interconnect structure and method for forming the same Grant 8,853,831 - Shih , et al. October 7, 2 | 2014-10-07 |
| Surface Treatment in the Formation of Interconnect Structure App 20140141611 - Chou; Chia-Cheng ; et al. | 2014-05-22 |
| Interconnect Structure And Method For Forming The Same App 20130256903 - SHIH; Po-Cheng ; et al. | 2013-10-03 |
| Interconnect Structure And Method For Forming The Same App 20130256888 - SHIH; Po-Cheng ; et al. | 2013-10-03 |
| Double patterning strategy for contact hole and trench in photolithography Grant 8,470,708 - Shih , et al. June 25, 2 | 2013-06-25 |
| Methods for Forming Interconnect Structures of Integrated Circuits App 20130052818 - Shih; Po-Cheng ; et al. | 2013-02-28 |
| Low-k Cu Barriers in Damascene Interconnect Structures App 20110223759 - Wang; Kuan-Chen ; et al. | 2011-09-15 |
| Double Patterning Strategy For Contact Hole And Trench In Photolithography App 20110207329 - SHIH; Po-Cheng ; et al. | 2011-08-25 |
| Common voltage adjustment circuit and liquid crystal display panel utilizing the same Grant 7,400,312 - Hung , et al. July 15, 2 | 2008-07-15 |
| Liquid Crystal Module App 20060001820 - Cheng; Yin-Tsung ; et al. | 2006-01-05 |
| Common voltage adjustment circuit and liquid crystal display panel utilizing the same App 20050219185 - Hung, Chi-Mao ; et al. | 2005-10-06 |
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