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Method and apparatus for providing symmetrical output data for a double data rate DRAM Grant 8,516,292 - Li , et al. August 20, 2 | 2013-08-20 |
Circuit and method for controlling a clock synchronizing circuit for low power refresh operation Grant 8,400,868 - Schoenfeld , et al. March 19, 2 | 2013-03-19 |
Method And Apparatus For Providing Symmetrical Output Data For A Double Data Rate Dram App 20110119519 - Li; Wen ;   et al. | 2011-05-19 |
Method and apparatus for providing symmetrical output data for a double data rate DRAM Grant 7,877,623 - Li , et al. January 25, 2 | 2011-01-25 |
Method and apparatus for providing symmetrical output data for a double data rate dram App 20090031158 - Li; Wen ;   et al. | 2009-01-29 |
Method and apparatus for providing symmetrical output data for a double data rate DRAM Grant 7,421,607 - Li , et al. September 2, 2 | 2008-09-02 |
Method And Apparatus For Providing Symmetrical Output Data For A Double Data Rate Dram App 20070220295 - Li; Wen ;   et al. | 2007-09-20 |
Method and apparatus for providing symmetrical output data for a double data rate DRAM Grant 7,237,136 - Li , et al. June 26, 2 | 2007-06-26 |
Integrated Circuit Device With Treated Perimeter Edge App 20060261445 - Schoenfeld; Aaron | 2006-11-23 |
Low power buffer implementation Grant 6,941,526 - Schoenfeld , et al. September 6, 2 | 2005-09-06 |
Low power buffer implementation App 20050114803 - Schoenfeld, Aaron ;   et al. | 2005-05-26 |
Apparatus for implementing selected functionality on an integrated circuit device in an electronic device Grant 6,897,569 - Schoenfeld May 24, 2 | 2005-05-24 |
Method for implementing selected functionality on an integrated circuit device Grant 6,858,472 - Schoenfeld February 22, 2 | 2005-02-22 |
Interdigitated leads-over-chip lead frame and device for supporting an integrated circuit die Grant 6,831,353 - Schoenfeld , et al. December 14, 2 | 2004-12-14 |
Integrated circuit having conductive paths of different heights formed from the same layer structure and method for forming the same Grant 6,828,230 - Schoenfeld , et al. December 7, 2 | 2004-12-07 |
Low power buffer implementation Grant 6,816,994 - Schoenfeld , et al. November 9, 2 | 2004-11-09 |
Multilevel leadframe for a packaged integrated circuit and method of fabrication Grant 6,787,889 - Schoenfeld September 7, 2 | 2004-09-07 |
Methods of fabricating multilevel leadframes and semiconductor devices Grant 6,780,680 - Schoenfeld August 24, 2 | 2004-08-24 |
Method and apparatus for providing symmetrical output data for a double data rate DRAM App 20040148538 - Li, Wen ;   et al. | 2004-07-29 |
Fork-like memory structure for ULSI DRAM Grant 6,724,033 - Schoenfeld , et al. April 20, 2 | 2004-04-20 |
Fork-like memory structure for ULSI DRAM and method of fabrication Grant 6,707,096 - Schoenfeld , et al. March 16, 2 | 2004-03-16 |
Method and apparatus for providing symmetrical output data for a double data rate DRAM Grant 6,704,881 - Li , et al. March 9, 2 | 2004-03-09 |
Method and apparatus for coupling a semiconductor die to die terminals Grant 6,699,734 - Schoenfeld , et al. March 2, 2 | 2004-03-02 |
Method for implementing selected functionality on an integrated circuit device App 20040038512 - Schoenfeld, Aaron | 2004-02-26 |
Apparatus for implementing selected functionality on an integrated circuit device in an electronic device App 20040026772 - Schoenfeld, Aaron | 2004-02-12 |
Apparatus for implementing selected functionality on an integrated circuit device Grant 6,674,177 - Schoenfeld January 6, 2 | 2004-01-06 |
Low power buffer implementation App 20030237056 - Schoenfeld, Aaron ;   et al. | 2003-12-25 |
Method for implementing selected functionality on an integrated circuit device Grant 6,635,560 - Schoenfeld October 21, 2 | 2003-10-21 |
Interdigitated leads-over-chip lead frame and device for supporting an integrated circuit die App 20030193081 - Schoenfeld, Aaron ;   et al. | 2003-10-16 |
Apparatus for implementing selected functionality on an integrated circuit device Grant 6,617,692 - Schoenfeld September 9, 2 | 2003-09-09 |
Method and apparatus for coupling a semiconductor die to die terminals Grant 6,600,215 - Schoenfeld , et al. July 29, 2 | 2003-07-29 |
Methods of fabricating multilevel leadframes and semiconductor devices App 20030127713 - Schoenfeld, Aaron | 2003-07-10 |
Method and apparatus for coupling a semiconductor die to die terminals App 20030113953 - Schoenfeld, Aaron ;   et al. | 2003-06-19 |
Multilevel leadframe for a packaged integrated circuit and method of fabrication App 20020195691 - Schoenfeld, Aaron | 2002-12-26 |
Method and apparatus for implementing selected functionality on an integrated circuit device Grant 6,472,764 - Schoenfeld October 29, 2 | 2002-10-29 |
Multilevel leadframe for a packaged integrated circuit Grant 6,462,404 - Schoenfeld October 8, 2 | 2002-10-08 |
Method and apparatus for implementing selected functionality on an integrated circuit device App 20020140111 - Schoenfeld, Aaron | 2002-10-03 |
Method and apparatus for digital delay locked loop circuits Grant 6,392,458 - Miller, Jr. , et al. May 21, 2 | 2002-05-21 |
Fork-like memory structure for ULSI DRAM and method of fabrication App 20020056867 - Schoenfeld, Aaron ;   et al. | 2002-05-16 |
Method and apparatus for digital delay locked loop circuits Grant 6,359,482 - Miller, Jr. , et al. March 19, 2 | 2002-03-19 |
Method and apparatus for implementing selected functionality on an integrated circuit device App 20020031873 - Schoenfeld, Aaron | 2002-03-14 |
Method And Apparatus For Digital Delay Locked Loop Circuits App 20020024367 - MILLER, JAMES E JR. ;   et al. | 2002-02-28 |
Method and apparatus for implementing selected functionality on an integrated circuit device App 20020024128 - Schoenfeld, Aaron | 2002-02-28 |
Method and apparatus for implementing selected functionality on an integrated circuit device Grant 6,351,040 - Schoenfeld February 26, 2 | 2002-02-26 |
Method and apparatus for implementing selected functionality on an integrated circuit device Grant 6,348,400 - Schoenfeld February 19, 2 | 2002-02-19 |
Method and apparatus for coupling a semiconductor die to die terminals App 20010052638 - Schoenfeld, Aaron ;   et al. | 2001-12-20 |
Interdigitated leads-over-chip lead frame, device, and method for supporting an integrated circuit die App 20010038142 - Schoenfeld, Aaron ;   et al. | 2001-11-08 |
Method and apparatus for implementing selected functionality on an integrated circuit device App 20010026022 - Schoenfeld, Aaron | 2001-10-04 |
Integrated Circuit Having Conductive Paths Of Different Heights Formed From The Same Layer Structure And Method For Forming The Same App 20010016407 - SCHOENFELD, AARON ;   et al. | 2001-08-23 |
Grinding technique for integrated circuits App 20010004544 - Schoenfeld, Aaron | 2001-06-21 |
Method for supporting an integrated circuit die Grant 6,148,509 - Schoenfeld , et al. November 21, 2 | 2000-11-21 |
Logic circuit delay stage and delay line utilizing same Grant 6,137,334 - Miller, Jr. , et al. October 24, 2 | 2000-10-24 |
Method and apparatus for improving the performance of digital delay locked loop circuits Grant 6,069,506 - Miller, Jr. , et al. May 30, 2 | 2000-05-30 |
Multilevel leadframe for a packaged integrated circuit Grant 6,066,515 - Schoenfeld May 23, 2 | 2000-05-23 |
ESD protection using selective siliciding techniques Grant 6,004,838 - Ma , et al. December 21, 1 | 1999-12-21 |
Interdigitated leads-over-chip lead frame for supporting an integrated circuit die Grant 5,973,935 - Schoenfeld , et al. October 26, 1 | 1999-10-26 |
Waveshaping circuit generating two rising slopes for a sense amplifier pulldown device Grant 5,614,856 - Wilson , et al. March 25, 1 | 1997-03-25 |