| Patent | Date |
|---|
Low cost high throughput processing platform
Grant 8,668,422 - Niewmierzycki , et al. March 11, 2 | 2014-03-11 |
Advanced low cost high throughput processing platform
Grant 7,658,586 - Niewmierzycki , et al. February 9, 2 | 2010-02-09 |
Low cost high throughput processing platform
Grant 7,563,068 - Niewmierzycki , et al. July 21, 2 | 2009-07-21 |
Apparatus for uniformly etching a dielectric layer
Grant 7,316,761 - Doan , et al. January 8, 2 | 2008-01-08 |
Low Cost High Throughput Processing Platform
App 20070175864 - Niewmierzycki; Leszek ; et al. | 2007-08-02 |
Temperature Controlled Semiconductor Processing Chamber Liner
App 20070091535 - Noorbakhsh; Hamid ; et al. | 2007-04-26 |
Low cost high throughput processing platform
App 20060045664 - Niewmierzycki; Leszek ; et al. | 2006-03-02 |
Advanced low cost high throughput processing platform
App 20060039781 - Niewmierzycki; Leszek ; et al. | 2006-02-23 |
Gas flow division in a wafer processing system having multiple chambers
Grant 6,913,652 - Shan July 5, 2 | 2005-07-05 |
Interferometric endpoint detection in a substrate etching process
Grant 6,905,624 - Frum , et al. June 14, 2 | 2005-06-14 |
Magnetic barrier for plasma in chamber exhaust
Grant 6,863,835 - Carducci , et al. March 8, 2 | 2005-03-08 |
Integrated low k dielectrics and etch stops
App 20050023694 - Bjorkman, Claes H. ; et al. | 2005-02-03 |
Highly selective process for etching oxide over nitride using hexafluorobutadiene
Grant 6,849,193 - Hung , et al. February 1, 2 | 2005-02-01 |
Interferometric endpoint detection in a substrate etching process
App 20050006341 - Frum, Coriolan I. ; et al. | 2005-01-13 |
Dielectric etch chamber with expanded process window
App 20050003675 - Carducci, James D. ; et al. | 2005-01-06 |
Monitoring substrate processing using reflected radiation
Grant 6,831,742 - Sui , et al. December 14, 2 | 2004-12-14 |
Monitoring dimensions of features at different locations in the processing of substrates
Grant 6,829,056 - Barnes , et al. December 7, 2 | 2004-12-07 |
Enhancement of silicon oxide etch rate and nitride selectivity using hexafluorobutadiene or other heavy perfluorocarbon
Grant 6,797,189 - Hung , et al. September 28, 2 | 2004-09-28 |
Magnetic barrier for plasma in chamber exhaust
Grant 6,773,544 - Carducci , et al. August 10, 2 | 2004-08-10 |
Apparatus for uniformly etching a dielectric layer
App 20040149394 - Doan, Kenny L. ; et al. | 2004-08-05 |
Method of etching a trench in a silicon-containing dielectric material
Grant 6,686,293 - Kim , et al. February 3, 2 | 2004-02-03 |
Promotion of independence between degree of dissociation of reactive gas and the amount of ionization of dilutant gas via diverse gas injection
App 20040011464 - Shan, Hongqing | 2004-01-22 |
Ashable layers for reducing critical dimensions of integrated circuit features
App 20030219988 - Shan, Hongqing ; et al. | 2003-11-27 |
Method Of Etching A Trench In A Silicon-containing Dielectric Material
App 20030211750 - Kim, Yunsang ; et al. | 2003-11-13 |
Magnetically enhanced plasma oxide etch using hexafluorobutadiene
Grant 6,613,689 - Liu , et al. September 2, 2 | 2003-09-02 |
Process for etching oxide using hexafluorobutadiene or related fluorocarbons and manifesting a wide process window
Grant 6,602,434 - Hung , et al. August 5, 2 | 2003-08-05 |
Energizing gas for substrate processing with shockwaves
App 20030141178 - Shan, Hongqing ; et al. | 2003-07-31 |
Dielectric etch chamber with expanded process window
App 20030038111 - Carducci, James D. ; et al. | 2003-02-27 |
Highly selective process for etching oxide over nitride using hexafluorobutadiene
App 20030000913 - Hung, Hoiman ; et al. | 2003-01-02 |
Enhancement Of Silicon Oxide Etch Rate And Nitride Selectivity Using Hexafluorobutadiene Or Other Heavy Perfluorocarbon
App 20020175144 - HUNG, HOIMAN(RAYMOND) ; et al. | 2002-11-28 |
Magnetically enhanced plasma oxide etch using hexafluorobutadiene
App 20020173162 - Liu, Jingbao ; et al. | 2002-11-21 |
Magnetically enhanced plasma etch process using a heavy fluorocarbon etching gas
Grant 6,451,703 - Liu , et al. September 17, 2 | 2002-09-17 |
Substrate cleaning process
Grant 6,440,864 - Kropewnicki , et al. August 27, 2 | 2002-08-27 |
Capacitively coupled reactive ion etch plasma reactor with overhead high density plasma source for chamber dry cleaning
App 20020101167 - Shan, Hongqing ; et al. | 2002-08-01 |
Intergrated low k dielectrics and etch stops
App 20020084257 - Bjorkman, Claes H. ; et al. | 2002-07-04 |
Integrated low k dielectrics and etch stops
App 20020074309 - Bjorkman, Claes H. ; et al. | 2002-06-20 |
Temperature controlled semiconductor processing chamber liner
App 20020069970 - Noorbakhsh, Hamid ; et al. | 2002-06-13 |
Process for etching oxide using a hexafluorobutadiene and manifesting a wide process window
Grant 6,387,287 - Hung , et al. May 14, 2 | 2002-05-14 |
Plasma pretreatment of photoresist in an oxide etch process
Grant 6,326,307 - Lindley , et al. December 4, 2 | 2001-12-04 |
Magnetic barrier for plasma in chamber exhaust
App 20010032591 - Carducci, James D. ; et al. | 2001-10-25 |
Magnetic barrier for plasma in chamber exhaust
App 20010032590 - Carducci, James D. ; et al. | 2001-10-25 |
Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing system
App 20010009139 - Shan, Hongqing ; et al. | 2001-07-26 |
Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing system
Grant 6,232,236 - Shan , et al. May 15, 2 | 2001-05-15 |
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