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Semiconductor Device Using Emc Wafer Support System And Fabricating Method Thereof App 20220181314 - Kim; Jin Young ;   et al. | 2022-06-09 |
Semiconductor Device And Manufacturing Method Thereof App 20220148886 - Paek; Jong Sik ;   et al. | 2022-05-12 |
Semiconductor device using EMC wafer support system and fabricating method thereof Grant 11,183,493 - Kim , et al. November 23, 2 | 2021-11-23 |
Semiconductor Device And Manufacturing Method Thereof App 20210265174 - Do; Won Chul ;   et al. | 2021-08-26 |
Semiconductor device and manufacturing method thereof Grant 11,101,144 - Paek , et al. August 24, 2 | 2021-08-24 |
Semiconductor device and manufacturing method thereof Grant 10,985,031 - Do , et al. April 20, 2 | 2021-04-20 |
Semiconductor Device And Manufacturing Method Thereof App 20200303212 - Paek; Jong Sik ;   et al. | 2020-09-24 |
Semiconductor Device Using Emc Wafer Support System And Fabricating Method Thereof App 20200203331 - Kim; Jin Young ;   et al. | 2020-06-25 |
Semiconductor device and manufacturing method thereof Grant 10,515,825 - Paek , et al. Dec | 2019-12-24 |
Semiconductor Device And Manufacturing Method Thereof App 20190279881 - Do; Won Chul ;   et al. | 2019-09-12 |
Semiconductor device using EMC wafer support system and fabricating method thereof Grant 10,388,643 - Kim , et al. A | 2019-08-20 |
Semiconductor device and manufacturing method thereof Grant 10,297,466 - Do , et al. | 2019-05-21 |
Semiconductor Device And Manufacturing Method Thereof App 20190067035 - Paek; Jong Sik ;   et al. | 2019-02-28 |
Semiconductor device and manufacturing method thereof Grant 10,079,157 - Paek , et al. September 18, 2 | 2018-09-18 |
Semiconductor Device And Manufacturing Method Thereof App 20180261468 - Do; Won Chul ;   et al. | 2018-09-13 |
Semiconductor device and manufacturing method thereof Grant 9,966,276 - Do , et al. May 8, 2 | 2018-05-08 |
Pen type input device and method for character input and mouse functions Grant 9,946,372 - Rhee , et al. April 17, 2 | 2018-04-17 |
Semiconductor Device Using Emc Wafer Support System And Fabricating Method Thereof App 20170271315 - Kim; Jin Young ;   et al. | 2017-09-21 |
Stacked memory devices, and memory packages and memory systems having the same Grant 9,747,959 - Seo August 29, 2 | 2017-08-29 |
Stacked Memory Devices, And Memory Packages And Memory Systems Having The Same App 20170154655 - SEO; Seong-Min | 2017-06-01 |
Semiconductor Device And Manufacturing Method Thereof App 20170125264 - Do; Won Chul ;   et al. | 2017-05-04 |
Semiconductor device using EMC wafer support system and fabricating method thereof Grant 9,627,368 - Kim , et al. April 18, 2 | 2017-04-18 |
Semiconductor device and manufacturing method thereof Grant 9,536,858 - Do , et al. January 3, 2 | 2017-01-03 |
Semiconductor device with plated pillars and leads Grant 9,502,375 - Paek , et al. November 22, 2 | 2016-11-22 |
Electronic device package structure and method of fabricating the same Grant 9,478,517 - Paek , et al. October 25, 2 | 2016-10-25 |
Multi-functional pen and method for using multi-functional pen Grant 9,454,246 - Seo , et al. September 27, 2 | 2016-09-27 |
Semiconductor device and manufacturing method thereof Grant 9,449,946 - Sung , et al. September 20, 2 | 2016-09-20 |
Display device having pattern and method of detecting pixel position therein Grant 9,423,910 - Seo , et al. August 23, 2 | 2016-08-23 |
Semiconductor Device And Manufacturing Method Thereof App 20160189980 - Paek; Jong Sik ;   et al. | 2016-06-30 |
Pen-type Input Device And Input Method Using The Same App 20160162047 - RHEE; Do-Young ;   et al. | 2016-06-09 |
Semiconductor device Grant 9,196,601 - Park , et al. November 24, 2 | 2015-11-24 |
Semiconductor Device And Manufacturing Method Thereof App 20150200179 - Do; Won Chul ;   et al. | 2015-07-16 |
Semiconductor device utilzing redistribution layers to couple stacked die Grant 9,048,241 - Paek , et al. June 2, 2 | 2015-06-02 |
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Electronic Device Package Structure And Method Fabricating The Same App 20150049421 - Paek; Jong Sik ;   et al. | 2015-02-19 |
Semiconductor Device App 20150021791 - Park; Doo Hyun ;   et al. | 2015-01-22 |
Semiconductor Device With Plated Pillars And Leads App 20150021751 - Paek; Jong Sik ;   et al. | 2015-01-22 |
Semiconductor Device With Plated Conductive Pillar Coupling App 20150021767 - Park; Doo Hyun ;   et al. | 2015-01-22 |
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Apparatus And Method For Recognizing Image With Increased Image Recognition Rate App 20130088463 - KIM; Po-Ra ;   et al. | 2013-04-11 |
Display Apparatus Including A Pattern And Method For Generating A App 20130082907 - YUN; In-Kuk ;   et al. | 2013-04-04 |
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Multi-functional Pen And Method For Using Multi-functional Pen App 20110164001 - Seo; Seong-Min ;   et al. | 2011-07-07 |
Method And Apparatus For Generating Vibrations In Portable Terminal App 20110157052 - LEE; Eun-Hwa ;   et al. | 2011-06-30 |
Pen Type Input Device And Input Method Using The Same App 20110006982 - Rhee; Do-Young ;   et al. | 2011-01-13 |
Method For Providing Haptic Feedback In A Touch Screen App 20100141606 - Bae; Yu-Dong ;   et al. | 2010-06-10 |
Mobile Input Device Of Mobile Terminal App 20090149219 - RHEE; Do Young ;   et al. | 2009-06-11 |
Wafer level chip scale package and manufacturing method for the same Grant 7,446,422 - Paek , et al. November 4, 2 | 2008-11-04 |
Surface acoustic wave (SAW) device package and method for packaging a SAW device Grant 7,362,038 - Jang , et al. April 22, 2 | 2008-04-22 |
Image sensor package and its manufacturing method Grant 7,359,579 - Paek , et al. April 15, 2 | 2008-04-15 |
Current Driving Type Light Source Driving Circuit App 20080074156 - SEO; Ja-Won ;   et al. | 2008-03-27 |
Bi-directional optical transceiver App 20070104426 - Yun; In-Kuk ;   et al. | 2007-05-10 |
Wafer level package and its manufacturing method App 20070018322 - Park; In Bae ;   et al. | 2007-01-25 |
Semiconductor package and manufacturing method thereof App 20060261458 - Paek; Jong Sik ;   et al. | 2006-11-23 |
Wafer-level chip-scale package Grant 6,987,319 - Paek , et al. January 17, 2 | 2006-01-17 |
Semiconductor package Grant 6,953,988 - Seo , et al. October 11, 2 | 2005-10-11 |
Semiconductor package App 20050062148 - Seo, Seong Min ;   et al. | 2005-03-24 |
Semiconductor package Grant 6,858,919 - Seo , et al. February 22, 2 | 2005-02-22 |
Wafer-level chip-scale package Grant 6,841,874 - Paek , et al. January 11, 2 | 2005-01-11 |
Semiconductor package including stacked chips with aligned input/output pads Grant 6,759,737 - Seo , et al. July 6, 2 | 2004-07-06 |
Semiconductor package App 20020020907 - Seo, Seong Min ;   et al. | 2002-02-21 |
Process for bonding semiconductor chip Grant 5,858,149 - Seo , et al. January 12, 1 | 1999-01-12 |
Bonding method for semiconductor chips Grant 5,740,956 - Seo , et al. April 21, 1 | 1998-04-21 |