Shaw; Thomas M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shaw; Thomas M..The latest application filed is for "compressive zone to reduce dicing defects".

Company Profile

6.84.82

Shaw; Thomas M. - Peekskill NY
Shaw; Thomas M - Yorktown Heights NY US
Shaw; Thomas M. - US
Shaw; Thomas M. - Yorktown Heights NY US
Shaw; Thomas M - Peeskill NY
Shaw; Thomas M - Peekskill NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Techniques to improve reliability in Cu interconnects using Cu intermetallics Grant 10,943,863 - Hu , et al. March 9, 2	2021-03-09
Compressive zone to reduce dicing defects Grant 10,833,025 - Peterson , et al. November 10, 2	2020-11-10
Techniques to improve reliability in Cu interconnects using Cu intermetallics Grant 10,818,590 - Hu , et al. October 27, 2	2020-10-27
Compressive Zone To Reduce Dicing Defects App 20200312788 - Peterson; Kirk D. ; et al.	2020-10-01
Step pyramid shaped structure to reduce dicing defects Grant 10,636,750 - Li , et al.	2020-04-28
Step Pyramid Shaped Structure To Reduce Dicing Defects App 20200118942 - Li; Shidong ; et al.	2020-04-16
Techniques to Improve Reliability in Cu Interconnects Using Cu Intermetallics App 20200006226 - Hu; Chao-Kun ; et al.	2020-01-02
Techniques to Improve Reliability in Cu Interconnects Using Cu Intermetallics App 20200006227 - Hu; Chao-Kun ; et al.	2020-01-02
Techniques to improve reliability in Cu interconnects using Cu intermetallics Grant 10,461,026 - Hu , et al. Oc	2019-10-29
Piezoelectronic switch device for RF applications Grant 10,354,824 - Copel , et al. July 16, 2	2019-07-16
Strain monitoring of MRAM arrays Grant 10,203,199 - Annunziata , et al. Feb	2019-02-12
Strain monitoring of MRAM arrays Grant 10,168,143 - Annunziata , et al. J	2019-01-01
Strain Monitoring Of Mram Arrays App 20180259323 - Annunziata; Anthony J. ; et al.	2018-09-13
Strain Monitoring Of Mram Arrays App 20180259322 - Annunziata; Anthony J. ; et al.	2018-09-13
Integrated time dependent dielectric breakdown reliability testing Grant 9,939,486 - Chen , et al. April 10, 2	2018-04-10
Piezoelectronic switch device for RF applications Grant 9,881,759 - Copel , et al. January 30, 2	2018-01-30
Integrated time dependent dielectric breakdown reliability testing Grant 9,874,601 - Chen , et al. January 23, 2	2018-01-23
Techniques to Improve Reliability in Cu Interconnects Using Cu Intermetallics App 20180005939 - Hu; Chao-Kun ; et al.	2018-01-04
Controlling fragmentation of chemically strengthened glass Grant 9,738,560 - Cabral, Jr. , et al. August 22, 2	2017-08-22
Integrated Time Dependent Dielectric Breakdown Reliability Testing App 20170122999 - Chen; Jifeng ; et al.	2017-05-04
Piezoelectronic Switch Device For Rf Applications App 20170084413 - Copel; Matthew W. ; et al.	2017-03-23
Controlling fragmentation of chemically strengthened glass Grant 9,586,857 - Cabral, Jr. , et al. March 7, 2	2017-03-07
Volumetric integrated circuit and volumetric integrated circuit manufacturing method Grant 9,583,410 - Edelstein , et al. February 28, 2	2017-02-28
Integrated time dependent dielectric breakdown reliability testing Grant 9,557,369 - Chen , et al. January 31, 2	2017-01-31
Integrated Time Dependent Dielectric Breakdown Reliability Testing App 20170010322 - Chen; Jifeng ; et al.	2017-01-12
Piezoelectronic switch device for RF applications Grant 9,472,368 - Copel , et al. October 18, 2	2016-10-18
Integrated time dependent dielectric breakdown reliability testing Grant 9,448,277 - Chen , et al. September 20, 2	2016-09-20
Piezoelectronic Switch Device For Rf Applications App 20160268083 - Copel; Matthew W. ; et al.	2016-09-15
Controlling Fragmentation Of Chemically Strengthened Glass App 20160264456 - Cabral, JR.; Cyril ; et al.	2016-09-15
Method and structure for determining thermal cycle reliability Grant 9,443,776 - Filippi , et al. September 13, 2	2016-09-13
Controlling Fragmentation Of Chemically Strengthened Glass App 20160137548 - Cabral, JR.; Cyril ; et al.	2016-05-19
Piezoelectronic Switch Device For Rf Applications App 20160126044 - Copel; Matthew W. ; et al.	2016-05-05
Method and structure for determining thermal cycle reliability Grant 9,287,186 - Filippi , et al. March 15, 2	2016-03-15
Low k porous SiCOH dielectric and integration with post film formation treatment Grant 9,219,037 - Gates , et al. December 22, 2	2015-12-22
Volumetric Integrated Circuit And Volumetric Integrated Circuit Manufacturing Method App 20150270246 - Edelstein; Daniel C. ; et al.	2015-09-24
Method And Structure For Determining Thermal Cycle Reliability App 20150262899 - FILIPPI; RONALD G. ; et al.	2015-09-17
Semiconductor test and monitoring structure to detect boundaries of safe effective modulus Grant 9,087,805 - Crain, Jr. , et al. July 21, 2	2015-07-21
Semiconductor article having a zig-zag guard ring and method of forming the same Grant 9,082,781 - Filippi , et al. July 14, 2	2015-07-14
Structure and method for making crack stop for 3D integrated circuits Grant 9,059,167 - Farooq , et al. June 16, 2	2015-06-16
Multiple step anneal method and semiconductor formed by multiple step anneal Grant 9,018,089 - Liniger , et al. April 28, 2	2015-04-28
Semiconductor test and monitoring structure to detect boundaries of safe effective modulus Grant 9,006,739 - Crain, Jr. , et al. April 14, 2	2015-04-14
Semiconductor Article Having A Zig-zag Guard Ring App 20150097297 - Filippi; Ronald G. ; et al.	2015-04-09
Semiconductor Test And Monitoring Structure To Detect Boundaries Of Safe Effective Modulus App 20150044787 - Crain, JR.; James V. ; et al.	2015-02-12
Structure And Method For Making Crack Stop For 3d Integrated Circuits App 20140339703 - Farooq; Mukta G. ; et al.	2014-11-20
Structure and method for making crack stop for 3D integrated circuits Grant 8,859,390 - Farooq , et al. October 14, 2	2014-10-14
Dieletric Cap Having Material With Optical Band Gap To Substantially Block Uv Radiation During Curing Treatment, And Related Methods App 20140302685 - Belyansky; Michael P. ; et al.	2014-10-09
Method of making a copper interconnect having a barrier liner of multiple metal layers Grant 8,841,212 - Nogami , et al. September 23, 2	2014-09-23
Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections Grant 8,796,133 - Bonilla , et al. August 5, 2	2014-08-05
Hybrid interconnect structure for performance improvement and reliability enhancement Grant 8,796,854 - Yang , et al. August 5, 2	2014-08-05
Integrated Time Dependent Dielectric Breakdown Reliability Testing App 20140207396 - Chen; Jifeng ; et al.	2014-07-24
Hybrid interconnect structure for performance improvement and reliability enhancement Grant 8,753,979 - Yang , et al. June 17, 2	2014-06-17
Hybrid interconnect structure for performance improvement and reliability enhancement Grant 8,754,526 - Yang , et al. June 17, 2	2014-06-17
Elastic modulus mapping of an integrated circuit chip in a chip/device package Grant 8,650,512 - Daubenspeck , et al. February 11, 2	2014-02-11
Semiconductor Structure App 20140021616 - Anzola; Diego ; et al.	2014-01-23
Semiconductor Structure App 20140024146 - Anzola; Diego ; et al.	2014-01-23
Optimization Metallization For Prevention Of Dielectric Cracking Under Controlled Collapse Chip Connections App 20140021622 - Bonilla; Griselda ; et al.	2014-01-23
Integrated Time Dependent Dielectric Breakdown Reliability Testing App 20130345997 - CHEN; JIFENG ; et al.	2013-12-26
Redundant metal barrier structure for interconnect applications Grant 8,592,306 - Yang , et al. November 26, 2	2013-11-26
Semiconductor Test And Monitoring Structure To Detect Boundaries Of Safe Effective Modulus App 20130270558 - Crain, JR.; James V. ; et al.	2013-10-17
Hybrid Interconnect Structure For Performance Improvement And Reliability Enhancement App 20130228925 - Yang; Chih-Chao ; et al.	2013-09-05
Hybrid Interconnect Structure For Performance Improvement And Reliability Enhancement App 20130230983 - Yang; Chih-Chao ; et al.	2013-09-05
Hybrid Interconnect Structure For Performance Improvement And Reliability Enhancement App 20130221529 - Yang; Chih-Chao ; et al.	2013-08-29
Hybrid interconnect structure for performance improvement and reliability enhancement Grant 8,456,006 - Yang , et al. June 4, 2	2013-06-04
Multiple Step Anneal Method And Semiconductor Formed By Multiple Step Anneal App 20130049207 - Liniger; Eric G. ; et al.	2013-02-28
Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same Grant 8,362,596 - Cohen , et al. January 29, 2	2013-01-29
Barrier Sequence For Use In Copper Interconnect Metallization App 20130005137 - Nogami; Takeshi ; et al.	2013-01-03
Device and methodology for reducing effective dielectric constant in semiconductor devices Grant 8,343,868 - Edelstein , et al. January 1, 2	2013-01-01
LOW k POROUS SiCOH DIELECTRIC AND INTEGRATION WITH POST FILM FORMATION TREATMENT App 20120329287 - Gates; Stephen M. ; et al.	2012-12-27
Redundant Metal Barrier Structure For Interconnect Applications App 20120264292 - Yang; Chih-Chao ; et al.	2012-10-18
Redundant metal barrier structure for interconnect applications Grant 8,242,600 - Yang , et al. August 14, 2	2012-08-14
Reducing effective dielectric constant in semiconductor devices Grant 8,129,286 - Edelstein , et al. March 6, 2	2012-03-06
Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures Grant 8,076,756 - Lane , et al. December 13, 2	2011-12-13
Hybrid Interconnect Structure For Performance Improvement And Reliability Enhancement App 20110260323 - Yang; Chih-Chao ; et al.	2011-10-27
Structure And Method For Making Crack Stop For 3d Integrated Circuits App 20110193197 - FAROOQ; MUKTA G. ; et al.	2011-08-11
Process for interfacial adhesion in laminate structures through patterned roughing of a surface Grant 7,972,965 - Cooney, III , et al. July 5, 2	2011-07-05
Hybrid interconnect structure for performance improvement and reliability enhancement Grant 7,973,409 - Yang , et al. July 5, 2	2011-07-05
Structure For Inhibiting Back End Of Line Damage From Dicing And Chip Packaging Interaction Failures App 20110140245 - LANE; MICHAEL W. ; et al.	2011-06-16
Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures Grant 7,955,955 - Lane , et al. June 7, 2	2011-06-07
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20110111590 - Edelstein; Daniel C. ; et al.	2011-05-12
Device and methodology for reducing effective dielectric constant in semiconductor devices Grant 7,892,940 - Edelstein , et al. February 22, 2	2011-02-22
Engineered Interconnect Dielectric Caps Having Compressive Stress And Interconnect Structures Containing Same App 20110012238 - Cohen; Stephan A. ; et al.	2011-01-20
BEOL interconnect structures with improved resistance to stress Grant 7,847,402 - Restaino , et al. December 7, 2	2010-12-07
Redundant Metal Barrier Structure For Interconnect Applications App 20100295181 - Yang; Chih-Chao ; et al.	2010-11-25
Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer Grant 7,820,559 - Clevenger , et al. October 26, 2	2010-10-26
Strengthening of a structure by infiltration Grant 7,678,673 - Huang , et al. March 16, 2	2010-03-16
Device and methodology for reducing effective dielectric constant in semiconductor devices Grant 7,592,685 - Edelstein , et al. September 22, 2	2009-09-22
Crack trapping and arrest in thin film structures Grant 7,573,130 - Shaw , et al. August 11, 2	2009-08-11
Barrier Sequence For Use In Copper Interconnect Metallization App 20090179328 - Nogami; Takeshi ; et al.	2009-07-16
LOW k POROUS SiCOH DIELECTRIC AND INTEGRATION WITH POST FILM FORMATION TREATMENT App 20090061649 - Gates; Stephen M. ; et al.	2009-03-05
LOW k POROUS SiCOH DIELECTRIC AND INTEGRATION WITH POST FILM FORMATION TREATMENT App 20090061237 - Gates; Stephen M. ; et al.	2009-03-05
Method of forming crack trapping and arrest in thin film structures Grant 7,491,578 - Shaw , et al. February 17, 2	2009-02-17
Strengthening Of A Structure By Infiltration App 20090035480 - Huang; Elbert ; et al.	2009-02-05
Hardmask for improved reliability of silicon based dielectrics Grant 7,485,582 - Nguyen , et al. February 3, 2	2009-02-03
Building metal pillars in a chip for structure support Grant 7,456,098 - Hichri , et al. November 25, 2	2008-11-25
Inhibiting Damage From Dicing And Chip Packaging Interaction Failures In Back End Of Line Structures App 20080277765 - Lane; Michael W. ; et al.	2008-11-13
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20080254630 - EDELSTEIN; Daniel C. ; et al.	2008-10-16
Structure To Improve Adhesion Between Top Cvd Low-k Dielectric And Dielectric Capping Layer App 20080254643 - Clevenger; Lawrence A. ; et al.	2008-10-16
Method And Structure For Determining Thermal Cycle Reliability App 20080224135 - Filippi; Ronald Gene ; et al.	2008-09-18
Beol Interconnect Structures With Improved Resistance To Stress App 20080197513 - Restaino; Darryl D. ; et al.	2008-08-21
Device and methodology for reducing effective dielectric constant in semiconductor devices Grant 7,405,147 - Edelstein , et al. July 29, 2	2008-07-29
Dielectric Cap Having Material With Optical Band Gap To Substantially Block Uv Radiation During Curing Treatment, And Related Methods App 20080173985 - Belyansky; Michael P. ; et al.	2008-07-24
Hybrid Interconnect Structure For Performance Improvement And Reliability Enhancement App 20080174017 - Yang; Chih-Chao ; et al.	2008-07-24
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer Grant 7,402,532 - Clevenger , et al. July 22, 2	2008-07-22
Structure for determining thermal cycle reliability Grant 7,388,224 - Filippi , et al. June 17, 2	2008-06-17
Hardmask For Improved Reliability Of Silicon Based Dielectrics App 20080132055 - Nguyen; Son Van ; et al.	2008-06-05
Method for reducing film stress for SiCOH low-k dielectric materials Grant 7,381,659 - Nguyen , et al. June 3, 2	2008-06-03
Hardmask For Improved Reliability Of Silicon Based Dielectrics App 20080118717 - Nguyen; Son Van ; et al.	2008-05-22
Control of liner thickness for improving thermal cycle reliability Grant 7,345,305 - Filippi , et al. March 18, 2	2008-03-18
Hardmask for reliability of silicon based dielectrics Grant 7,335,980 - Nguyen , et al. February 26, 2	2008-02-26
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20080038915 - EDELSTEIN; Daniel C. ; et al.	2008-02-14
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20080038923 - EDELSTEIN; Daniel C. ; et al.	2008-02-14
Process For Interfacial Adhesion In Laminate Structures Through Patterned Roughing Of A Surface App 20080020546 - COONEY; Edward C. III ; et al.	2008-01-24
Process for interfacial adhesion in laminate structures through patterned roughing of a surface Grant 7,303,994 - Cooney, III , et al. December 4, 2	2007-12-04
Method of extracting properties of back end of line (BEOL) chip architecture Grant 7,260,810 - Filippi, Jr. , et al. August 21, 2	2007-08-21
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer App 20070148958 - Clevenger; Lawrence A. ; et al.	2007-06-28
Method For Reducing Film Stress For Sicoh Low-k Dielectric Materials App 20070117408 - Nguyen; Son Van ; et al.	2007-05-24
Method and structure for determining thermal cycle reliability App 20060273460 - Filippi; Ronald Gene ; et al.	2006-12-07
Crackstop with release layer for crack control in semiconductors Grant 7,109,093 - Fitzsimmons , et al. September 19, 2	2006-09-19
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer Grant 7,102,232 - Clevenger , et al. September 5, 2	2006-09-05
Method and structure for determining thermal cycle reliability Grant 7,098,054 - Filippi , et al. August 29, 2	2006-08-29
Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor Grant 7,098,676 - Landers , et al. August 29, 2	2006-08-29
Building metal pillars in a chip for structure support App 20060190846 - Hichri; Habib ; et al.	2006-08-24
Building metal pillars in a chip for structure support Grant 7,067,902 - Hichri , et al. June 27, 2	2006-06-27
Hardmask for improved reliability of silicon based dielectrics App 20060091559 - Nguyen; Son Van ; et al.	2006-05-04
Control of liner thickness for improving thermal cycle reliability App 20060027842 - Filippi; Ronald Gene ; et al.	2006-02-09
Control of liner thickness for improving thermal cycle reliability Grant 6,989,282 - Filippi , et al. January 24, 2	2006-01-24
Stacked via-stud with improved reliability in copper metallurgy App 20060014376 - Agarwala; Birendra N. ; et al.	2006-01-19
Reliability of low-k dielectric devices with energy dissipative layer App 20060012014 - Chen; Shyng-Tsong T. ; et al.	2006-01-19
Process For Interfacial Adhesion In Laminate Structures Through Patterned Roughing Of A Surface App 20050277266 - Cooney, Edward C. III ; et al.	2005-12-15
Stacked via-stud with improved reliability in copper metallurgy Grant 6,972,209 - Agarwala , et al. December 6, 2	2005-12-06
Structure to improve adhesion between top CVD low-k dielectiric and dielectric capping layer App 20050230831 - Clevenger, Lawrence A. ; et al.	2005-10-20
Control of liner thickness for improving thermal cycle reliability App 20050227380 - Filippi, Ronald Gene ; et al.	2005-10-13
Crackstop With Release Layer For Crack Control In Semiconductors App 20050208781 - Fitzsimmons, John A. ; et al.	2005-09-22
Method and structure for determining thermal cycle reliability App 20050186689 - Filippi, Ronald Gene ; et al.	2005-08-25
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20050167838 - Edelstein, Daniel C. ; et al.	2005-08-04
Building metal pillars in a chip for structure support App 20050118803 - Hichri, Habib ; et al.	2005-06-02
Tuneable ferroelectric decoupling capacitor Grant 6,888,714 - Shaw , et al. May 3, 2	2005-05-03
Method of extracting properties of back end of line (BEOL) chip architecture App 20050086628 - Filippi, Ronald G. JR. ; et al.	2005-04-21
Gas treatment of thin film structures with catalytic action Grant 6,815,343 - Baniecki , et al. November 9, 2	2004-11-09
Multi-functional structure for enhanced chip manufacturibility & reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor App 20040129938 - Landers, William F. ; et al.	2004-07-08
Gas treatment of thin film structures with catalytic action App 20040126939 - Baniecki, John D. ; et al.	2004-07-01
Stacked via-stud with improved reliability in copper metallurgy App 20040101663 - Agarwala, Birendra N. ; et al.	2004-05-27
Tuneable ferroelectric decoupling capacitor App 20030112578 - Shaw, Thomas M. ; et al.	2003-06-19
Process for producing metal interconnections and product produced thereby Grant 6,417,572 - Chidambarrao , et al. July 9, 2	2002-07-09
Electromigration resistant power distribution network Grant 6,202,191 - Filippi , et al. March 13, 2	2001-03-13
Process for producing ceramic circuit structures having conductive vias Grant 5,337,475 - Aoude , et al. August 16, 1	1994-08-16
Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates Grant 5,283,104 - Aoude , et al. February 1, 1	1994-02-01