loadpatents
name:-0.027981042861938
name:-0.018369913101196
name:-0.00047588348388672
SAKAI; Shunsuke Patent Filings

SAKAI; Shunsuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for SAKAI; Shunsuke.The latest application filed is for "wiring substrate".

Company Profile
0.27.28
  • SAKAI; Shunsuke - Ogaki JP
  • SAKAI; Shunsuke - Ogaki-shi JP
  • Sakai; Shunsuke - Osaka JP
  • Sakai; Shunsuke - Anan N/A JP
  • Sakai; Shunsuke - Anan-si JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wiring Substrate
App 20220192018 - SAKAI; Shunsuke ;   et al.
2022-06-16
Printed wiring board and method for manufacturing the same
Grant 10,477,682 - Ishihara , et al. Nov
2019-11-12
Printed Wiring Board And Method For Manufacturing The Same
App 20190215958 - Ishihara; Teruyuki ;   et al.
2019-07-11
Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the same
Grant 10,070,523 - Sakai , et al. September 4, 2
2018-09-04
Multilayer wiring board with built-in electronic component
Grant 9,859,221 - Shimabe , et al. January 2, 2
2018-01-02
Printed wiring board and semiconductor package
Grant 9,564,392 - Furutani , et al. February 7, 2
2017-02-07
Printed Wiring Board And Semiconductor Package
App 20160336261 - FURUTANI; Toshiki ;   et al.
2016-11-17
Printed Wiring Board And Method For Manufacturing The Same
App 20160316558 - SAKAI; Shunsuke ;   et al.
2016-10-27
Multilayer Wiring Board
App 20160255717 - FURUTANI; Toshiki ;   et al.
2016-09-01
Printed wiring board
Grant 9,320,148 - Mikado , et al. April 19, 2
2016-04-19
Multilayer wiring board with built-in electronic component and method for manufacturing the same
Grant 9,282,635 - Shimabe , et al. March 8, 2
2016-03-08
Printed Wiring Board, Method For Manufacturing The Same And Semiconductor Package
App 20160044783 - Furutani; Toshiki ;   et al.
2016-02-11
Printed Wiring Board And Semiconductor Package
App 20160043024 - FURUTANI; Toshiki ;   et al.
2016-02-11
Multilayer Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same
App 20150282305 - SHIMABE; Toyotaka ;   et al.
2015-10-01
Multilayer Wiring Board With Built-in Electronic Component
App 20150245492 - SHIMABE; Toyotaka ;   et al.
2015-08-27
Wiring board and method for manufacturing the same
Grant 9,119,322 - Mikado , et al. August 25, 2
2015-08-25
Instant noodles and method for producing the same
Grant 8,968,813 - Takahashi , et al. March 3, 2
2015-03-03
Printed wiring board
Grant 8,957,320 - Furutani , et al. February 17, 2
2015-02-17
Wiring Board And Method For Manufacturing The Same
App 20150022982 - MIKADO; Yukinobu ;   et al.
2015-01-22
Wiring board and method for manufacturing the same
Grant 8,908,387 - Mikado , et al. December 9, 2
2014-12-09
Wiring board and method for manufacturing the same
Grant 8,829,357 - Mikado , et al. September 9, 2
2014-09-09
Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same
App 20140247571 - SAKAI; Shunsuke ;   et al.
2014-09-04
Feed additive composition for ruminants, and feed containing the same, and method of fabricating such feed additive composition for ruminants
Grant 8,642,070 - Okutani , et al. February 4, 2
2014-02-04
Wiring board and method for manufacturing the same
Grant 8,642,897 - Sakai February 4, 2
2014-02-04
Printed Wiring Board
App 20130192883 - FURUTANI; Toshiki ;   et al.
2013-08-01
Wiring Board And Method For Manufacturing The Same
App 20130194764 - MIKADO; Yukinobu ;   et al.
2013-08-01
Wiring board with built-in electronic component and method for manufacturing the same
Grant 8,466,372 - Sakai , et al. June 18, 2
2013-06-18
Diversity receiving apparatus and diversity receiving method
Grant 8,385,486 - Soga , et al. February 26, 2
2013-02-26
Diversity receiving apparatus and diversity receiving method
Grant 8,335,281 - Soga , et al. December 18, 2
2012-12-18
Instant Noodles And Method For Producing The Same
App 20120288607 - Takahashi; Rintaro ;   et al.
2012-11-15
Wiring board and method for manufacturing the same
Grant 8,299,366 - Sato , et al. October 30, 2
2012-10-30
Printed Wiring Board
App 20120250277 - MIKADO; Yukinobu ;   et al.
2012-10-04
Wiring Board And Method For Manufacturing The Same
App 20120186866 - MIKADO; Yukinobu ;   et al.
2012-07-26
Wiring Board And Method For Manufacturing The Same
App 20120188734 - MIKADO; Yukinobu ;   et al.
2012-07-26
Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same
App 20120142147 - SAKAI; Shunsuke ;   et al.
2012-06-07
Wiring Board And Method For Manufacturing The Same
App 20120085572 - SAKAI; Shunsuke
2012-04-12
Wiring Board And Method For Manufacturing Wiring Board
App 20110240354 - FURUHATA; Naoki ;   et al.
2011-10-06
Wiring Board And Method For Manufacturing The Same
App 20100300737 - SATO; Kenji ;   et al.
2010-12-02
Diversity Receiving Apparatus And Diversity Receiving Method
App 20100284492 - Soga; Shigeru ;   et al.
2010-11-11
Diversity Receiving Apparatus And Diversity Receiving Method
App 20100183097 - Soga; Shigeru ;   et al.
2010-07-22
Receiving apparatus, receiving system using same, and receiving method thereof
Grant 7,720,113 - Sakai , et al. May 18, 2
2010-05-18
Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same
App 20100078205 - SAKAI; Shunsuke ;   et al.
2010-04-01
Receiving Apparatus, Receiving System Using Same, And Receiving Method Thereof
App 20070274399 - Sakai; Shunsuke ;   et al.
2007-11-29
Feed additive composition for ruminants, and feed containing the same, and method of fabricating such feed additive composition for ruminants
App 20070148212 - Okutani; Akira ;   et al.
2007-06-28

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