Sachan; Vikas
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sachan; Vikas.The latest application filed is for "semiconductor wafer inspection using care area group-specific threshold settings for detecting defects".
- Sachan; Vikas - Cupertino CA
- Sachan; Vikas - Richardson TX
- Sachan; Vikas - Hockessin DE
| Patent | Date |
|---|---|
| Semiconductor wafer inspection using care area group-specific threshold settings for detecting defects Grant 10,146,036 - Dhagat , et al. De | 2018-12-04 |
| Semiconductor Wafer Inspection Using Care Area Group-specific Threshold Settings For Detecting Defects App 20170352145 - Dhagat; Parul ; et al. | 2017-12-07 |
| Polishing compositions for noble metals Grant 7,270,762 - Wang , et al. September 18, 2 | 2007-09-18 |
| Composition and method for polishing in metal CMP Grant 6,699,299 - Sachan , et al. March 2, 2 | 2004-03-02 |
| Methods to control film removal rates for improved polishing in metal CMP Grant 6,693,035 - Sachan , et al. February 17, 2 | 2004-02-17 |
| Composition and method for polishing in metal CMP App 20030181046 - Sachan, Vikas ; et al. | 2003-09-25 |
| Polishing compositions for noble metals App 20030176072 - Wang, Hongyu ; et al. | 2003-09-18 |
| Composition and method for polishing in metal CMP Grant 6,616,717 - Sachan , et al. September 9, 2 | 2003-09-09 |
| Dissolution of metal particles produced by polishing Grant 6,602,112 - Tran , et al. August 5, 2 | 2003-08-05 |
| Planarization of silicon carbide hardmask material App 20030139069 - Block, Kelly H. ; et al. | 2003-07-24 |
| Polishing composition for CMP having abrasive particles App 20030006396 - Wang, Hongyu ; et al. | 2003-01-09 |
| Chemical mechanical polishing slurries for metal Grant 6,447,373 - Lack , et al. September 10, 2 | 2002-09-10 |
| Polishing compositions for noble metals App 20020111027 - Sachan, Vikas ; et al. | 2002-08-15 |
| Polishing compositions for noble metals App 20020039839 - Thomas, Terence M. ; et al. | 2002-04-04 |
| Control of removal rates in CMP App 20020019202 - Thomas, Terence M. ; et al. | 2002-02-14 |
| Dissolution of metal particles produced by polishing App 20010039166 - Tran, Tony Quan ; et al. | 2001-11-08 |
| Composition and method for polishing in metal CMP App 20010024933 - Sachan, Vikas ; et al. | 2001-09-27 |
| Method for CMP of low dielectric constant polymer layers App 20010013507 - Hosali, Sharath D. ; et al. | 2001-08-16 |
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