Sathe; Sanjeev Balwant

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sathe; Sanjeev Balwant.The latest application filed is for "wafer scale thin film package".

Company Profile

0.16.5

Sathe; Sanjeev Balwant - Binghamton NY
Sathe, Sanjeev Balwant - Johnson City NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer Scale Thin Film Package App 20080119029 - Caletka; David Vincent ; et al.	2008-05-22
Wafer scale thin film package Grant 7,348,261 - Caletka , et al. March 25, 2	2008-03-25
Method and packaging structure for optimizing warpage of flip chip organic packages Grant 7,026,706 - Infantolino , et al. April 11, 2	2006-04-11
Method and packaging structure for optimizing warpage of flip chip organic packages App 20040155339 - Infantolino, William ; et al.	2004-08-12
Method and packaging structure for optimizing warpage of flip chip organic packages Grant 6,747,331 - Infantolino , et al. June 8, 2	2004-06-08
Method and packaging structure for optimizing warpage of flip chip organic packages App 20040012086 - Infantolino, William ; et al.	2004-01-22
Wafer scale thin film package App 20030199121 - Caletka, David Vincent ; et al.	2003-10-23
Electronic package with thermally conductive standoff Grant 6,631,078 - Alcoe , et al. October 7, 2	2003-10-07
Wafer scale thin film package Grant 6,627,998 - Caletka , et al. September 30, 2	2003-09-30
Electronic Package With Thermally Conductive Standoff App 20030129863 - Alcoe, David J. ; et al.	2003-07-10
Method of making electronic package with compressible heatsink structure Grant 6,255,136 - Alcoe , et al. July 3, 2	2001-07-03
Electronic package with compressible heatsink structure Grant 6,245,186 - Alcoe , et al. June 12, 2	2001-06-12
Electronic packages and a method to improve thermal performance of electronic packages Grant 6,058,015 - Sammakia , et al. May 2, 2	2000-05-02
Electronic package with heat transfer means Grant 6,037,658 - Brodsky , et al. March 14, 2	2000-03-14
Electronic packages and a method to improve thermal performance of electronic packages Grant 5,966,290 - Sammakia , et al. October 12, 1	1999-10-12
Electronic packages and method to enhance the passive thermal management of electronic packages Grant 5,912,800 - Sammakia , et al. June 15, 1	1999-06-15
Electronic package with compressible heatsink structure Grant 5,863,814 - Alcoe , et al. January 26, 1	1999-01-26
Electronic package with compressible heatsink structure Grant 5,786,635 - Alcoe , et al. July 28, 1	1998-07-28
Demountable heat sink Grant 5,754,400 - Sathe , et al. May 19, 1	1998-05-19
Heat sink structure with corrugated wound wire heat conductive elements Grant 5,673,177 - Brodsky , et al. September 30, 1	1997-09-30
Demountable heat sink Grant 5,654,876 - Sathe , et al. August 5, 1	1997-08-05

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