loadpatents
name:-0.027987957000732
name:-0.022086143493652
name:-0.0040519237518311
Sawatari; Tatsuro Patent Filings

Sawatari; Tatsuro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sawatari; Tatsuro.The latest application filed is for "circuit board and manufacturing method therefor".

Company Profile
3.23.26
  • Sawatari; Tatsuro - Tokyo JP
  • - Tokyo JP
  • Sawatari; Tatsuro - Shimonoseki-Machi JP
  • Sawatari; Tatsuro - Takasaki JP
  • Sawatari; Tatsuro - Gunma JP
  • SAWATARI; Tatsuro - Takasaki-shi JP
  • Sawatari; Tatsuro - Nakamuroda Haruna-Machi JP
  • Sawatari; Tatsuro - Gunma-Gun JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Circuit board and manufacturing method therefor
Grant 10,681,820 - Sawatari , et al.
2020-06-09
Circuit Board And Manufacturing Method Therefor
App 20190274220 - SAWATARI; TATSURO ;   et al.
2019-09-05
Camera module
Grant 9,818,780 - Miyazaki , et al. November 14, 2
2017-11-14
Substrate with built-in electronic component
Grant 9,363,897 - Sugiyama , et al. June 7, 2
2016-06-07
Method of manufacturing substrate having cavity
Grant 9,301,407 - Miyazaki , et al. March 29, 2
2016-03-29
Camera module
Grant 9,253,386 - Miyazaki , et al. February 2, 2
2016-02-02
Substrate with built-in component
Grant 9,101,075 - Naganuma , et al. August 4, 2
2015-08-04
Circuit module having electrical shield
Grant 9,101,050 - Shimamura , et al. August 4, 2
2015-08-04
Substrate with built-in electronic component
Grant 9,078,370 - Sugiyama , et al. July 7, 2
2015-07-07
Substrate with built-in electronic component
Grant 9,055,671 - Sawatari , et al. June 9, 2
2015-06-09
Substrate with built-in electronic component
Grant 9,007,782 - Sawatari , et al. April 14, 2
2015-04-14
Substrate With Built-in Electronic Component
App 20150098203 - SAWATARI; Tatsuro ;   et al.
2015-04-09
Electronic circuit module and method for producing the same
Grant 8,988,885 - Sawatari , et al. March 24, 2
2015-03-24
Substrate With Built-in Component
App 20150070862 - NAGANUMA; Masaki ;   et al.
2015-03-12
Substrate With Built-in Electronic Component And Core Base-material For Substrate With Built-in Electronic Component
App 20150068795 - IDA; Kazuaki ;   et al.
2015-03-12
Substrate with built-in electronic component
Grant 8,964,407 - Sawatari , et al. February 24, 2
2015-02-24
Circuit Module
App 20150049439 - SHIMAMURA; Masaya ;   et al.
2015-02-19
Method Of Manufacturing Substrate Having Cavity
App 20150010694 - MIYAZAKI; Masashi ;   et al.
2015-01-08
Substrate with built-in electronic component
Grant 08923009 -
2014-12-30
Substrate with built-in electronic component
Grant 8,923,009 - Sawatari , et al. December 30, 2
2014-12-30
Substrate With Built-in Electronic Component
App 20140355232 - SAWATARI; Tatsuro ;   et al.
2014-12-04
Substrate With Built-in Electronic Component
App 20140307402 - SUGIYAMA; Yuichi ;   et al.
2014-10-16
Substrate With Built-in Electronic Component
App 20140285988 - SAWATARI; Tatsuro ;   et al.
2014-09-25
Composite multi-layer substrate and module using the substrate
Grant RE45,146 - Miyazaki , et al. September 23, 2
2014-09-23
Camera Module
App 20140252522 - MIYAZAKI; Masashi ;   et al.
2014-09-11
Camera Module
App 20140253794 - MIYAZAKI; Masashi ;   et al.
2014-09-11
Electronic circuit module
Grant 8,811,021 - Sugiyama , et al. August 19, 2
2014-08-19
Substrate With Built-in Electronic Component
App 20140133120 - SAWATARI; Tatsuro ;   et al.
2014-05-15
Electronic Circuit Module
App 20140126160 - SUGIYAMA; Yuichi ;   et al.
2014-05-08
Electronic Circuit Module And Method For Producing The Same
App 20140126157 - SAWATARI; Tatsuro ;   et al.
2014-05-08
Substrate With Built-in Electronic Component
App 20140048321 - Sugiyama; Yuichi ;   et al.
2014-02-20
Substrate With Built-in Electronic Component
App 20140049928 - Sawatari; Tatsuro ;   et al.
2014-02-20
Multi-layer board incorporating electronic component and method for producing the same
Grant 8,314,343 - Inoue , et al. November 20, 2
2012-11-20
Composite multi-layer substrate and module using the substrate
Grant 7,928,560 - Miyazaki , et al. April 19, 2
2011-04-19
Composite Multi-layer Substrate And Module Using The Substrate
App 20100300736 - Miyazaki; Masashi ;   et al.
2010-12-02
Composite multi-layer substrate and module using the substrate
Grant 7,745,926 - Miyazaki , et al. June 29, 2
2010-06-29
Multilayer substrate including components therein
Grant 7,738,256 - Sawatari , et al. June 15, 2
2010-06-15
Multi-layer Board Incorporating Electronic Component And Method For Producing The Same
App 20090084596 - INOUE; Yusuke ;   et al.
2009-04-02
Multilayer Substrate Including Components Therein
App 20080196932 - Sawatari; Tatsuro ;   et al.
2008-08-21
Multilayer substrate including components therein
Grant 7,379,306 - Sawatari , et al. May 27, 2
2008-05-27
Composite multi-layer substrate and module using the substrate
Grant 7,348,662 - Miyazaki , et al. March 25, 2
2008-03-25
Composite multi-layer substrate and module using the substrate
App 20080006928 - Miyazaki; Masashi ;   et al.
2008-01-10
Multilayer printed wiring board and production method therefor
Grant 7,278,205 - Miyazaki , et al. October 9, 2
2007-10-09
Multilayer printed wiring board and production method therefor
App 20070029109 - Miyazaki; Masashi ;   et al.
2007-02-08
Composite multi-layer substrate and module using the substrate
App 20060255440 - Miyazaki; Masashi ;   et al.
2006-11-16
Multilayer printed wiring board and production method therefor
App 20060016620 - Miyazaki; Masashi ;   et al.
2006-01-26
Multilayer substrate including components therein
App 20050255303 - Sawatari, Tatsuro ;   et al.
2005-11-17

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