SAKAI; Hisaya

Patent Applications and Registrations

Patent applications and USPTO patent grants for SAKAI; Hisaya.The latest application filed is for "three-dimensional memory device with a dielectric isolation spacer and methods of forming the same".

Company Profile

1.19.21

SAKAI; Hisaya - Yokkaichi JP
Sakai; Hisaya - Kawasaki N/A JP
Sakai; Hisaya - Kawasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Three-dimensional Memory Device With A Dielectric Isolation Spacer And Methods Of Forming The Same App 20210351109 - SATO; Jo ; et al.	2021-11-11
Three-dimensional memory device with a dielectric isolation spacer and methods of forming the same Grant 11,152,284 - Sato , et al. October 19, 2	2021-10-19
Three-dimensional Memory Device With Via Structures Surrounded By Perforated Dielectric Moat Structure And Methods Of Making The Same App 20210210428 - OHSAWA; Kazuto ; et al.	2021-07-08
Semiconductor device having wirings formed by damascene Grant 8,546,949 - Oryoji , et al. October 1, 2	2013-10-01
Method of manufacturing a semiconductor device and semiconductor device Grant 8,536,708 - Akiyama , et al. September 17, 2	2013-09-17
Method of forming wiring structure and semiconductor device comprising underlying refractory metal layers Grant 8,373,274 - Sakai , et al. February 12, 2	2013-02-12
Method Of Manufacturing A Semiconductor Device And Semiconductor Device App 20120326315 - Akiyama; Shinichi ; et al.	2012-12-27
Method of manufacturing a semiconductor device and semiconductor device Grant 8,338,953 - Akiyama , et al. December 25, 2	2012-12-25
Manufacture method for semiconductor device using damascene method Grant 8,101,513 - Kanki , et al. January 24, 2	2012-01-24
Method Of Manufacturing A Semiconductor Device And Semiconductor Device App 20110241211 - AKIYAMA; Shinichi ; et al.	2011-10-06
Method of manufacturing a semiconductor device and semiconductor device Grant 8,030,207 - Akiyama , et al. October 4, 2	2011-10-04
Method of manufacturing semiconductor apparatus, and semiconductor apparatus Grant 7,994,055 - Sakai , et al. August 9, 2	2011-08-09
Fabrication method of semiconductor device having a barrier layer containing Mn Grant 7,935,624 - Ohtsuka , et al. May 3, 2	2011-05-03
Semiconductor device having wirings formed by damascene and its manufacture method Grant 7,906,433 - Oryoji , et al. March 15, 2	2011-03-15
Semiconductor Device And Fabrication Process Thereof App 20110021020 - Sakai; Hisaya ; et al.	2011-01-27
Semiconductor Device Having Wirings Formed By Damascene App 20100193965 - ORYOJI; Michio ; et al.	2010-08-05
Semiconductor device and method for fabricating the same Grant 7,579,277 - Owada , et al. August 25, 2	2009-08-25
Method Of Manufacturing A Semiconductor Device And Semiconductor Device App 20080284027 - AKIYAMA; Shinichi ; et al.	2008-11-20
Method Of Manufacturing Semiconductor Apparatus, And Semiconductor Apparatus App 20080179747 - SAKAI; Hisaya ; et al.	2008-07-31
Method of forming wiring structure and semiconductor device App 20080142973 - Sakai; Hisaya ; et al.	2008-06-19
Wiring structure forming method and semiconductor device Grant 7,381,643 - Sakai , et al. June 3, 2	2008-06-03
Method of forming wiring structure and semiconductor device Grant 7,358,180 - Sakai , et al. April 15, 2	2008-04-15
Semiconductor device and fabrication process thereof App 20080067680 - Sakai; Hisaya ; et al.	2008-03-20
Semiconductor Device Manufacturing Method App 20080057717 - OWADA; Tamotsu ; et al.	2008-03-06
Semiconductor device having wirings formed by damascene and its manufacture method App 20070218671 - Oryoji; Michio ; et al.	2007-09-20
Semiconductor device and method for fabricating the same App 20070197032 - Owada; Tamotsu ; et al.	2007-08-23
Fabrication method of semiconductor device App 20070173055 - Ohtsuka; Nobuyuki ; et al.	2007-07-26
Manufacture method for semiconductor device using damascene method App 20070134899 - Kanki; Tsuyoshi ; et al.	2007-06-14
Wiring structure forming method and semiconductor device App 20060189115 - Sakai; Hisaya ; et al.	2006-08-24
Semiconductor device and method of manufacturing the same Grant 6,992,005 - Ohtsuka , et al. January 31, 2	2006-01-31
Method of forming wiring structure and semiconductor device App 20050194691 - Sakai, Hisaya ; et al.	2005-09-08
Wiring structure forming method and semiconductor device App 20050151263 - Sakai, Hisaya ; et al.	2005-07-14
Semiconductor device having increased adhesion between a barrier layer for preventing copper diffusion and a conductive layer, and method of manufacturing the same Grant 6,900,542 - Sakai , et al. May 31, 2	2005-05-31
Semiconductor device and method of manufacturing the same App 20040188839 - Ohtsuka, Nobuyuki ; et al.	2004-09-30
Semiconductor device Grant 6,750,541 - Ohtsuka , et al. June 15, 2	2004-06-15
Semiconductor device and method of manufacturing the same App 20040000716 - Sakai, Hisaya ; et al.	2004-01-01
Semiconductor device and method of manufacturing the same App 20020158338 - Ohtsuka, Nobuyuki ; et al.	2002-10-31

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