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name:-0.040215969085693
name:-0.019323110580444
Sakatani; Shigeaki Patent Filings

Sakatani; Shigeaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sakatani; Shigeaki.The latest application filed is for "thermal insulation sheet and method for producing the same, and electronic device and battery unit".

Company Profile
17.42.49
  • Sakatani; Shigeaki - Osaka JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Battery, battery module and method for producing separator
Grant 11,302,988 - Kuramitsu , et al. April 12, 2
2022-04-12
Heat-insulation material, heat-insulation structure using same, and process for producing same
Grant 11,293,583 - Kohmyohji , et al. April 5, 2
2022-04-05
Hydrophobic treatment method and manufacturing method for sheet-like member using method
Grant 11,230,475 - Kubo , et al. January 25, 2
2022-01-25
Thermal Insulation Sheet And Method For Producing The Same, And Electronic Device And Battery Unit
App 20210180244 - OIKAWA; Kazuma ;   et al.
2021-06-17
Thermal insulation sheet and method for producing the same, and electronic device and battery unit
Grant 11,015,286 - Oikawa , et al. May 25, 2
2021-05-25
Method for manufacturing aerogel
Grant 10,875,776 - Sakatani , et al. December 29, 2
2020-12-29
Heat Insulating Sheet And Method Of Manufacturing Thereof, And Electronic Device And Battery Unit Using Heat Insulating Sheet
App 20200378058 - OIKAWA; KAZUMA ;   et al.
2020-12-03
Heat-insulation sheet, electronic device using same, and method for producing heat-insulation sheet
Grant 10,710,332 - Oikawa , et al.
2020-07-14
Heat-insulation Sheet, Electronic Device Using Same, And Method For Producing Heat-insulation Sheet
App 20200122430 - OIKAWA; KAZUMA ;   et al.
2020-04-23
Heat Insulating Material, Method For Manufacturing Same, And Electronic Equipment And Automobile Using Same
App 20200108583 - OIKAWA; KAZUMA ;   et al.
2020-04-09
Battery, Battery Module And Method For Producing Separator
App 20200058912 - KURAMITSU; KAZUKI ;   et al.
2020-02-20
Heat-insulation sheet, electronic device using same, and method for producing heat-insulation sheet
Grant 10,543,660 - Oikawa , et al. Ja
2020-01-28
Method For Manufacturing Aerogel
App 20190330068 - SAKATANI; SHIGEAKI ;   et al.
2019-10-31
Heat-insulation material and production method thereof
Grant 10,384,420 - Hisatake , et al. A
2019-08-20
Aerogel and manufacturing method thereof
Grant 10,377,637 - Sakatani , et al. A
2019-08-13
Heat Insulating Material And Heat Insulating Structure Using Same
App 20190178434 - SAKATANI; SHIGEAKI ;   et al.
2019-06-13
Heat Insulator
App 20190177911 - HINO; HIROHISA ;   et al.
2019-06-13
Thermal Insulation Sheet And Method For Producing The Same, And Electronic Device And Battery Unit
App 20190161909 - OIKAWA; Kazuma ;   et al.
2019-05-30
Insulating Material And Device Using Insulating Material
App 20190145571 - OIKAWA; Kazuma ;   et al.
2019-05-16
Heat Insulating Material And Method For Forming Coating Of The Same
App 20190144701 - NAKAMURA; Taichi ;   et al.
2019-05-16
Silica aerogel, heat-insulation material, and method for producing silica aerogel
Grant 10,259,924 - Sakatani , et al.
2019-04-16
Hydrophobic Treatment Method And Manufacturing Method For Sheet-like Member Using Method
App 20190062168 - KUBO; TAKASHI ;   et al.
2019-02-28
Aerogels, Materials Using Same, And Methods For Producing Same
App 20190001293 - OIKAWA; KAZUMA ;   et al.
2019-01-03
Heat-insulation Material, Heat-insulation Structure Using Same, And Process For Producing Same
App 20180245731 - KOHMYOHJI; DAIDO ;   et al.
2018-08-30
Heat-insulation material and production method thereof
Grant 10,042,092 - Wada , et al. August 7, 2
2018-08-07
Heat Insulation Material And Device Using Same
App 20180156550 - OIKAWA; KAZUMA ;   et al.
2018-06-07
Composite sheet, production method thereof and electronic apparatus using the same
Grant 9,937,683 - Oikawa , et al. April 10, 2
2018-04-10
Seat heater
Grant 9,936,539 - Sakatani , et al. April 3, 2
2018-04-03
Heat-insulation Material And Production Method Thereof
App 20180024281 - WADA; Tooru ;   et al.
2018-01-25
Heat-insulation Sheet, Electronic Device Using Same, And Method For Producing Heat-insulation Sheet
App 20170266920 - OIKAWA; KAZUMA ;   et al.
2017-09-21
Heat-insulation Material And Production Method Thereof
App 20170239914 - HISATAKE; YOICHI ;   et al.
2017-08-24
Aerogel And Manufacturing Method Thereof
App 20170203971 - SAKATANI; SHIGEAKI ;   et al.
2017-07-20
Composite material and electronic apparatus
Grant 9,707,737 - Nakamura , et al. July 18, 2
2017-07-18
Silica Aerogel, Heat-insulation Material, And Method For Producing Silica Aerogel
App 20170174859 - SAKATANI; SHIGEAKI ;   et al.
2017-06-22
Xerogel production method
Grant 9,663,376 - Oikawa , et al. May 30, 2
2017-05-30
Composite sheet, mounting structure including the composite sheet and electronic apparatus including the mounting structure
Grant 9,604,431 - Sakatani , et al. March 28, 2
2017-03-28
Composite Material And Electronic Apparatus
App 20160167340 - NAKAMURA; TAICHI ;   et al.
2016-06-16
Heat Insulation Sheet And Method Of Producing The Same
App 20160060808 - OIKAWA; KAZUMA ;   et al.
2016-03-03
Seat Heater
App 20160029438 - SAKATANI; SHIGEAKI ;   et al.
2016-01-28
Composite Sheet, Production Method Thereof And Electronic Apparatus Using The Same
App 20160016378 - OIKAWA; KAZUMA ;   et al.
2016-01-21
Xerogel Production Method
App 20150360961 - Oikawa; Kazuma ;   et al.
2015-12-17
Composite Sheet, Mounting Structure Including The Composite Sheet And Electronic Apparatus Including The Mounting Structure
App 20150077957 - SAKATANI; SHIGEAKI ;   et al.
2015-03-19
Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body
Grant 8,810,035 - Nakamura , et al. August 19, 2
2014-08-19
Laser array light source unit
Grant 8,718,109 - Saruwatari , et al. May 6, 2
2014-05-06
Semiconductor device
Grant 8,691,377 - Nakamura , et al. April 8, 2
2014-04-08
Soldering material and electronic component assembly
Grant 8,598,464 - Sakatani , et al. December 3, 2
2013-12-03
Mounting structure
Grant 8,552,307 - Hine , et al. October 8, 2
2013-10-08
Semiconductor Bonding Structure Body And Manufacturing Method Of Semiconductor Bonding Structure Body
App 20130241069 - Nakamura; Taichi ;   et al.
2013-09-19
Semiconductor device mounted structure and its manufacturing method
Grant 8,450,859 - Ohashi , et al. May 28, 2
2013-05-28
Joint structure and electronic component
Grant 8,421,246 - Furusawa , et al. April 16, 2
2013-04-16
Mounted structure
Grant 8,410,377 - Yamaguchi , et al. April 2, 2
2013-04-02
Mounting structure for semiconductor element with underfill resin
Grant 8,378,472 - Matsuno , et al. February 19, 2
2013-02-19
Structure with electronic component mounted therein and method for manufacturing such structure
Grant 8,345,444 - Sakatani , et al. January 1, 2
2013-01-01
Joint structure, joining material, and method for producing joining material containing bismuth
Grant 8,338,966 - Furusawa , et al. December 25, 2
2012-12-25
Laser Array Light Source Unit
App 20120287954 - SARUWATARI; Naoto ;   et al.
2012-11-15
Bonded structure and manufacturing method for bonded structure
Grant 8,268,718 - Nakamura , et al. September 18, 2
2012-09-18
Semiconductor Component, Semiconductor Wafer Component, Manufacturing Method Of Semiconductor Component, And Manufacturing Method Of Joining Structure
App 20120153461 - Kitaura; Hidetoshi ;   et al.
2012-06-21
Mounted structural body and method of manufacturing the same
Grant 8,179,686 - Sakatani , et al. May 15, 2
2012-05-15
Mounting structure
Grant 8,138,426 - Matsuno , et al. March 20, 2
2012-03-20
Semiconductor Device
App 20120018890 - Nakamura; Taichi ;   et al.
2012-01-26
Mounting Structure
App 20110284278 - Hine; Kiyohiro ;   et al.
2011-11-24
Electroconductive bonding material and electric/electronic device using the same
Grant 8,012,379 - Miyakawa , et al. September 6, 2
2011-09-06
Bonded Structure And Manufacturing Method For Bonded Structure
App 20110175224 - NAKAMURA; Taichi ;   et al.
2011-07-21
Soldering Material And Electronic Component Assembly
App 20110120769 - Sakatani; Shigeaki ;   et al.
2011-05-26
Joint Structure, Joining Material And Method For Producing Joining Material
App 20110108996 - Furusawa; Akio ;   et al.
2011-05-12
Structure With Electronic Component Mounted Therein And Method For Manufacturing Such Structure
App 20110110050 - Sakatani; Shigeaki ;   et al.
2011-05-12
Electronic circuit device and method for manufacturing same
Grant 7,935,892 - Nishikawa , et al. May 3, 2
2011-05-03
Semiconductor Device Mounted Structure And Its Manufacturing Method
App 20110095423 - Ohashi; Naomichi ;   et al.
2011-04-28
Solder Joint Structure, And Joining Method Of The Same
App 20110042817 - Furusawa; Akio ;   et al.
2011-02-24
Electroconductive Bonding Material And Electric/electronic Device Using The Same
App 20100316794 - MIYAKAWA; Hidenori ;   et al.
2010-12-16
Joint Structure And Electronic Component
App 20100301481 - Furusawa; Akio ;   et al.
2010-12-02
Mounting Structure
App 20100224398 - Matsuno; Koso ;   et al.
2010-09-09
Card type information device and method for manufacturing same
Grant 7,775,446 - Ochi , et al. August 17, 2
2010-08-17
Semiconductor Device And Method For Fabricating The Same
App 20100148367 - MATSUO; Takahiro ;   et al.
2010-06-17
Heat Curable Resin Composition, And Mounting Method And Reparing Process For Circuit Board Using The Heat Curable Composition
App 20090236036 - Miyakawa; Hidenori ;   et al.
2009-09-24
Card Type Information Device And Method For Manufacturing Same
App 20090173795 - Ochi; Shozo ;   et al.
2009-07-09
Electronic Circuit Device And Method For Manufacturing Same
App 20090133900 - Nishikawa; Kazuhiro ;   et al.
2009-05-28
Mounted Structural Body And Method Of Manufacturing The Same
App 20090120675 - SAKATANI; Shigeaki ;   et al.
2009-05-14
Mounting Structure
App 20090116203 - MATSUNO; Koso ;   et al.
2009-05-07
Mounted Structure
App 20090116205 - Yamaguchi; Atsushi ;   et al.
2009-05-07
Electroconductive Bonding Material and Electric/Electronic Device Using the Same
App 20090032293 - Miyakawa; Hidenori ;   et al.
2009-02-05

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