Seshan; Krishna

Patent Applications and Registrations

Patent applications and USPTO patent grants for Seshan; Krishna.The latest application filed is for "microelectronic die having electrical connections to allow testing of guard wall for damage and method of testing guard wall for damage".

Company Profile

0.43.29

Seshan; Krishna - San Jose CA
Seshan; Krishna - Santa Clara CA
Seshan; Krishna - Beacon NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same Grant 7,960,831 - Hua , et al. June 14, 2	2011-06-14
Power gridding scheme Grant 7,511,370 - Seshan March 31, 2	2009-03-31
Selectable decoupling capacitors for integrated circuits and associated methods Grant 7,425,458 - Seshan September 16, 2	2008-09-16
Isolation structure configurations for modifying stresses in semiconductor devices Grant 7,411,269 - Ma , et al. August 12, 2	2008-08-12
Isolation structure configurations for modifying stresses in semiconductor devices Grant 7,410,858 - Ma , et al. August 12, 2	2008-08-12
Microelectronic die having electrical connections to allow testing of guard wall for damage and method of testing guard wall for damage App 20080078994 - Seshan; Krishna	2008-04-03
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same Grant 7,314,819 - Hua , et al. January 1, 2	2008-01-01
Ball-limiting Metallurgies, Solder Bump Compositions Used Therewith, Packages Assembled Thereby, And Methods Of Assembling Same App 20070284741 - Hua; Fay ; et al.	2007-12-13
Method to make a weight compensating/tuning layer on a substrate Grant 7,262,070 - Doros , et al. August 28, 2	2007-08-28
Method of fabricating a linearized output driver and terminator Grant 7,250,333 - Dabral , et al. July 31, 2	2007-07-31
Frequency tuning of film bulk acoustic resonators (FBAR) App 20070139140 - Rao; Valluri R. ; et al.	2007-06-21
Semiconductor passivation deposition process for interfacial adhesion Grant 7,202,568 - Seshan , et al. April 10, 2	2007-04-10
Isolation structure configurations for modifying stresses in semiconductor devices App 20070013023 - Ma; Qing ; et al.	2007-01-18
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same App 20070004086 - Hua; Fay ; et al.	2007-01-04
Isolation structure configurations for modifying stresses in semiconductor devices App 20060220147 - Ma; Qing ; et al.	2006-10-05
Forming a cap above a metal layer App 20060180945 - Seshan; Krishna ; et al.	2006-08-17
Ball limiting metallurgy split into segments App 20060131748 - Seshan; Krishna	2006-06-22
Forming a cap above a metal layer Grant 7,056,817 - Seshan , et al. June 6, 2	2006-06-06
Method of forming segmented ball limiting metallurgy Grant 7,033,923 - Seshan April 25, 2	2006-04-25
Device with segmented ball limiting metallurgy Grant 7,034,402 - Seshan April 25, 2	2006-04-25
Diode and transistor design for high speed I/O Grant 7,012,304 - Dabral , et al. March 14, 2	2006-03-14
Power gridding scheme App 20060033211 - Seshan; Krishna	2006-02-16
Power gridding scheme App 20060033197 - Seshan; Krishna	2006-02-16
Power gridding scheme Grant 6,979,896 - Seshan December 27, 2	2005-12-27
Selectable decoupling capacitors for integrated circuits and associated methods App 20050247931 - Seshan, Krishna	2005-11-10
Selectable decoupling capacitors for integrated circuit and methods of use Grant 6,937,458 - Seshan August 30, 2	2005-08-30
Isolation structure configurations for modifying stresses in semiconductor devices App 20050179109 - Ma, Qing ; et al.	2005-08-18
Power gridding scheme Grant 6,930,379 - Seshan August 16, 2	2005-08-16
Method of forming segmented ball limiting metallurgy App 20050158980 - Seshan, Krishna	2005-07-21
Method for fabricating a moat around an active pixel area of a microelectronic image projection device Grant 6,914,658 - Seshan , et al. July 5, 2	2005-07-05
Isolation structure configurations for modifying stresses in semiconductor devices Grant 6,876,053 - Ma , et al. April 5, 2	2005-04-05
Method to make a weight compensating/tuning layer on a substrate App 20050070119 - Doros, Theodore ; et al.	2005-03-31
Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method App 20040192019 - Seshan, Krishna ; et al.	2004-09-30
Method for fabricating microelectronic image projection devices App 20040125247 - Seshan, Krishna ; et al.	2004-07-01
Selectable decoupling capacitors for integrated circuit and methods of use App 20040108596 - Seshan, Krishna	2004-06-10
Forming a cap above a metal layer App 20040094836 - Seshan, Krishna ; et al.	2004-05-20
Integrated circuit package Grant 6,734,544 - Yan , et al. May 11, 2	2004-05-11
Power gridding scheme App 20040065948 - Seshan, Krishna	2004-04-08
Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method Grant 6,715,663 - Seshan , et al. April 6, 2	2004-04-06
Method and apparatus for a linearized output driver and terminator App 20040038475 - Dabral, Sanjay ; et al.	2004-02-26
Selectable decoupling capacitors for integrated circuit and methods of use Grant 6,686,659 - Seshan February 3, 2	2004-02-03
Structures to mechanically stabilize isolated top-level metal lines App 20040009657 - Selvin, Eric ; et al.	2004-01-15
Method and apparatus for a linearized output driver and terminator Grant 6,646,324 - Dabral , et al. November 11, 2	2003-11-11
Structures to mechanically stabilize isolated top-level metal lines Grant 6,614,118 - Selvin , et al. September 2, 2	2003-09-02
Integrated circuit package App 20030155640 - Yan, Soupin ; et al.	2003-08-21
Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method App 20030132766 - Seshan, Krishna ; et al.	2003-07-17
Power gridding scheme App 20030080406 - Seshan, Krishna	2003-05-01
Integrated circuit package Grant 6,552,425 - Yan , et al. April 22, 2	2003-04-22
Ball limiting metallurgy for input/outputs and methods of fabrication Grant 6,521,996 - Seshan February 18, 2	2003-02-18
Integrated passivation process, probe geometry and probing process Grant 6,515,358 - Dass , et al. February 4, 2	2003-02-04
Electronic assembly and cooling thereof Grant 6,480,385 - Seshan November 12, 2	2002-11-12
Selectable decoupling capacitors for integrated circuit and methods of use App 20020119583 - Seshan, Krishna	2002-08-29
Ball limiting metallurgy for input/outputs and methods of fabrication App 20020079576 - Seshan, Krishna	2002-06-27
Semiconductor passivation deposition process for interfacial adhesion App 20020050629 - Seshan, Krishna ; et al.	2002-05-02
Electronic assembly and cooling thereof App 20020048153 - Seshan, Krishna	2002-04-25
Method To Reduce Timing Skews In I/o Circuits And Clock Drivers Caused By Fabrication Process Tolerances App 20020044011 - DABRAL, SANJAY ; et al.	2002-04-18
Method and apparatus for cutting a wafer Grant 6,357,330 - Dass , et al. March 19, 2	2002-03-19
Process for sort testing C4 bumped wafers Grant 6,162,652 - Dass , et al. December 19, 2	2000-12-19
Energy-absorbing stable guard ring Grant 6,163,065 - Seshan , et al. December 19, 2	2000-12-19
Planar guard ring Grant 6,137,155 - Seshan , et al. October 24, 2	2000-10-24
Silicon wafer testing rig and a method for testing a silicon wafer wherein the silicon wafer is bent into a dome shape Grant 6,100,709 - Marieb , et al. August 8, 2	2000-08-08
Method to reduce timing skews in I/O circuits and clock drivers caused by fabrication process tolerances Grant 6,090,650 - Dabral , et al. July 18, 2	2000-07-18
Metal locking structures to prevent a passivation layer from delaminating Grant 6,043,551 - Seshan March 28, 2	2000-03-28
Metal staples to prevent interlayer delamination Grant 5,977,639 - Seshan , et al. November 2, 1	1999-11-02
Energy absorbing structures to prevent damage to an integrated circuit Grant 5,880,528 - Seshan , et al. March 9, 1	1999-03-09
Method of making a self cooling electrically programmable fuse Grant 5,622,892 - Bezama , et al. April 22, 1	1997-04-22
Method of forming a thermally activated noise immune fuse Grant 5,614,440 - Bezama , et al. March 25, 1	1997-03-25
Self cooling electrically programmable fuse Grant 5,585,663 - Bezama , et al. December 17, 1	1996-12-17
Electrically programmable antifuse using metal penetration of a junction Grant 5,298,784 - Gambino , et al. March 29, 1	1994-03-29
Ultrasonic adhesion/dehesion monitoring apparatus with acoustic transducer means Grant 5,170,929 - Long , et al. December 15, 1	1992-12-15
On-chip temperature sensor utilizing a Schottky barrier diode structure Grant 5,154,514 - Gambino , et al. October 13, 1	1992-10-13
Method and apparatus for causing an open circuit in a conductive line Grant 4,962,294 - Beckham , et al. October 9, 1	1990-10-09

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