SASAKI; Masanao
Patent Applications and Registrations
Patent applications and USPTO patent grants for SASAKI; Masanao.The latest application filed is for "location identification system, location identification method, and computer-readable medium".
- SASAKI; Masanao - Kanagawa JP
- Sasaki; Masanao - Nishigo-mura JP
| Patent | Date |
|---|---|
| Location Identification System, Location Identification Method, And Computer-readable Medium App 20220225488 - KAWAMORI; Masami ; et al. | 2022-07-14 |
| Method for conditioning polishing pad and polishing apparatus Grant 10,730,161 - Yasuda , et al. | 2020-08-04 |
| Method for polishing silicon wafer Grant 10,460,947 - Sasaki , et al. Oc | 2019-10-29 |
| Workpiece processing apparatus Grant 10,335,918 - Yasuda , et al. | 2019-07-02 |
| Method of producing polishing head and polishing apparatus Grant 10,293,460 - Hashimoto , et al. | 2019-05-21 |
| Workpiece Polishing Apparatus App 20190001463 - HASHIMOTO; Hiromasa ; et al. | 2019-01-03 |
| Method For Conditioning Polishing Pad And Polishing Apparatus App 20180264618 - YASUDA; Taichi ; et al. | 2018-09-20 |
| Double-side polishing method Grant 9,987,721 - Sasaki , et al. June 5, 2 | 2018-06-05 |
| Workpiece Processing Apparatus App 20180117729 - YASUDA; Taichi ; et al. | 2018-05-03 |
| Method For Polishing Silicon Wafer App 20170345662 - SASAKI; Masanao ; et al. | 2017-11-30 |
| Method Of Producing Polishing Head And Polishing Apparatus App 20160101503 - HASHIMOTO; Hiromasa ; et al. | 2016-04-14 |
| Workpiece Polishing Apparatus App 20160082567 - HASHIMOTO; Hiromasa ; et al. | 2016-03-24 |
| Carrier For Use In Double-side Polishing Apparatus And Method Of Double-side Polishing Wafer App 20150321311 - SASAKI; Masanao ; et al. | 2015-11-12 |
| Double-side Polishing Method App 20150217425 - Sasaki; Masanao ; et al. | 2015-08-06 |
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