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Method For Manufacturing Aerogel App 20190330068 - SAKATANI; SHIGEAKI ;   et al. | 2019-10-31 |
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Heat Insulating Material And Heat Insulating Structure Using Same App 20190178434 - SAKATANI; SHIGEAKI ;   et al. | 2019-06-13 |
Heat Insulator App 20190177911 - HINO; HIROHISA ;   et al. | 2019-06-13 |
Thermal Insulation Sheet And Method For Producing The Same, And Electronic Device And Battery Unit App 20190161909 - OIKAWA; Kazuma ;   et al. | 2019-05-30 |
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Heat Insulating Material And Method For Forming Coating Of The Same App 20190144701 - NAKAMURA; Taichi ;   et al. | 2019-05-16 |
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Heat-insulation Material And Production Method Thereof App 20180024281 - WADA; Tooru ;   et al. | 2018-01-25 |
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Silica Aerogel, Heat-insulation Material, And Method For Producing Silica Aerogel App 20170174859 - SAKATANI; SHIGEAKI ;   et al. | 2017-06-22 |
Xerogel production method Grant 9,663,376 - Oikawa , et al. May 30, 2 | 2017-05-30 |
Composite sheet, mounting structure including the composite sheet and electronic apparatus including the mounting structure Grant 9,604,431 - Sakatani , et al. March 28, 2 | 2017-03-28 |
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Composite Sheet, Mounting Structure Including The Composite Sheet And Electronic Apparatus Including The Mounting Structure App 20150077957 - SAKATANI; SHIGEAKI ;   et al. | 2015-03-19 |
Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body Grant 8,810,035 - Nakamura , et al. August 19, 2 | 2014-08-19 |
Laser array light source unit Grant 8,718,109 - Saruwatari , et al. May 6, 2 | 2014-05-06 |
Semiconductor device Grant 8,691,377 - Nakamura , et al. April 8, 2 | 2014-04-08 |
Soldering material and electronic component assembly Grant 8,598,464 - Sakatani , et al. December 3, 2 | 2013-12-03 |
Mounting structure Grant 8,552,307 - Hine , et al. October 8, 2 | 2013-10-08 |
Semiconductor Bonding Structure Body And Manufacturing Method Of Semiconductor Bonding Structure Body App 20130241069 - Nakamura; Taichi ;   et al. | 2013-09-19 |
Semiconductor device mounted structure and its manufacturing method Grant 8,450,859 - Ohashi , et al. May 28, 2 | 2013-05-28 |
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Mounted structure Grant 8,410,377 - Yamaguchi , et al. April 2, 2 | 2013-04-02 |
Mounting structure for semiconductor element with underfill resin Grant 8,378,472 - Matsuno , et al. February 19, 2 | 2013-02-19 |
Structure with electronic component mounted therein and method for manufacturing such structure Grant 8,345,444 - Sakatani , et al. January 1, 2 | 2013-01-01 |
Joint structure, joining material, and method for producing joining material containing bismuth Grant 8,338,966 - Furusawa , et al. December 25, 2 | 2012-12-25 |
Laser Array Light Source Unit App 20120287954 - SARUWATARI; Naoto ;   et al. | 2012-11-15 |
Bonded structure and manufacturing method for bonded structure Grant 8,268,718 - Nakamura , et al. September 18, 2 | 2012-09-18 |
Semiconductor Component, Semiconductor Wafer Component, Manufacturing Method Of Semiconductor Component, And Manufacturing Method Of Joining Structure App 20120153461 - Kitaura; Hidetoshi ;   et al. | 2012-06-21 |
Mounted structural body and method of manufacturing the same Grant 8,179,686 - Sakatani , et al. May 15, 2 | 2012-05-15 |
Mounting structure Grant 8,138,426 - Matsuno , et al. March 20, 2 | 2012-03-20 |
Semiconductor Device App 20120018890 - Nakamura; Taichi ;   et al. | 2012-01-26 |
Mounting Structure App 20110284278 - Hine; Kiyohiro ;   et al. | 2011-11-24 |
Electroconductive bonding material and electric/electronic device using the same Grant 8,012,379 - Miyakawa , et al. September 6, 2 | 2011-09-06 |
Bonded Structure And Manufacturing Method For Bonded Structure App 20110175224 - NAKAMURA; Taichi ;   et al. | 2011-07-21 |
Soldering Material And Electronic Component Assembly App 20110120769 - Sakatani; Shigeaki ;   et al. | 2011-05-26 |
Joint Structure, Joining Material And Method For Producing Joining Material App 20110108996 - Furusawa; Akio ;   et al. | 2011-05-12 |
Structure With Electronic Component Mounted Therein And Method For Manufacturing Such Structure App 20110110050 - Sakatani; Shigeaki ;   et al. | 2011-05-12 |
Electronic circuit device and method for manufacturing same Grant 7,935,892 - Nishikawa , et al. May 3, 2 | 2011-05-03 |
Semiconductor Device Mounted Structure And Its Manufacturing Method App 20110095423 - Ohashi; Naomichi ;   et al. | 2011-04-28 |
Solder Joint Structure, And Joining Method Of The Same App 20110042817 - Furusawa; Akio ;   et al. | 2011-02-24 |
Electroconductive Bonding Material And Electric/electronic Device Using The Same App 20100316794 - MIYAKAWA; Hidenori ;   et al. | 2010-12-16 |
Joint Structure And Electronic Component App 20100301481 - Furusawa; Akio ;   et al. | 2010-12-02 |
Mounting Structure App 20100224398 - Matsuno; Koso ;   et al. | 2010-09-09 |
Card type information device and method for manufacturing same Grant 7,775,446 - Ochi , et al. August 17, 2 | 2010-08-17 |
Semiconductor Device And Method For Fabricating The Same App 20100148367 - MATSUO; Takahiro ;   et al. | 2010-06-17 |
Heat Curable Resin Composition, And Mounting Method And Reparing Process For Circuit Board Using The Heat Curable Composition App 20090236036 - Miyakawa; Hidenori ;   et al. | 2009-09-24 |
Card Type Information Device And Method For Manufacturing Same App 20090173795 - Ochi; Shozo ;   et al. | 2009-07-09 |
Electronic Circuit Device And Method For Manufacturing Same App 20090133900 - Nishikawa; Kazuhiro ;   et al. | 2009-05-28 |
Mounted Structural Body And Method Of Manufacturing The Same App 20090120675 - SAKATANI; Shigeaki ;   et al. | 2009-05-14 |
Mounting Structure App 20090116203 - MATSUNO; Koso ;   et al. | 2009-05-07 |
Mounted Structure App 20090116205 - Yamaguchi; Atsushi ;   et al. | 2009-05-07 |
Electroconductive Bonding Material and Electric/Electronic Device Using the Same App 20090032293 - Miyakawa; Hidenori ;   et al. | 2009-02-05 |