| Patent | Date |
|---|
Rounded Metal Trace Corner For Stress Reduction
App 20220285306 - KIM; Dae-Woo ; et al. | 2022-09-08 |
Embedded very high density (VHD) layer
Grant 11,387,187 - Collins , et al. July 12, 2 | 2022-07-12 |
Rounded metal trace corner for stress reduction
Grant 11,380,643 - Kim , et al. July 5, 2 | 2022-07-05 |
Silicon Groove Architectures And Manufacturing Processes For Passive Alignment In A Photonics Die
App 20220196940 - KARHADE; Omkar ; et al. | 2022-06-23 |
Device, method and system for providing recessed interconnect structures of a substrate
Grant 11,355,427 - Loo , et al. June 7, 2 | 2022-06-07 |
High Bandwidth Optical Interconnection Architectures
App 20220155539 - PIETAMBARAM; Srinivas V. ; et al. | 2022-05-19 |
Horizontal Pitch Translation Using Embedded Bridge Dies
App 20220157706 - SHARAN; Sujit ; et al. | 2022-05-19 |
EMIB copper layer for signal and power routing
Grant 11,322,445 - Mekonnen , et al. May 3, 2 | 2022-05-03 |
Guard Ring Design Enabling In-line Testing Of Silicon Bridges For Semiconductor Packages
App 20220130743 - SARKAR; Arnab ; et al. | 2022-04-28 |
Enabling Long Interconnect Bridges
App 20220130763 - Mahajan; Ravindranath V. ; et al. | 2022-04-28 |
Horizontal pitch translation using embedded bridge dies
Grant 11,276,635 - Sharan , et al. March 15, 2 | 2022-03-15 |
Capacitor Die Embedded In Package Substrate For Providing Capacitance To Surface Mounted Die
App 20220059476 - COLLINS; Andrew ; et al. | 2022-02-24 |
Guard ring design enabling in-line testing of silicon bridges for semiconductor packages
Grant 11,257,743 - Sarkar , et al. February 22, 2 | 2022-02-22 |
Enabling long interconnect bridges
Grant 11,222,847 - Mahajan , et al. January 11, 2 | 2022-01-11 |
Low-inductance current paths for on-package power distributions and methods of assembling same
Grant 11,222,837 - Collins , et al. January 11, 2 | 2022-01-11 |
Capacitor die embedded in package substrate for providing capacitance to surface mounted die
Grant 11,195,805 - Collins , et al. December 7, 2 | 2021-12-07 |
Emib Copper Layer For Signal And Power Routing
App 20210296240 - Mekonnen; Yidnekachew S. ; et al. | 2021-09-23 |
Emib Architecture With Dedicated Metal Layers For Improving Power Delivery
App 20210280518 - XIE; Jianyong ; et al. | 2021-09-09 |
Signal routing carrier
Grant 11,114,394 - Wang , et al. September 7, 2 | 2021-09-07 |
Passive components in vias in a stacked integrated circuit package
Grant 11,031,288 - Sharan , et al. June 8, 2 | 2021-06-08 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20210134726 - BRAUNISCH; Henning ; et al. | 2021-05-06 |
Metal-free Frame Design For Silicon Bridges For Semiconductor Packages
App 20210125942 - KIM; Dae-Woo ; et al. | 2021-04-29 |
Projecting contacts and method for making the same
Grant 10,978,423 - Kim , et al. April 13, 2 | 2021-04-13 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,923,429 - Braunisch , et al. February 16, 2 | 2021-02-16 |
Signal Routing Carrier
App 20210043588 - Wang; Lijiang ; et al. | 2021-02-11 |
Metal-free frame design for silicon bridges for semiconductor packages
Grant 10,916,514 - Kim , et al. February 9, 2 | 2021-02-09 |
Rounded Metal Trace Corner For Stress Reduction
App 20200402940 - KIM; Dae-Woo ; et al. | 2020-12-24 |
Substrateless Double-sided Embedded Multi-die Interconnect Bridge
App 20200395300 - Xie; Biancun ; et al. | 2020-12-17 |
Horizontal Pitch Translation Using Embedded Bridge Dies
App 20200381350 - SHARAN; Sujit ; et al. | 2020-12-03 |
Interconnect Hub For Dies
App 20200373235 - COLLINS; Andrew ; et al. | 2020-11-26 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20200357747 - BRAUNISCH; Henning ; et al. | 2020-11-12 |
Package Design Scheme For Enabling High-speed Low-loss Signaling And Mitigation Of Manufacturing Risk And Cost
App 20200343202 - WANG; Lijiang ; et al. | 2020-10-29 |
Rounded metal trace corner for stress reduction
Grant 10,797,014 - Kim , et al. October 6, 2 | 2020-10-06 |
Nested Architectures For Enhanced Heterogeneous Integration
App 20200286814 - MAHAJAN; Ravindranath ; et al. | 2020-09-10 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,763,216 - Braunisch , et al. Sep | 2020-09-01 |
Low-inductance Current Paths For On-package Power Distributions And Methods Of Assembling Same
App 20200235048 - Collins; Andrew ; et al. | 2020-07-23 |
Low-inductance current paths for on-package power distributions and methods of assembling same
Grant 10,651,117 - Collins , et al. | 2020-05-12 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20200075493 - BRAUNISCH; Henning ; et al. | 2020-03-05 |
Metal-free Frame Design For Silicon Bridges For Semiconductor Packages
App 20200013734 - KIM; Dae-Woo ; et al. | 2020-01-09 |
Multilevel Die Complex With Integrated Discrete Passive Components
App 20200006302 - Collins; Andrew P. ; et al. | 2020-01-02 |
Embedded Very High Density (vhd) Layer
App 20200006236 - Collins; Andrew Paul ; et al. | 2020-01-02 |
Low-inductance Current Paths For On-package Power Distributions And Methods Of Assembling Same
App 20190393142 - Collins; Andrew ; et al. | 2019-12-26 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 10,510,669 - Braunisch , et al. Dec | 2019-12-17 |
Guard Ring Design Enabling In-line Testing Of Silicon Bridges For Semiconductor Packages
App 20190371719 - SARKAR; Arnab ; et al. | 2019-12-05 |
Via architecture for increased density interface
Grant 10,475,736 - Aleksov , et al. Nov | 2019-11-12 |
Metal-free frame design for silicon bridges for semiconductor packages
Grant 10,461,047 - Kim , et al. Oc | 2019-10-29 |
Enabling Long Interconnect Bridges
App 20190318993 - Mahajan; Ravindranath V. ; et al. | 2019-10-17 |
Capacitor Die Embedded In Package Substrate For Providing Capacitance To Surface Mounted Die
App 20190304935 - COLLINS; Andrew ; et al. | 2019-10-03 |
Guard ring design enabling in-line testing of silicon bridges for semiconductor packages
Grant 10,418,312 - Sarkar , et al. Sept | 2019-09-17 |
Self Aligned Sort Probe Card For Si Bridge Wafer
App 20190271721 - KIM; Dae-Woo ; et al. | 2019-09-05 |
Bridge Hub Tiling Architecture
App 20190206798 - COLLINS; ANDREW P. ; et al. | 2019-07-04 |
Passive Components In Vias In A Stacked Integrated Circuit Package
App 20190157152 - SHARAN; Sujit ; et al. | 2019-05-23 |
Rounded Metal Trace Corner For Stress Reduction
App 20190157232 - Kim; Dae-Wood ; et al. | 2019-05-23 |
Device, Method And System For Providing Recessed Interconnect Structures Of A Substrate
App 20190131227 - LOO; Howe Yin ; et al. | 2019-05-02 |
Alternative Surfaces For Conductive Pad Layers Of Silicon Bridges For Semiconductor Packages
App 20190131229 - KIM; Dae-Woo ; et al. | 2019-05-02 |
Via Architecture For Increased Density Interface
App 20190096798 - Aleksov; Aleksandar ; et al. | 2019-03-28 |
Passive components in vias in a stacked integrated circuit package
Grant 10,236,209 - Sharan , et al. | 2019-03-19 |
Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages
Grant 10,177,083 - Kim , et al. J | 2019-01-08 |
Projecting Contacts And Method For Making The Same
App 20180366438 - Kim; Dae-Woo ; et al. | 2018-12-20 |
Guard Ring Design Enabling In-line Testing Of Silicon Bridges For Semiconductor Packages
App 20180226331 - SARKAR; Arnab ; et al. | 2018-08-09 |
Metal-free Frame Design For Silicon Bridges For Semiconductor Packages
App 20180226364 - KIM; Dae-Woo ; et al. | 2018-08-09 |
Alternative Surfaces For Conductive Pad Layers Of Silicon Bridges For Semiconductor Packages
App 20180226330 - KIM; Dae-Woo ; et al. | 2018-08-09 |
Magnetic alignment for flip chip microelectronic devices
Grant 10,002,824 - Agrawal , et al. June 19, 2 | 2018-06-19 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20180145031 - BRAUNISCH; Henning ; et al. | 2018-05-24 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 9,875,969 - Braunisch , et al. January 23, 2 | 2018-01-23 |
Magnetic Alignment For Flip Chip Microelectronic Devices
App 20170278783 - Agrawal; Ankur ; et al. | 2017-09-28 |
Magnetic alignment for flip chip microelectronic devices
Grant 9,711,443 - Agrawal , et al. July 18, 2 | 2017-07-18 |
Magnetic Alignment For Flip Chip Microelectronic Devices
App 20170141021 - Agrawal; Ankur ; et al. | 2017-05-18 |
Passive Components In Vias In A Stacked Integrated Circuit Package
App 20160190113 - SHARAN; SUJIT ; et al. | 2016-06-30 |
Silicon Space Transformer For Ic Packaging
App 20160133589 - Mallik; Debendra ; et al. | 2016-05-12 |
Package substrate and die spacer layers having a ceramic backbone
Grant 9,258,880 - Aleksov , et al. February 9, 2 | 2016-02-09 |
Silicon Space Transformer For Ic Packaging
App 20150001732 - Mallik; Debendra ; et al. | 2015-01-01 |
Package substrate and die spacer layers having a ceramic backbone
App 20130341076 - Aleksov; Aleksandar ; et al. | 2013-12-26 |
Package substrate and die spacer layers having a ceramic backbone
Grant 8,604,353 - Aleksov , et al. December 10, 2 | 2013-12-10 |
Multi-chip Package And Method Of Providing Die-to-die Interconnects In Same
App 20120261838 - Braunisch; Henning ; et al. | 2012-10-18 |
Multi-chip package and method of providing die-to-die interconnects in same
Grant 8,227,904 - Braunisch , et al. July 24, 2 | 2012-07-24 |
Package substrate and die spacer layers having a ceramic backbone
App 20120152601 - Aleksov; Aleksandar ; et al. | 2012-06-21 |
Method for fabricating package substrate and die spacer layers having a ceramic backbone
Grant 8,186,051 - Aleksov , et al. May 29, 2 | 2012-05-29 |
First-level interconnects with slender columns, and processes of forming same
App 20110122592 - Ganesan; Sanka ; et al. | 2011-05-26 |
Multi-chip package and method of providing die-to-die interconnects in same
App 20100327424 - Braunisch; Henning ; et al. | 2010-12-30 |
C4 joint reliability
Grant 7,656,035 - Agraharam , et al. February 2, 2 | 2010-02-02 |
Method of forming a crystalline phase material
Grant 7,625,641 - Sandhu , et al. December 1, 2 | 2009-12-01 |
Package substrate and die spacer layers having a ceramic backbone
App 20090242247 - Aleksov; Aleksandar ; et al. | 2009-10-01 |
C4 Joint Reliability
App 20090115057 - Agraharam; Sairam ; et al. | 2009-05-07 |
Electrochemical mechanical planarization
Grant 7,527,722 - Sharan May 5, 2 | 2009-05-05 |
C4 joint reliability
Grant 7,517,787 - Agraharam , et al. April 14, 2 | 2009-04-14 |
Chemical vapor deposition apparatus and deposition method
Grant 7,468,104 - Mardian , et al. December 23, 2 | 2008-12-23 |
Methods Of Forming Highly Oriented Diamond Films And Structures Formed Thereby
App 20080237718 - Noveski; Vladimir ; et al. | 2008-10-02 |
Microelectronic package and method of manufacturing same
App 20080237844 - Aleksov; Aleksandar ; et al. | 2008-10-02 |
High aspect ratio contact structure with reduced silicon consumption
Grant 7,402,512 - Derraa , et al. July 22, 2 | 2008-07-22 |
Methods of forming low resistivity contact for an integrated circuit device
Grant 7,341,931 - Sharan , et al. March 11, 2 | 2008-03-11 |
Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants
Grant 7,268,078 - Iyer , et al. September 11, 2 | 2007-09-11 |
Protective layer during scribing
Grant 7,265,032 - Sharan , et al. September 4, 2 | 2007-09-04 |
System and method for detecting flow in a mass flow controller
Grant 7,255,128 - Sandhu , et al. August 14, 2 | 2007-08-14 |
Chemical vapor deposition method
Grant 7,229,666 - Mardian , et al. June 12, 2 | 2007-06-12 |
Methods of forming silicon dioxide layers, and methods of forming trench isolation regions
Grant 7,211,499 - Sharan , et al. May 1, 2 | 2007-05-01 |
Method for PECVD deposition of selected material films
Grant 7,196,020 - Sharan , et al. March 27, 2 | 2007-03-27 |
Wafer cleaning brush
Grant 7,185,384 - Sun , et al. March 6, 2 | 2007-03-06 |
Semiconductor processing methods of forming and utilizing antireflective material layers, and methods of forming transistor gate stacks
Grant 7,151,054 - Sandhu , et al. December 19, 2 | 2006-12-19 |
Method of forming a crystalline phase material
App 20060243194 - Sandhu; Gurtej S. ; et al. | 2006-11-02 |
System And Method For Detecting Flow In A Mass Flow Controller
App 20060219031 - Sandhu; Gurtej Singh ; et al. | 2006-10-05 |
System And Method For Detecting Flow In A Mass Flow Controller
App 20060223204 - Sandhu; Gurtej Singh ; et al. | 2006-10-05 |
System And Method For Detecting Flow In A Mass Flow Controller
App 20060218762 - Sandhu; Gurtej Singh ; et al. | 2006-10-05 |
System and method for detecting flow in a mass flow controller
Grant 7,114,404 - Sandhu , et al. October 3, 2 | 2006-10-03 |
C4 joint reliability
App 20060214292 - Agraharam; Sairam ; et al. | 2006-09-28 |
Methods of forming silicon dioxide layers, and methods of forming trench isolation regions
App 20060205175 - Sharan; Sujit ; et al. | 2006-09-14 |
Metal silicide adhesion layer for contact structures
App 20060202283 - Deraa; Ammar ; et al. | 2006-09-14 |
Method For Pecvd Deposition Of Selected Material Films
App 20060193996 - Sharan; Sujit ; et al. | 2006-08-31 |
Method for PECVD deposition of selected material films
Grant 7,093,559 - Sharan , et al. August 22, 2 | 2006-08-22 |
Method of forming a refractory metal silicide
Grant 7,087,111 - Sandhu , et al. August 8, 2 | 2006-08-08 |
Integrated circuits having low resistivity contacts and the formation thereof using an in situ plasma doping and clean
App 20060166507 - Sharan; Sujit ; et al. | 2006-07-27 |
Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants
App 20060134912 - Iyer; Ravi ; et al. | 2006-06-22 |
Wafer cleaning brush
App 20060096049 - Sun; Yuxia ; et al. | 2006-05-11 |
Chemistry for chemical vapor deposition of titanium containing films
Grant 7,033,939 - Sharan , et al. April 25, 2 | 2006-04-25 |
Method of forming a conductive contact
Grant 7,022,618 - Sharan , et al. April 4, 2 | 2006-04-04 |
Methods of forming silicon dioxide layers, and methods of forming trench isolation regions
Grant 7,018,908 - Sharan , et al. March 28, 2 | 2006-03-28 |
Methods of forming an electrically conductive line
Grant 6,977,221 - Sandhu , et al. December 20, 2 | 2005-12-20 |
Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants
Grant 6,977,225 - Iyer , et al. December 20, 2 | 2005-12-20 |
Silicon wafer with soluble protective coating
Grant 6,974,726 - Dani , et al. December 13, 2 | 2005-12-13 |
High aspect ratio contact structure with reduced silicon consumption
App 20050233577 - Derraa, Ammar ; et al. | 2005-10-20 |
Methods and apparatus for laser dicing
App 20050221586 - Mulligan, Rose A. ; et al. | 2005-10-06 |
Methods of forming coatings on gas-dispersion fixtures in chemical-vapor-deposition systems
Grant 6,949,273 - Sharan September 27, 2 | 2005-09-27 |
Methods of forming a refractory metal silicide
Grant 6,943,107 - Sandhu , et al. September 13, 2 | 2005-09-13 |
Integrated circuits having low resistivity contacts and the formation thereof using an in situ plasma doping and clean
Grant 6,921,708 - Sharan , et al. July 26, 2 | 2005-07-26 |
Silicon wafer with soluable protective coating
App 20050139962 - Dani, Ashay A. ; et al. | 2005-06-30 |
Methods and apparatus for laser dicing
App 20050136622 - Mulligan, Rose A. ; et al. | 2005-06-23 |
High aspect ratio contact structure with reduced silicon consumption
Grant 6,908,849 - Derraa , et al. June 21, 2 | 2005-06-21 |
Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity
Grant 6,905,397 - Sharan June 14, 2 | 2005-06-14 |
Method of forming refractory metal silicide
App 20050109271 - Sandhu, Gurtej S. ; et al. | 2005-05-26 |
Method of forming a crystalline phase material
Grant 6,884,716 - Sandhu , et al. April 26, 2 | 2005-04-26 |
Plasma enhanced chemical vapor deposition methods and semiconductor processing methods of forming layers and shallow trench isolation regions
App 20050079731 - Sharan, Sujit ; et al. | 2005-04-14 |
Protective layer during scribing
App 20050070095 - Sharan, Sujit ; et al. | 2005-03-31 |
High aspect ratio contact structure with reduced silicon consumption
Grant 6,858,904 - Derraa , et al. February 22, 2 | 2005-02-22 |
Chemical vapor deposition method
App 20050028732 - Mardian, Allen P. ; et al. | 2005-02-10 |
High aspect ratio contact structure with reduced silicon consumption
App 20050032361 - Derraa, Ammar ; et al. | 2005-02-10 |
Chemistry for chemical vapor deposition of titanium containing films
App 20050020067 - Sharan, Sujit ; et al. | 2005-01-27 |
Methods of forming a refractory metal silicide
App 20050009338 - Sandhu, Gurtej S. ; et al. | 2005-01-13 |
Method of forming a refractory metal silicide
Grant 6,841,474 - Sandhu , et al. January 11, 2 | 2005-01-11 |
Methods of forming an electrically conductive line
App 20040266187 - Sandhu, Gurtej S. ; et al. | 2004-12-30 |
Methods of forming an electrically conductive line
Grant 6,835,654 - Sandhu , et al. December 28, 2 | 2004-12-28 |
Methods of forming coatings on gas-dispersion fixtures in chemical-vapor-deposition systems
App 20040234705 - Sharan, Sujit | 2004-11-25 |
Boron-doped titanium nitride layer for high aspect ratio semiconductor devices
Grant 6,822,299 - Derraa , et al. November 23, 2 | 2004-11-23 |
Methods of forming an electrically conductive line
Grant 6,815,344 - Sandhu , et al. November 9, 2 | 2004-11-09 |
Integrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufacture
Grant 6,812,512 - Prall , et al. November 2, 2 | 2004-11-02 |
Methods of forming conductive interconnects
Grant 6,800,517 - Sandhu , et al. October 5, 2 | 2004-10-05 |
Semiconductor processing methods of forming and utilizing antireflective material layers, and methods of forming transistor gate stacks
App 20040180537 - Sandhu, Gurtej S. ; et al. | 2004-09-16 |
Methods of forming silicon dioxide layers, and methods of forming trench isolation regions
App 20040180558 - Sharan, Sujit ; et al. | 2004-09-16 |
Diffusion barrier layer for semiconductor wafer fabrication
Grant 6,791,149 - Derraa , et al. September 14, 2 | 2004-09-14 |
Methods of forming conductive interconnects
App 20040166622 - Sandhu, Gurtej S. ; et al. | 2004-08-26 |
Chemistry for chemical vapor deposition of titanium containing films
Grant 6,777,330 - Sharan , et al. August 17, 2 | 2004-08-17 |
Method of forming a crystalline phase material
Grant 6,773,502 - Sandhu , et al. August 10, 2 | 2004-08-10 |
Methods of forming silicon dioxide layers and methods of forming trench isolation regions
Grant 6,759,306 - Sharan , et al. July 6, 2 | 2004-07-06 |
Combined gate cap or digit line and spacer deposition using HDP
Grant 6,756,293 - Li , et al. June 29, 2 | 2004-06-29 |
Methods of forming coatings on gas-dispersion fixtures in chemical-vapor-deposition systems
Grant 6,756,088 - Sharan June 29, 2 | 2004-06-29 |
Device for in-situ cleaning of an inductively-coupled plasma chambers
Grant 6,749,717 - Sandhu , et al. June 15, 2 | 2004-06-15 |
Methods of forming conductive interconnects
Grant 6,750,089 - Sandhu , et al. June 15, 2 | 2004-06-15 |
Diffusion barrier layer for semiconductor wafer fabrication
Grant 6,746,952 - Derraa , et al. June 8, 2 | 2004-06-08 |
Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants
App 20040097073 - Iyer, Ravi ; et al. | 2004-05-20 |
Methods of forming silicon dioxide layers, and methods of forming trench isolation regions
Grant 6,737,328 - Sharan , et al. May 18, 2 | 2004-05-18 |
Semiconductor processing methods of forming an utilizing antireflective material layers, and methods of forming transistor gate stacks
Grant 6,727,173 - Sandhu , et al. April 27, 2 | 2004-04-27 |
Electrochemical mechanical planarization
App 20040060814 - Sharan, Sujit | 2004-04-01 |
Method of forming a conductive contact
App 20040063314 - Sharan, Sujit ; et al. | 2004-04-01 |
System and method for detecting flow in a mass flow controller
App 20040063231 - Sandhu, Gurtej Singh ; et al. | 2004-04-01 |
Method of forming a crystalline phase material
Grant 6,706,116 - Sandhu , et al. March 16, 2 | 2004-03-16 |
RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition
Grant 6,705,246 - Sharan , et al. March 16, 2 | 2004-03-16 |
Electrochemical mechanical planarization
Grant 6,706,158 - Sharan March 16, 2 | 2004-03-16 |
Wafer cleaning brush
App 20040040576 - Sun, Yuxia ; et al. | 2004-03-04 |
Titanium boronitride layer for high aspect ratio semiconductor devices
Grant 6,696,368 - Derraa , et al. February 24, 2 | 2004-02-24 |
Integrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufacture
Grant 6,686,288 - Prall , et al. February 3, 2 | 2004-02-03 |
Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants
Grant 6,653,234 - Iyer , et al. November 25, 2 | 2003-11-25 |
Chemical vapor deposition apparatus and deposition method
App 20030215569 - Mardian, Allen P. ; et al. | 2003-11-20 |
Integrated circuits having low resistivity contacts and the formation thereof using an in situ plasma doping and clean
Grant 6,642,620 - Sharan , et al. November 4, 2 | 2003-11-04 |
System and method for detecting flow in a mass flow controller
Grant 6,627,465 - Sandhu , et al. September 30, 2 | 2003-09-30 |
Chemical Vapor Deposition Of Titanium From Titanium Tetrachloride And Hydrocarbon Reactants
App 20030162390 - Iyer, Ravi ; et al. | 2003-08-28 |
Method of forming a conductive contact on a substrate and method of processing a semiconductor substrate using an ozone treatment
Grant 6,602,785 - Sharan , et al. August 5, 2 | 2003-08-05 |
Contact with germanium layer
Grant 6,597,042 - Honeycutt , et al. July 22, 2 | 2003-07-22 |
Combined gate cap or digit line and spacer deposition using HDP
App 20030124872 - Li, Weimin ; et al. | 2003-07-03 |
Methods of forming conductive interconnects
App 20030119244 - Sandhu, Gurtej S. ; et al. | 2003-06-26 |
Methods of forming an electrically conductive line
App 20030119241 - Sandhu, Gurtej S. ; et al. | 2003-06-26 |
Method of forming a crystalline phase material
App 20030095910 - Sandhu, Gurtej S. ; et al. | 2003-05-22 |
Boron-doped titanium nitride layer for high aspect ratio semiconductor devices
App 20030075802 - Derraa, Ammar ; et al. | 2003-04-24 |
Diffusion barrier layer for semiconductor wafer fabrication
App 20030077895 - Derraa, Ammar ; et al. | 2003-04-24 |
Method of forming a crystalline phase material
App 20030073305 - Sandhu, Gurtej S. ; et al. | 2003-04-17 |
Electrochemical mechanical planarization
App 20030062269 - Sharan, Sujit | 2003-04-03 |
Diffusion barrier layer for semiconductor wafer fabrication
App 20030042607 - Derraa, Ammar ; et al. | 2003-03-06 |
High aspect ratio contact structure with reduced silicon consumption
App 20030042550 - Derraa, Ammar ; et al. | 2003-03-06 |
System and method for detecting flow in a mass flow controller
App 20030045011 - Sandhu, Gurtej Singh ; et al. | 2003-03-06 |
Metal silicide adhesion layer for contact structures
App 20030042614 - Deraa, Ammar ; et al. | 2003-03-06 |
Combined gate cap or digit line and spacer deposition using HDP
Grant 6,524,975 - Li , et al. February 25, 2 | 2003-02-25 |
Boron-doped titanium nitride layer for high aspect ratio semiconductor devices
App 20030025206 - Derraa, Ammar ; et al. | 2003-02-06 |
Plasma Etching Process
App 20030015496 - SHARAN, SUJIT ; et al. | 2003-01-23 |
Quasi-remote plasma processing method and apparatus
Grant 6,499,425 - Sandhu , et al. December 31, 2 | 2002-12-31 |
Apparatus for enhanced rate chemcial mechanical polishing with adjustable selectivity
App 20020193050 - Sharan, Sujit | 2002-12-19 |
Plasma enhanced chemical vapor deposition process
Grant 6,468,925 - Campbell , et al. October 22, 2 | 2002-10-22 |
Method of forming a crystalline phase material
App 20020146905 - Sandhu, Gurtej S. ; et al. | 2002-10-10 |
Chemistry for chemical vapor deposition of titanium containing films
App 20020132475 - Sharan, Sujit ; et al. | 2002-09-19 |
Methods of forming coatings on gas-dispersion fixtures in chemical-vapor-deposition systems
App 20020094371 - Sharan, Sujit | 2002-07-18 |
Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity
App 20020081950 - Sharan, Sujit | 2002-06-27 |
Combined gate cap or digit line and spacer deposition using HDP
App 20020076947 - Li, Weimin ; et al. | 2002-06-20 |
Method of Forming an Electrically Conductive Line
App 20020072232 - Sandhu, Gurtej S. ; et al. | 2002-06-13 |
RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition
App 20020061656 - Sharan, Sujit ; et al. | 2002-05-23 |
RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition
App 20020056416 - Sharan, Sujit ; et al. | 2002-05-16 |
Plasma enhanced chemical vapor deposition process
App 20020048963 - Campbell, Philip H. ; et al. | 2002-04-25 |
Plasma etching process and semiconductor plasma etching process
App 20020040885 - Sharan, Sujit ; et al. | 2002-04-11 |
Chemical vapor deposition process of depositing a material over a semiconductor substrate and method of forming a conductive contact
App 20020040886 - Sharan, Sujit ; et al. | 2002-04-11 |
Combined gate cap or digit line and spacer deposition using HDP
Grant 6,368,988 - Li , et al. April 9, 2 | 2002-04-09 |
Method Of Forming A Refractory Metal Silicide
App 20020028577 - SANDHU, GURTEJ S. ; et al. | 2002-03-07 |
Chemistry For Chemical Vapor Deposition Of Titanium Containing Films
App 20020013050 - SHARAN, SUJIT ; et al. | 2002-01-31 |
Contact structure having a diffusion barrier
App 20020000660 - Sharan, Sujit ; et al. | 2002-01-03 |
Method of VLSI contact, trench, and via filling using a germanium underlayer with metallization
Grant 6,331,482 - Honeycutt , et al. December 18, 2 | 2001-12-18 |
Semiconductor processing methods of forming and utilizing antireflective material layers, and methods of forming transistor gate stacks
App 20010044221 - Sandhu, Gurtej S. ; et al. | 2001-11-22 |
Method for PECVD deposition of selected material films
Grant 6,291,341 - Sharan , et al. September 18, 2 | 2001-09-18 |
Method of forming DRAM trench capacitor with metal layer over hemispherical grain polysilicon
Grant 6,291,289 - Rhodes , et al. September 18, 2 | 2001-09-18 |
Integrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufacture
App 20010019893 - Prall, Kirk ; et al. | 2001-09-06 |
Method for PECVD deposition of selected material films
App 20010019889 - Sharan, Sujit ; et al. | 2001-09-06 |
Method for forming a contact having a diffusion barrier
Grant 6,284,651 - Sharan , et al. September 4, 2 | 2001-09-04 |
Method for PECVD deposition of selected material films
App 20010018268 - Sharan, Sujit ; et al. | 2001-08-30 |
Method for PECVD deposition of selected material films
App 20010018269 - Sharan, Sujit ; et al. | 2001-08-30 |
Method Of Forming Dram Trench Capacitor With Metal Layer Over Hemispherical Grain Polysilicon
App 20010012656 - RHODES, HOWARD E. ; et al. | 2001-08-09 |
Semiconductor processing methods of forming and utilizing antireflective material layers, and methods of forming transistor gate stacks
Grant 6,268,282 - Sandhu , et al. July 31, 2 | 2001-07-31 |
Method of forming titanium silicide and titanium by chemical vapor deposition and resulting apparatus
App 20010006240 - Doan, Trung T. ; et al. | 2001-07-05 |
Methods of forming a contact having titanium silicide and titanium formed by chemical vapor deposition
Grant 6,255,216 - Doan , et al. July 3, 2 | 2001-07-03 |
Rf Powered Plasma Enhanced Chemical Vapor Deposition Reactor And Methods Of Effecting Plasma Enhanced Chemical Vapor Deposition
App 20010003270 - SHARAN, SUJIT ; et al. | 2001-06-14 |
RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition
Grant 6,235,646 - Sharan , et al. May 22, 2 | 2001-05-22 |
Capacitor Structures
App 20010001210 - Rhodes, Howard E. ; et al. | 2001-05-17 |
Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants
App 20010000761 - Iyer, Ravi ; et al. | 2001-05-03 |
Apparatus having titanium silicide and titanium formed by chemical vapor deposition
Grant 6,208,033 - Doan , et al. March 27, 2 | 2001-03-27 |
Low dielectric constant dielectric films and process for making the same
Grant 6,140,249 - Sharan October 31, 2 | 2000-10-31 |
RF powered plasma enhanced chemical vapor deposition reactor and methods
Grant 6,112,697 - Sharan , et al. September 5, 2 | 2000-09-05 |
Method of forming field emission devices
Grant 6,086,442 - Sandhu , et al. July 11, 2 | 2000-07-11 |
Semiconductor processing method of forming a conductively doped semiconductive material plug within a contact opening
Grant 6,067,680 - Pan , et al. May 30, 2 | 2000-05-30 |
Method of increasing capacitance of memory cells incorporating hemispherical grained silicon
Grant 6,027,970 - Sharan , et al. February 22, 2 | 2000-02-22 |
Method of forming a crystalline phase material
Grant 5,997,634 - Sandhu , et al. December 7, 1 | 1999-12-07 |
Integrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufacture
Grant 5,990,021 - Prall , et al. November 23, 1 | 1999-11-23 |
Facet etch for improved step coverage of integrated circuit contacts
Grant 5,985,767 - Roberts , et al. November 16, 1 | 1999-11-16 |
Method of forming an electrically conductive contact plug, method of forming a reactive or diffusion barrier layer over a substrate, integrated circuitry, and method of forming a layer of titanium boride
Grant 5,977,636 - Sharan November 2, 1 | 1999-11-02 |
Method of forming titanium silicide and titanium by chemical vapor deposition
Grant 5,976,976 - Doan , et al. November 2, 1 | 1999-11-02 |
Removal of metal cusp for improved contact fill
Grant 5,929,526 - Srinivasan , et al. July 27, 1 | 1999-07-27 |
Methods of forming a silicon nitride film, a capacitor dielectric layer and a capacitor
Grant 5,882,978 - Srinivasan , et al. March 16, 1 | 1999-03-16 |
Low cost DRAM metallization
Grant 5,846,881 - Sandhu , et al. December 8, 1 | 1998-12-08 |
Field effect transistors comprising electrically conductive plugs having monocrystalline and polycrystalline silicon
Grant 5,831,334 - Prall , et al. November 3, 1 | 1998-11-03 |
Multiple species sputtering for improved bottom coverage and improved sputter rate
Grant 5,750,012 - Ireland , et al. May 12, 1 | 1998-05-12 |
Method of forming an electrical contact to a silicon substrate
Grant 5,747,116 - Sharan , et al. May 5, 1 | 1998-05-05 |
Apparatus and method to increase gas residence time in a reactor
Grant 5,735,960 - Sandhu , et al. April 7, 1 | 1998-04-07 |
Facet etch for improved step coverage of integrated circuit contacts
Grant 5,730,835 - Roberts , et al. March 24, 1 | 1998-03-24 |
Field effect transistor
Grant 5,677,573 - Prall , et al. October 14, 1 | 1997-10-14 |
Sacrificial CVD germanium layer for formation of high aspect ratio submicron VLSI contacts
Grant 5,644,166 - Honeycutt , et al. July 1, 1 | 1997-07-01 |
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