loadpatents
Patent applications and USPTO patent grants for Sawatari; Tatsuro.The latest application filed is for "circuit board and manufacturing method therefor".
Patent | Date |
---|---|
Circuit board and manufacturing method therefor Grant 10,681,820 - Sawatari , et al. | 2020-06-09 |
Circuit Board And Manufacturing Method Therefor App 20190274220 - SAWATARI; TATSURO ;   et al. | 2019-09-05 |
Camera module Grant 9,818,780 - Miyazaki , et al. November 14, 2 | 2017-11-14 |
Substrate with built-in electronic component Grant 9,363,897 - Sugiyama , et al. June 7, 2 | 2016-06-07 |
Method of manufacturing substrate having cavity Grant 9,301,407 - Miyazaki , et al. March 29, 2 | 2016-03-29 |
Camera module Grant 9,253,386 - Miyazaki , et al. February 2, 2 | 2016-02-02 |
Substrate with built-in component Grant 9,101,075 - Naganuma , et al. August 4, 2 | 2015-08-04 |
Circuit module having electrical shield Grant 9,101,050 - Shimamura , et al. August 4, 2 | 2015-08-04 |
Substrate with built-in electronic component Grant 9,078,370 - Sugiyama , et al. July 7, 2 | 2015-07-07 |
Substrate with built-in electronic component Grant 9,055,671 - Sawatari , et al. June 9, 2 | 2015-06-09 |
Substrate with built-in electronic component Grant 9,007,782 - Sawatari , et al. April 14, 2 | 2015-04-14 |
Substrate With Built-in Electronic Component App 20150098203 - SAWATARI; Tatsuro ;   et al. | 2015-04-09 |
Electronic circuit module and method for producing the same Grant 8,988,885 - Sawatari , et al. March 24, 2 | 2015-03-24 |
Substrate With Built-in Component App 20150070862 - NAGANUMA; Masaki ;   et al. | 2015-03-12 |
Substrate With Built-in Electronic Component And Core Base-material For Substrate With Built-in Electronic Component App 20150068795 - IDA; Kazuaki ;   et al. | 2015-03-12 |
Substrate with built-in electronic component Grant 8,964,407 - Sawatari , et al. February 24, 2 | 2015-02-24 |
Circuit Module App 20150049439 - SHIMAMURA; Masaya ;   et al. | 2015-02-19 |
Method Of Manufacturing Substrate Having Cavity App 20150010694 - MIYAZAKI; Masashi ;   et al. | 2015-01-08 |
Substrate with built-in electronic component Grant 08923009 - | 2014-12-30 |
Substrate with built-in electronic component Grant 8,923,009 - Sawatari , et al. December 30, 2 | 2014-12-30 |
Substrate With Built-in Electronic Component App 20140355232 - SAWATARI; Tatsuro ;   et al. | 2014-12-04 |
Substrate With Built-in Electronic Component App 20140307402 - SUGIYAMA; Yuichi ;   et al. | 2014-10-16 |
Substrate With Built-in Electronic Component App 20140285988 - SAWATARI; Tatsuro ;   et al. | 2014-09-25 |
Composite multi-layer substrate and module using the substrate Grant RE45,146 - Miyazaki , et al. September 23, 2 | 2014-09-23 |
Camera Module App 20140252522 - MIYAZAKI; Masashi ;   et al. | 2014-09-11 |
Camera Module App 20140253794 - MIYAZAKI; Masashi ;   et al. | 2014-09-11 |
Electronic circuit module Grant 8,811,021 - Sugiyama , et al. August 19, 2 | 2014-08-19 |
Substrate With Built-in Electronic Component App 20140133120 - SAWATARI; Tatsuro ;   et al. | 2014-05-15 |
Electronic Circuit Module App 20140126160 - SUGIYAMA; Yuichi ;   et al. | 2014-05-08 |
Electronic Circuit Module And Method For Producing The Same App 20140126157 - SAWATARI; Tatsuro ;   et al. | 2014-05-08 |
Substrate With Built-in Electronic Component App 20140048321 - Sugiyama; Yuichi ;   et al. | 2014-02-20 |
Substrate With Built-in Electronic Component App 20140049928 - Sawatari; Tatsuro ;   et al. | 2014-02-20 |
Multi-layer board incorporating electronic component and method for producing the same Grant 8,314,343 - Inoue , et al. November 20, 2 | 2012-11-20 |
Composite multi-layer substrate and module using the substrate Grant 7,928,560 - Miyazaki , et al. April 19, 2 | 2011-04-19 |
Composite Multi-layer Substrate And Module Using The Substrate App 20100300736 - Miyazaki; Masashi ;   et al. | 2010-12-02 |
Composite multi-layer substrate and module using the substrate Grant 7,745,926 - Miyazaki , et al. June 29, 2 | 2010-06-29 |
Multilayer substrate including components therein Grant 7,738,256 - Sawatari , et al. June 15, 2 | 2010-06-15 |
Multi-layer Board Incorporating Electronic Component And Method For Producing The Same App 20090084596 - INOUE; Yusuke ;   et al. | 2009-04-02 |
Multilayer Substrate Including Components Therein App 20080196932 - Sawatari; Tatsuro ;   et al. | 2008-08-21 |
Multilayer substrate including components therein Grant 7,379,306 - Sawatari , et al. May 27, 2 | 2008-05-27 |
Composite multi-layer substrate and module using the substrate Grant 7,348,662 - Miyazaki , et al. March 25, 2 | 2008-03-25 |
Composite multi-layer substrate and module using the substrate App 20080006928 - Miyazaki; Masashi ;   et al. | 2008-01-10 |
Multilayer printed wiring board and production method therefor Grant 7,278,205 - Miyazaki , et al. October 9, 2 | 2007-10-09 |
Multilayer printed wiring board and production method therefor App 20070029109 - Miyazaki; Masashi ;   et al. | 2007-02-08 |
Composite multi-layer substrate and module using the substrate App 20060255440 - Miyazaki; Masashi ;   et al. | 2006-11-16 |
Multilayer printed wiring board and production method therefor App 20060016620 - Miyazaki; Masashi ;   et al. | 2006-01-26 |
Multilayer substrate including components therein App 20050255303 - Sawatari, Tatsuro ;   et al. | 2005-11-17 |
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