loadpatents
Patent applications and USPTO patent grants for Roppongi; Takahiro.The latest application filed is for "solder material, solder paste, and solder joint".
Patent | Date |
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Solder material, solder paste, and solder joint Grant 11,344,976 - Kawasaki , et al. May 31, 2 | 2022-05-31 |
Cu core ball, solder joint, solder paste and formed solder Grant 10,888,959 - Kawasaki , et al. January 12, 2 | 2021-01-12 |
Soldering material Grant 10,888,957 - Kawasaki , et al. January 12, 2 | 2021-01-12 |
Solder Material, Solder Paste, And Solder Joint App 20200376607 - Kawasaki; Hiroyoshi ;   et al. | 2020-12-03 |
Cu column, Cu core column, solder joint, and through-silicon via Grant 10,811,376 - Kawasaki , et al. October 20, 2 | 2020-10-20 |
Solder material, solder paste, solder preform, solder joint and method of managing the solder material Grant 10,717,157 - Hattori , et al. | 2020-07-21 |
Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint Grant 10,675,719 - Kawasaki , et al. | 2020-06-09 |
Cu core ball, solder joint, solder paste and formed solder Grant 10,639,749 - Kawasaki , et al. | 2020-05-05 |
Flux composition for solder applications Grant 10,610,979 - Maruko , et al. | 2020-04-07 |
Solder Material, Solder Paste, Formed Solder And Solder Joint App 20200061757 - NISHINO; Tomoaki ;   et al. | 2020-02-27 |
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder App 20190375053 - Kawasaki; Hiroyoshi ;   et al. | 2019-12-12 |
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder App 20190375054 - Kawasaki; Hiroyoshi ;   et al. | 2019-12-12 |
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder App 20190376161 - Kawasaki; Hiroyoshi ;   et al. | 2019-12-12 |
Core material, semiconductor package, and forming method of bump electrode Grant 10,381,319 - Nishino , et al. A | 2019-08-13 |
Method of manufacturing cu core ball Grant 10,370,771 - Kawasaki , et al. | 2019-08-06 |
Cu core ball, solder paste, formed solder, Cu core column, and solder joint Grant 10,322,472 - Hattori , et al. | 2019-06-18 |
Solder material, solder joint, and method of manufacturing the solder material Grant 10,173,287 - Kawasaki , et al. J | 2019-01-08 |
Method for producing metal ball, joining material, and metal ball Grant 10,150,185 - Kawasaki , et al. Dec | 2018-12-11 |
Cu core ball Grant 10,147,695 - Kawasaki , et al. De | 2018-12-04 |
Flux App 20180339375 - Maruko; Daisuke ;   et al. | 2018-11-29 |
Cu ball, Cu core ball, solder joint, solder paste, and solder foam Grant 10,137,535 - Kawasaki , et al. November 27, 2 | 2018-11-27 |
Soldering Material, Solder Joint, and Method for Inspecting Soldering Material App 20180281118 - Kawasaki; Hiroyoshi ;   et al. | 2018-10-04 |
Core Material, Semiconductor Package, and Forming Method of Bump Electrode App 20180174991 - Nishino; Tomoaki ;   et al. | 2018-06-21 |
Joining Member, Solder Material, Solder Paste, Formed Solder, Flux Coated Material, and Solder Joint App 20180015572 - Kawasaki; Hiroyoshi ;   et al. | 2018-01-18 |
Solder Material, Solder Paste, Solder Preform, Solder Joint and Method of Managing the Solder Material App 20170312860 - Hattori; Takahiro ;   et al. | 2017-11-02 |
Ni ball, Ni core ball, solder joint, solder paste, and solder foam Grant 9,802,251 - Kawasaki , et al. October 31, 2 | 2017-10-31 |
Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via App 20170287862 - Kawasaki; Hiroyoshi ;   et al. | 2017-10-05 |
Solder Material, Solder Joint, and Method of Manufacturing the Solder Material App 20170252871 - Kawasaki; Hiroyoshi ;   et al. | 2017-09-07 |
Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, and Solder Foam App 20170246711 - Kawasaki; Hiroyoshi ;   et al. | 2017-08-31 |
Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT App 20170233884 - KAWASAKI; Hiroyoshi ;   et al. | 2017-08-17 |
Method for Producing Metal Ball, Joining Material, and Metal Ball App 20170182600 - Kawasaki; Hiroyoshi ;   et al. | 2017-06-29 |
Cu ball Grant 9,668,358 - Kawasaki , et al. May 30, 2 | 2017-05-30 |
Ni Ball, Ni Core Ball, Solder Joint, Solder Paste, and Solder Foam App 20170080491 - Kawasaki; Hiroyoshi ;   et al. | 2017-03-23 |
Cu Core Ball, Solder Paste, Formed Solder, Cu Core Column, and Solder Joint App 20160368105 - Hattori; Takahiro ;   et al. | 2016-12-22 |
Cu Core Ball App 20160148885 - Kawasaki; Hiroyoshi ;   et al. | 2016-05-26 |
Core ball, solder paste, formed-solder, flux-coated core ball and solder joint Grant 9,278,409 - Kawasaki , et al. March 8, 2 | 2016-03-08 |
Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste Grant 9,266,196 - Akagawa , et al. February 23, 2 | 2016-02-23 |
Cu BALL App 20150336216 - HATTORI; Takahiro ;   et al. | 2015-11-26 |
Cu BALL App 20150313025 - KAWASAKI; Hiroyoshi ;   et al. | 2015-10-29 |
Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE App 20150217409 - AKAGAWA; Takashi ;   et al. | 2015-08-06 |
Core Ball, Solder Paste, Formed-solder, Flux-coated Core Ball And Solder Joint App 20150217408 - KAWASAKI; Hiroyoshi ;   et al. | 2015-08-06 |
Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT App 20150209912 - KAWASAKI; Hiroyoshi ;   et al. | 2015-07-30 |
Coated solder spheres and method for producing the same Grant RE45,537 - Sohma , et al. June 2, 2 | 2015-06-02 |
Lead-free solder ball Grant 7,750,475 - Souma , et al. July 6, 2 | 2010-07-06 |
Lead-free solder Grant 7,282,175 - Amagai , et al. October 16, 2 | 2007-10-16 |
Lead-free solder ball App 20070069379 - Souma; Daisuke ;   et al. | 2007-03-29 |
Solder for use on surfaces coated with nickel by electroless plating Grant 7,132,020 - Nozawa , et al. November 7, 2 | 2006-11-07 |
Lead-free solder App 20040262779 - Amagai, Masazumi ;   et al. | 2004-12-30 |
Solder for use on surfaces coated with nickel by electroless plating App 20040126269 - Nozawa, Iwao ;   et al. | 2004-07-01 |
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