| Patent | Date |
|---|
Storage container for electronic devices
Grant 11,148,864 - Shih , et al. October 19, 2 | 2021-10-19 |
Semiconductor device having 3D inductor and method of manufacturing the same
Grant 11,056,555 - Shih , et al. July 6, 2 | 2021-07-06 |
Method for reduction of interfacial stress accumulation between double side copper-plated layers and aluminum nitride substrate
Grant 10,923,621 - Wu , et al. February 16, 2 | 2021-02-16 |
Surface Acoustic Wave Device And Method Of Manufacturing The Same
App 20210013865 - Shih; Cheng-Hung ; et al. | 2021-01-14 |
Electroplating system and pressure device thereof
Grant 10,808,331 - Shih , et al. October 20, 2 | 2020-10-20 |
Chip package and chip thereof
Grant 10,797,213 - Hsieh , et al. October 6, 2 | 2020-10-06 |
Semiconductor Device Having 3d Inductor And Method Of Manufacturing The Same
App 20200295123 - Shih; Cheng-Hung ; et al. | 2020-09-17 |
Semiconductor Device Having 3d Inductor And Method Of Manufacturing The Same
App 20200266262 - Shih; Cheng-Hung ; et al. | 2020-08-20 |
Method For Reduction Of Interfacial Stress Accumulation Between Double Side Copper-plated Layers And Aluminum Nitride Substrate
App 20200152825 - Wu; Chun-Te ; et al. | 2020-05-14 |
Chip Package And Chip Thereof
App 20200091385 - Hsieh; Chin-Tang ; et al. | 2020-03-19 |
Method for producing spherical silicon nitride powder
Grant 10,384,941 - Wu , et al. A | 2019-08-20 |
Light emitting element with an enhanced electroluminescence effect
Grant 10,381,508 - Lo , et al. A | 2019-08-13 |
Electroplating System And Pressure Device Thereof
App 20190186037 - Shih; Cheng-Hung ; et al. | 2019-06-20 |
Method For Producing Spherical Silicon Nitride Powder
App 20190177162 - WU; CHUN-TE ; et al. | 2019-06-13 |
Light Emitting Element
App 20190044022 - Lo; I-Kai ; et al. | 2019-02-07 |
Method for preparing spherical aluminum oxynitride powder
Grant 10,144,645 - Lai , et al. De | 2018-12-04 |
Cosmetic Product
App 20170042312 - SHIH; Cheng-Hung | 2017-02-16 |
Semiconductor package structure having hollow chamber and bottom substrate and package process thereof
Grant 9,508,676 - Shih , et al. November 29, 2 | 2016-11-29 |
Process For Manufacturing Semiconductor Package Having Hollow Chamber
App 20160318756 - Shih; Cheng-Hung ; et al. | 2016-11-03 |
Method for Manufacturing a Light Emitting Element
App 20160293793 - Lo; I-Kai ; et al. | 2016-10-06 |
Lattice-matched Light Emitting Element
App 20160141453 - Lo; I-Kai ; et al. | 2016-05-19 |
Epitaxy structure of a light emitting element having III-nitride quantum wells
Grant 9,312,440 - Lo , et al. April 12, 2 | 2016-04-12 |
Trace Structure Of Fine-pitch Pattern
App 20160020166 - Hsieh; Yung-Wei ; et al. | 2016-01-21 |
Method of photoresist strip
Grant 9,230,823 - Shih , et al. January 5, 2 | 2016-01-05 |
Method for manufacturing aluminum nitride powder
Grant 9,216,906 - Kuo , et al. December 22, 2 | 2015-12-22 |
Epitaxy Structure Of A Light Emitting Element
App 20150333222 - LO; I-KAI ; et al. | 2015-11-19 |
Stacking Structure Of A Light-emitting Device
App 20150333226 - LO; I-Kai ; et al. | 2015-11-19 |
Stacking Structure Of A Photoelectric Device
App 20150333209 - Lo; I-Kai ; et al. | 2015-11-19 |
III-nitride quantum well structure and a light-emitting unit using the same
Grant 9,147,808 - Lo , et al. September 29, 2 | 2015-09-29 |
Method For Manufacturing Aluminum Nitride Powder
App 20150175421 - Kuo; Yang-Kuao ; et al. | 2015-06-25 |
Substrate Of Semiconductor And Method For Forming The Same
App 20150171052 - Kuo; Yang-Kuao ; et al. | 2015-06-18 |
Method Of Preparing Heterogeneous Stacked Co-fired Ceramic For Use In An Aluminum Nitride Electrostatic Chuck
App 20150155194 - KUO; YANG-KUO ; et al. | 2015-06-04 |
III-Nitride Quantum Well Structure and a Light-Emitting Unit Using the Same
App 20150102286 - LO; I-Kai ; et al. | 2015-04-16 |
III-nitride quantum well structure, a method for producing the same, and a light-emitting unit using the same
Grant 8,916,458 - Lo , et al. December 23, 2 | 2014-12-23 |
Semiconductor Manufacturing Process And Structure Thereof
App 20140367856 - Shih; Cheng-Hung ; et al. | 2014-12-18 |
Semiconductor manufacturing process and structure thereof
Grant 8,877,629 - Shih , et al. November 4, 2 | 2014-11-04 |
Lamp module with electronic connector adapter
Grant 8,783,897 - Shih July 22, 2 | 2014-07-22 |
Semiconductor Manufacturing Process And Structure Thereof
App 20140159234 - Shih; Cheng-Hung ; et al. | 2014-06-12 |
Iii-nitride Quantum Well Structure, A Method For Producing The Same, And A Light-emitting Unit Using The Same
App 20140110664 - LO; I-Kai ; et al. | 2014-04-24 |
Electronic Device
App 20140098503 - Huang; Mao-Sheng ; et al. | 2014-04-10 |
Pyramid bump structure
Grant 8,692,390 - Wu , et al. April 8, 2 | 2014-04-08 |
Package structure and semiconductor structure thereof
Grant 8,581,239 - Shih , et al. November 12, 2 | 2013-11-12 |
Method For Manufacturing Fine-pitch Bumps And Structure Thereof
App 20130256882 - Shih; Cheng-Hung ; et al. | 2013-10-03 |
Method For Manufacturing Fine-pitch Bumps And Structure Thereof
App 20130249081 - Shih; Cheng-Hung ; et al. | 2013-09-26 |
Semiconductor Packaging Method And Structure Thereof
App 20130252374 - Shih; Cheng-Hung ; et al. | 2013-09-26 |
Method For Manufacturing Fine-pitch Bumps And Structure Thereof
App 20130249089 - Shih; Cheng-Hung ; et al. | 2013-09-26 |
Method for manufacturing fine-pitch bumps and structure thereof
Grant 8,530,344 - Shih , et al. September 10, 2 | 2013-09-10 |
Semiconductor Packaging Method And Structure Thereof
App 20130214419 - Shih; Cheng-Hung ; et al. | 2013-08-22 |
Semiconductor Packaging Method And Structure Thereof
App 20130214407 - Shih; Cheng-Hung ; et al. | 2013-08-22 |
Method for manufacturing fine-pitch bumps and structure thereof
Grant 8,501,614 - Shih , et al. August 6, 2 | 2013-08-06 |
Semiconductor packaging method and structure thereof
Grant 8,497,579 - Shih , et al. July 30, 2 | 2013-07-30 |
Package Structure And Semiconductor Structure Thereof
App 20130187265 - Shih; Cheng-Hung ; et al. | 2013-07-25 |
m-terphenyl compound derivatives and application for organic light emitting diode
Grant 8,475,939 - Cheng , et al. July 2, 2 | 2013-07-02 |
Process for forming an anti-oxidant metal layer on an electronic device
Grant 8,450,049 - Kuo , et al. May 28, 2 | 2013-05-28 |
Bump structure and process of manufacturing the same
Grant 8,437,142 - Shih , et al. May 7, 2 | 2013-05-07 |
Bump Structure And Process Of Manufacturing The Same
App 20120318570 - Shih; Cheng-Hung ; et al. | 2012-12-20 |
Bump Structure And Process Of Manufacturing The Same
App 20120319271 - Shih; Cheng-Hung ; et al. | 2012-12-20 |
Bump structure and process of manufacturing the same
Grant 8,330,280 - Shih , et al. December 11, 2 | 2012-12-11 |
Lamp cartridge adapter and lamp module
App 20120243218 - Shih; Cheng-Hung | 2012-09-27 |
Pyramid Bump Structure
App 20120211257 - Wu; Chih-Hung ; et al. | 2012-08-23 |
Process For Forming An Anti-oxidant Metal Layer On An Electronic Device
App 20120208129 - Kuo; Chih-Ming ; et al. | 2012-08-16 |
m-TERPHENYL COMPOUND DERIVATIVES AND APPLICATION FOR ORGANIC LIGHT EMITTING DIODE
App 20110220880 - CHENG; Chien-Hong ; et al. | 2011-09-15 |
Integrated circuit packaging method and structure for redistributing configuration thereof
App 20050253259 - Lin, Chih Hsiang ; et al. | 2005-11-17 |
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