Sakamoto; Ichizo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sakamoto; Ichizo.The latest application filed is for "method for forming plating".

Company Profile

2.2.7

Sakamoto; Ichizo - Kyoto JP
Sakamoto; Ichizo - Moriyama JP
SAKAMOTO; Ichizo - Moriyama-shi JP
Sakamoto; Ichizo - Shiga JP
SAKAMOTO; Ichizo - Osaka JP
Sakamoto; Ichizo - Hyogo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Forming Plating App 20200010971 - Sakamoto; Ichizo ; et al.	2020-01-09
Contact member, sliding contact, electrical device and method for producing contact member having electrical contact surface layer comprising coated particles Grant 10,381,174 - Sakamoto , et al. A	2019-08-13
Contact Member, Sliding Contact, Electrical Device And Method For Producing Contact Member App 20180174774 - SAKAMOTO; Ichizo ; et al.	2018-06-21
Limit Switch Device App 20170263393 - Tsukimori; Kazuyuki ; et al.	2017-09-14
Content Processing Apparatus App 20120089858 - MATSUMURA; Hideki ; et al.	2012-04-12
Sealing Structure Of Terminal And Sealing Material Therefor App 20090039545 - Hayase; Tetsuo ; et al.	2009-02-12
Disc apparatus for reproducing a signal on a disc using a laser beam Grant 7,187,631 - Minechika , et al. March 6, 2	2007-03-06
Disk unit App 20050088930 - Minechika, Shigekazu ; et al.	2005-04-28
Sealing structure of terminal and sealing material therefor App 20050072591 - Hayase, Tetsuo ; et al.	2005-04-07

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