Ryu; Chang Sup

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ryu; Chang Sup.The latest application filed is for "method for forming bumps and substrate including the bumps".

Company Profile

0.51.109

Ryu; Chang Sup - Suwon-si KR
RYU; Chang Sup - Yongin-si KR
Ryu; Chang Sup - Suwon KR
Ryu; Chang Sup - Gyunggi-do N/A KR
Ryu; Chang-Sup - Yongin KR
RYU; Chang Sup - Gyeonggi-do KR
Ryu; Chang Sup - Daejeon KR
Ryu, Chang-Sup - Daejeon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composition for photoresist development and method of developing photoresist using the same Grant 9,235,129 - Lee , et al. January 12, 2	2016-01-12
Method For Forming Bumps And Substrate Including The Bumps App 20150373856 - CHOI; Cheol Ho ; et al.	2015-12-24
Method for forming solder resist and substrate for package Grant 9,040,838 - Lee , et al. May 26, 2	2015-05-26
Multi chip package Grant 8,981,549 - Kim , et al. March 17, 2	2015-03-17
Method of fabricating cavity capacitor embedded in printed circuit board Grant 8,966,746 - Kim , et al. March 3, 2	2015-03-03
Composition For Photoresist Development And Method Of Developing Photoresist Using The Same App 20140370446 - Lee; Chang Bo ; et al.	2014-12-18
Printed circuit board and method of manufacturing the same Grant 8,865,393 - Hong , et al. October 21, 2	2014-10-21
Printed circuit board and electro application Grant 8,780,584 - Kim , et al. July 15, 2	2014-07-15
Package Substrate, Method For Manufacturing The Same, And Package On Package Substrate App 20140183726 - LEE; Chang Bo ; et al.	2014-07-03
Basket Jig For Electroless Plating Apparatus And Electroless Plating Method App 20140099433 - NAM; Hyo Seung ; et al.	2014-04-10
Method Of Forming Gold Thin Film And Printed Circuit Board App 20140076618 - CHO; Seong Min ; et al.	2014-03-20
Method For Forming Solder Resist And Substrate For Package App 20140054073 - LEE; Chang Bo ; et al.	2014-02-27
Flat Dam And Method For Manufacturing Chip Package Using The Same App 20140041911 - Lee; Chang Bo ; et al.	2014-02-13
Method For Manufacturing Printed Circuit Board App 20140037862 - Lee; Chang Bo ; et al.	2014-02-06
Package Substrate App 20130313004 - AN; Jin-Yong ; et al.	2013-11-28
Method of manufacturing printed circuit board Grant 8,592,135 - Mok , et al. November 26, 2	2013-11-26
Printed Circuit Board And Electro Application App 20130229779 - KIM; Han ; et al.	2013-09-05
Method of manufacturing a package substrate Grant 8,499,444 - An , et al. August 6, 2	2013-08-06
Etching Solution And Method Of Manufacturing Printed Wiring Substrate Using The Same App 20130175238 - HONG; Dae Jo ; et al.	2013-07-11
Method Of Manufacturing An Organic Thin Film Transistor App 20130137212 - HA; Sang Won ; et al.	2013-05-30
Printed circuit board and electro application Grant 8,432,706 - Kim , et al. April 30, 2	2013-04-30
Printed circuit substrate and method of manufacturing the same Grant 8,410,373 - Park , et al. April 2, 2	2013-04-02
Method of manufacturing cooling fin and package substrate with cooling fin Grant 8,377,748 - Lee , et al. February 19, 2	2013-02-19
Method For Forming Bumps And Substrate Including The Bumps App 20130026626 - CHOI; Cheol Ho ; et al.	2013-01-31
Electromagnetic bandgap structure and printed circuit board Grant 8,310,840 - Kim , et al. November 13, 2	2012-11-13
Method Of Manufacturing A Printed Circuit Board App 20120222299 - MOK; Jee Soo ; et al.	2012-09-06
Printed Circuit Board And Manufacturing Method Thereof App 20120199388 - KIM; Joon-Sung ; et al.	2012-08-09
Electromagnetic interference noise reduction board using electromagnetic bandgap structure Grant 8,232,478 - Kim , et al. July 31, 2	2012-07-31
Multi-layer Printed Circuit Board And Method Of Manufacturing The Same App 20120168220 - Lee; Han Ul ; et al.	2012-07-05
Multi Chip Package App 20120168960 - KIM; Hye Jin ; et al.	2012-07-05
Method Of Manufacturing Printed Circuit Board App 20120148960 - Mok; Jee Soo ; et al.	2012-06-14
Printed circuit board and method of manufacturing the same Grant 8,198,550 - Mok , et al. June 12, 2	2012-06-12
Printed Circuit Board And Method Of Manufacturing The Same App 20120138336 - WATANABE; Ryoichi ; et al.	2012-06-07
Method of manufacturing a printed circuit board Grant 8,181,339 - Kim , et al. May 22, 2	2012-05-22
Electromagnetic bandgap structure and printed circuit board Grant 8,169,790 - Kim , et al. May 1, 2	2012-05-01
Apparatus for manufacturing printed circuit board Grant 8,151,446 - Mok , et al. April 10, 2	2012-04-10
Carrier Member For Transmitting Circuits, Coreless Printed Circuit Board Using The Carrier Member, And Method Of Manufacturing The Same App 20120073865 - Kang; Myung Sam ; et al.	2012-03-29
Method Of Manufacturing Printed Circuit Board Including Landless Via App 20120066902 - Kim; Han ; et al.	2012-03-22
Printed Circuit Board And Method Of Manufacturing The Same App 20120043126 - HONG; Dae Jo ; et al.	2012-02-23
Method of manufacturing multilayered printed circuit board App 20120005894 - Mok; Jee Soo ; et al.	2012-01-12
Method of manufacturing cooling fin and package substrate with cooling fin App 20110308069 - LEE; Eung Suek ; et al.	2011-12-22
Method of manufacturing mounting substrate App 20110303636 - Ahn; Jin-Yong ; et al.	2011-12-15
Printed circuit substrate and method of manufacturing the same App 20110253431 - Park; Hyung Wook ; et al.	2011-10-20
Flexible fuel cell Grant 8,039,174 - Cha , et al. October 18, 2	2011-10-18
Mounting substrate and manufacturing method thereof Grant 8,022,553 - Ahn , et al. September 20, 2	2011-09-20
Board on chip package App 20110221074 - Kang; Myung-Sam ; et al.	2011-09-15
Board on chip package and manufacturing method thereof Grant 8,003,439 - Kang , et al. August 23, 2	2011-08-23
Method of fabricating cavity capacitor embedded in printed circuit board App 20110197409 - Kim; Han ; et al.	2011-08-18
Printed circuit board with embedded cavity capacitor Grant 7,983,055 - Kim , et al. July 19, 2	2011-07-19
Printed circuit board using paste bump and manufacturing method thereof Grant 7,973,248 - Mok , et al. July 5, 2	2011-07-05
Organic Thin Film Transistor And Method Of Manufacturing The Same App 20110147724 - HA; Sang Won ; et al.	2011-06-23
Printed circuit board having electromagnetic bandgap structure Grant 7,943,864 - Kim , et al. May 17, 2	2011-05-17
Method of manufacturing printed circuit board App 20110079349 - Cho; Suk Hyeon ; et al.	2011-04-07
Printed circuit board and method of manufacturing the same App 20110061907 - Kang; Myung Sam ; et al.	2011-03-17
Method for manufacturing package on package with cavity Grant 7,901,985 - Mok , et al. March 8, 2	2011-03-08
Optical wiring board having a core App 20110039076 - Kim; Joon-Sung ; et al.	2011-02-17
Printed circuit board and electro application App 20110026234 - Kim; Han ; et al.	2011-02-03
Semiconductor package and method of manufacturing the same App 20110018123 - An; Jin Yong ; et al.	2011-01-27
Multilayer printed circuit board using paste bumps Grant 7,859,106 - Oh , et al. December 28, 2	2010-12-28
Circuit Layer Comprising Cnts And Method Of Manufacturing The Same App 20100230146 - LEE; Eung Suek ; et al.	2010-09-16
Electromagnetic interference noise reduction board using electromagnetic bandgap structure App 20100212951 - Kim; Han ; et al.	2010-08-26
Printed circuit board and method of manufacturing the same App 20100175915 - Mok; Jee Soo ; et al.	2010-07-15
Method of fabricating multilayer printed circuit board Grant 7,707,715 - Okabe , et al. May 4, 2	2010-05-04
Method of fabricating multilayer printed circuit board App 20100024212 - Okabe; Shuhichi ; et al.	2010-02-04
Core substrate and multilayer printed circuit board using paste bumps App 20100025092 - Oh; Yoong ; et al.	2010-02-04
Method for manufacturing package on package with cavity App 20100022052 - Mok; Jee-Soo ; et al.	2010-01-28
Printed circuit board and method of manufacturing the same App 20090308650 - Lee; Eung Suek ; et al.	2009-12-17
Printed circuit board and method of manufacturing the same App 20090301767 - Mok; Jee Soo ; et al.	2009-12-10
Printed circuit board including landless via and method of manufacturing the same App 20090294164 - Kim; Han ; et al.	2009-12-03
Conductive Paste Including A Carbon Nanotube And Printed Circuit Board Using The Same App 20090294739 - Lee; Eung-Suek ; et al.	2009-12-03
Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof App 20090294956 - Lee; Eung Suek ; et al.	2009-12-03
Method for fabricating core substrate using paste bumps Grant 7,622,329 - Oh , et al. November 24, 2	2009-11-24
Coreless substrate and manufacturing thereof Grant 7,605,459 - Mok , et al. October 20, 2	2009-10-20
Multilayered printed circuit board and method of manufacturing the same App 20090250259 - Mok; Jee Soo ; et al.	2009-10-08
Multilayered printed circuit board and method of manufacturing the same App 20090236131 - Mok; Jee Soo ; et al.	2009-09-24
Multilayered printed circuit board and method of manufacturing the same App 20090236130 - Mok; Jee Soo ; et al.	2009-09-24
Package board, semiconductor package, and fabricating method thereof Grant 7,592,708 - Kim , et al. September 22, 2	2009-09-22
Printed circuit board having fine pattern and manufacturing method thereof App 20090229875 - Mok; Jee-Soo ; et al.	2009-09-17
Printed circuit board including embedded passive component Grant 7,583,512 - Ryu , et al. September 1, 2	2009-09-01
Board on chip package and manufacturing method thereof App 20090206468 - Kang; Myung-Sam ; et al.	2009-08-20
Post bump and method of forming the same App 20090184420 - Choi; Jin-Won ; et al.	2009-07-23
Printed circuit board with embedded capacitors therein and manufacturing process thereof Grant 7,564,116 - Ahn , et al. July 21, 2	2009-07-21
Printed circuit board and manufacturing method thereof App 20090173531 - Kim; Joon-Sung ; et al.	2009-07-09
Package substrate and manufacturing method thereof App 20090169837 - An; Jin-Yong ; et al.	2009-07-02
Board on chip package and manufacturing method thereof Grant 7,550,316 - Kang , et al. June 23, 2	2009-06-23
Printed Circuit Board Having Chip Package Mounted Thereon And Method Of Fabricating Same App 20090152233 - CHO; Suk Hyeon ; et al.	2009-06-18
Printed Circuit Board Having Chip Package Mounted Thereon And Method Of Fabricating Same App 20090147488 - Cho; Suk Hyeon ; et al.	2009-06-11
Optical wiring board and manufacturing method thereof App 20090130390 - Kim; Joon-Sung ; et al.	2009-05-21
Electrical member and method of manufacturing a printed circuit board using the same App 20090120660 - Park; Dong-Jin ; et al.	2009-05-14
Conductive Paste And Printed Circuit Board Using The Same App 20090114425 - LEE; Eung-Suek ; et al.	2009-05-07
Printed circuit board and manufacturing method thereof App 20090107709 - MOK; Jee-Soo ; et al.	2009-04-30
Method of interconnecting layers of a printed circuit board App 20090083975 - Lee; Eung-Suek ; et al.	2009-04-02
Substrate manufacturing method App 20090084494 - An; Jin-Yong ; et al.	2009-04-02
Cavity capacitor fabrication method and printed circuit board having embedded cavity capacitor App 20090084591 - Kim; Han ; et al.	2009-04-02
Printed circuit board with embedded cavity capacitor App 20090086451 - Kim; Han ; et al.	2009-04-02
Printed circuit board having chip package mounted thereon and method of fabricating same Grant 7,506,437 - Cho , et al. March 24, 2	2009-03-24
Printed circuit board using paste bump and manufacturing method thereof App 20090064497 - Mok; Jee-Soo ; et al.	2009-03-12
Method of fabricating multilayer printed circuit board App 20090056119 - Okabe; Shuhichi ; et al.	2009-03-05
Apparatus and method for manufacturing printed circuit board App 20090049683 - Mok; Jee-Soo ; et al.	2009-02-26
Electromagnetic bandgap structure and printed circuit board App 20090039984 - Kim; Han ; et al.	2009-02-12
Electromagnetic bandgap structure and printed curcuit board App 20090038840 - Kim; Han ; et al.	2009-02-12
Printed circuit board including embedded chips and method of fabricating the same Grant 7,485,569 - Ryu , et al. February 3, 2	2009-02-03
Heat-releasing printed circuit board and manufacturing method thereof App 20090017275 - Lee; Eung-Suek ; et al.	2009-01-15
Board having buried patterns and manufacturing method thereof App 20090008143 - Ahn; Jin-Yong ; et al.	2009-01-08
Printed circuit board having electromagnetic bandgap structure App 20080314635 - Kim; Han ; et al.	2008-12-25
Mounting substrate and manufacturing method thereof App 20080315431 - Ahn; Jin-Yong ; et al.	2008-12-25
Parallel chip embedded printed circuit board and manufacturing method thereof App 20080314621 - Ahn; Jin-Yong ; et al.	2008-12-25
Printed circuit board using paste bump and manufacturing method thereof App 20080283288 - Mok; Jee-Soo ; et al.	2008-11-20
Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same App 20080264684 - Kang; Myung Sam ; et al.	2008-10-30
Printed circuit board and manufacturing method thereof App 20080225501 - Cho; Chung-Woo ; et al.	2008-09-18
Printed circuit board with weak magnetic field sensor Grant 7,394,249 - Kang , et al. July 1, 2	2008-07-01
Printed Circuit Board Including Embedded Passive Component And Method Of Fabricating Same App 20080123308 - Ryu; Chang Sup ; et al.	2008-05-29
Printed circuit board with embedded capacitors therein and manufacturing process thereof Grant 7,378,326 - Ahn , et al. May 27, 2	2008-05-27
Printed Circuit Board Including Embedded Chips And Method Of Fabricating The Same App 20080106879 - Ryu; Chang Sup ; et al.	2008-05-08
Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same Grant 7,351,915 - Ahn , et al. April 1, 2	2008-04-01
Method of fabricating a printed circuit board including an embedded passive component Grant 7,350,296 - Ryu , et al. April 1, 2	2008-04-01
Printed circuit board having weak magnetic field sensor and method of manufacturing the same Grant 7,348,772 - Kang , et al. March 25, 2	2008-03-25
Actuator employing a bobbin incorporating a winding coil and a manufacturing method thereof Grant 7,337,453 - Kang , et al. February 26, 2	2008-02-26
Method for manufacturing circuit board with built-in electronic components Grant 7,328,504 - Kim , et al. February 12, 2	2008-02-12
Printed circuit board including embedded chips and method of fabricating the same using plating Grant 7,282,394 - Cho , et al. October 16, 2	2007-10-16
Printed circuit board including embedded resistor and method of fabricating the same Grant 7,277,005 - Kang , et al. October 2, 2	2007-10-02
Board on chip package and manufacturing method thereof App 20070210439 - Kang; Myung-Sam ; et al.	2007-09-13
Package on package with cavity and method for manufacturing thereof App 20070187810 - Mok; Jee-Soo ; et al.	2007-08-16
Printed Circuit Board Including Embedded Capacitor Having High Dielectric Constant And Method Of Fabricating Same App 20070146980 - Ahn; Jin-Yong ; et al.	2007-06-28
Flexible fuel cell App 20070138133 - Cha; Hye Yeon ; et al.	2007-06-21
Solder bonding structure using bridge type pattern App 20070126126 - Kim; Seung Gu ; et al.	2007-06-07
Core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof App 20070120253 - Oh; Yoong ; et al.	2007-05-31
Printed circuit board using paste bump and manufacturing method thereof App 20070107934 - Mok; Jee-Soo ; et al.	2007-05-17
Fabricating method of printed circuit board having embedded component App 20070111380 - Cho; Suk-Hyeon ; et al.	2007-05-17
Package board, semiconductor package, and fabricating method thereof App 20070080469 - Kim; Seung-Gu ; et al.	2007-04-12
Printed circuit board having fine pattern and manufacturing method thereof App 20070059917 - Mok; Jee-Soo ; et al.	2007-03-15
Method for manufacturing circuit board with built-in electronic components App 20070006456 - Kim; Seung Gu ; et al.	2007-01-11
Parallel chip embedded printed circuit board and manufacturing method thereof App 20070007636 - Ahn; Jin-Yong ; et al.	2007-01-11
Printed circuit board with embedded electronic components App 20060291173 - Cho; Suk-Hyeon ; et al.	2006-12-28
Method for manufacturing electronic component-embedded printed circuit board App 20060258053 - Lee; Doo Hwan ; et al.	2006-11-16
Printed circuit board with embedded capacitors therein and manufacturing process thereof App 20060196691 - Ahn; Jin Yong ; et al.	2006-09-07
Embedded chip printed circuit board and method of manufacturing the same App 20060191711 - Cho; Suk Hyeon ; et al.	2006-08-31
Printed circuit board including embedded chips and method of fabricating the same App 20060157832 - Ryu; Chang Sup ; et al.	2006-07-20
Printed circuit board including embedded chips and method of fabricating the same using plating App 20060145331 - Cho; Suk Hyeon ; et al.	2006-07-06
Printed circuit board including embedded capacitor and method of fabricating same App 20060115770 - Hong; Jong Kuk ; et al.	2006-06-01
Printed circuit board having chip package mounted theron and method of fabricating same App 20060060960 - Cho; Suk Hyeon ; et al.	2006-03-23
Printed circuit board including embedded passive component and method of fabricating same App 20060054352 - Ryu; Chang Sup ; et al.	2006-03-16
Printed circuit board including embedded resistor and method of fabricating the same App 20060049913 - Kang; Myung Sam ; et al.	2006-03-09
Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same App 20060044734 - Ahn; Jin-Yong ; et al.	2006-03-02
Printed circuit board having weak magnetic field sensor and method of manufacturing the same App 20060017435 - Kang; Myung-Sam ; et al.	2006-01-26
Method of fabricating PCB including embedded passive chip App 20060014327 - Cho; Suk-Hyeon ; et al.	2006-01-19
Printed circuit board with weak magnetic field sensor and method of fabricating the same App 20060001422 - kang; Myung-Sam ; et al.	2006-01-05
Double-sided printed circuit board without via holes and method of fabricating the same App 20050284657 - Ryu, Chang-Sup ; et al.	2005-12-29
Actuator employing a bobbin incorporating a winding coil and a manufacturing method thereof App 20050060732 - Kang, Myung-Sam ; et al.	2005-03-17
Double-sided printed circuit board without via holes and method of fabricating the same App 20040124003 - Ryu, Chang-Sup ; et al.	2004-07-01