loadpatents
name:-0.01157808303833
name:-0.0090148448944092
name:-0.00056004524230957
Satoh; Masayuki Patent Filings

Satoh; Masayuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Satoh; Masayuki.The latest application filed is for "lid body portion and electronic device package using the lid body portion and electronic device".

Company Profile
0.9.10
  • Satoh; Masayuki - Chiba JP
  • SATOH; Masayuki - Chiba-shi JP
  • Satoh; Masayuki - Takasaki JP
  • Satoh; Masayuki - Gunma JP
  • Satoh; Masayuki - Kasaoka JP
  • Satoh; Masayuki - Takasaki-shi JP
  • Satoh; Masayuki - Kasaoka-shi JP
  • Satoh; Masayuki - Toscana CA
  • Satoh; Masayuki - Odawara JP
  • Satoh; Masayuki - Toyota JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Lid body portion and electronic device package using the lid body portion and electronic device
Grant 9,370,104 - Satoh , et al. June 14, 2
2016-06-14
Lid Body Portion And Electronic Device Package Using The Lid Body Portion And Electronic Device
App 20150022988 - SATOH; Masayuki ;   et al.
2015-01-22
Resin-sealed semiconductor device and method of manufacturing the same
Grant 8,253,238 - Satoh , et al. August 28, 2
2012-08-28
Semiconductor device
Grant 8,050,132 - Satoh November 1, 2
2011-11-01
System in package with built-in test-facilitating circuit
Grant 8,040,148 - Satoh October 18, 2
2011-10-18
Resin-sealed Semiconductor Device And Method Of Manufacturing The Same
App 20110068442 - Satoh; Masayuki ;   et al.
2011-03-24
Method for selectively forming electric conductor and method for manufacturing semiconductor device
Grant 7,892,975 - Kondoh , et al. February 22, 2
2011-02-22
Semiconductor Device
App 20100188923 - Satoh; Masayuki
2010-07-29
Apparatus For Forming Conductor, Method For Forming Conductor, And Method For Manufacturing Semiconductor Device
App 20100112776 - Kondoh; Eiichi ;   et al.
2010-05-06
System In Package And Socket
App 20100065846 - SATOH; Masayuki
2010-03-18
Semiconductor device
Grant 7,652,946 - Satoh January 26, 2
2010-01-26
Semiconductor Device
App 20090290444 - Satoh; Masayuki
2009-11-26
Semiconductor Device
App 20090154282 - Satoh; Masayuki
2009-06-18
Method For Selectively Forming Electric Conductor And Method For Manufacturing Semiconductor Device
App 20080233705 - Kondoh; Eiichi ;   et al.
2008-09-25
Apparatus For Forming Conductor, Method For Forming Conductor, And Method For Manufacturing Semiconductor Device
App 20080206949 - Kondoh; Eiichi ;   et al.
2008-08-28
Semiconductor device and process of manufacturing the same
Grant 6,504,229 - Yamauchi , et al. January 7, 2
2003-01-07
Semiconductor device and process of manufacturing the same
App 20010045667 - Yamauchi, Hiroshi ;   et al.
2001-11-29
Effective thrombosis mediated by human prourokinase-like polypeptides with increased binding affinity for thrombosis
Grant 5,316,934 - Kobayashi , et al. May 31, 1
1994-05-31
Internal combustion engine cylinder-head cover
Grant 4,565,164 - Satoh , et al. January 21, 1
1986-01-21

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