Patent | Date |
---|
Laser power sensor for thermally assisted magnetic recording Grant 8,406,090 - Juang , et al. March 26, 2 | 2013-03-26 |
Components and assembly procedure for thermal assisted recording Grant 7,986,592 - Hirano , et al. July 26, 2 | 2011-07-26 |
Components and assembly procedure for thermal assisted recording App 20090225636 - Hirano; Toshiki ;   et al. | 2009-09-10 |
Laser Power Sensor For Thermally Assisted Magnetic Recording App 20090225464 - Juang; Jia-Yang ;   et al. | 2009-09-10 |
System and method for compliant, adaptive hard drive sliders App 20080151426 - Huang; Fu-Ying ;   et al. | 2008-06-26 |
Fabrication process for preparing recording head sliders made from silicon substrates with SiO.sub.2 overcoats Grant 7,196,016 - Buchan , et al. March 27, 2 | 2007-03-27 |
Fabrication process for preparing recording head sliders made from silicon substrates with SiO2 overcoats App 20050070118 - Buchan, Nicholas I. ;   et al. | 2005-03-31 |
Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication Grant 6,802,761 - Beaucage , et al. October 12, 2 | 2004-10-12 |
Pattern-electroplated Lapping Plates For Reduced Loads During Single Slider Lapping And Process For Their Fabrication App 20040185753 - Beaucage, Jacey R. ;   et al. | 2004-09-23 |
Disk drive with improved retract circuit and method Grant 6,643,087 - Kuroki , et al. November 4, 2 | 2003-11-04 |
Silicon sliders with trapezoidal shape and drie process for fabrication App 20020145827 - Bunch, Richard ;   et al. | 2002-10-10 |
Solder balltape and method for making electrical connection between a head transducer and an electrical lead Grant 6,318,624 - Pattanaik , et al. November 20, 2 | 2001-11-20 |
Solder balltape and method for making electrical connection between a head transducer and an electrical lead Grant 6,046,882 - Pattanaik , et al. April 4, 2 | 2000-04-04 |
Microfabricated rotary motion wobble motor and disk drive incorporating it Grant 5,539,267 - Fan , et al. July 23, 1 | 1996-07-23 |
Magnetic recording disk having a contiguous fullerene film and a protective overcoat Grant 5,374,463 - Bethune , et al. December 20, 1 | 1994-12-20 |
Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester Grant 5,189,363 - Bregman , et al. February 23, 1 | 1993-02-23 |
Thermocompression bonding in integrated circuit packaging Grant 5,135,155 - Kang , et al. August 4, 1 | 1992-08-04 |
Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding Grant 5,134,460 - Brady , et al. July 28, 1 | 1992-07-28 |
Multilevel integrated circuit packaging structures Grant 5,028,983 - Bickford , et al. July 2, 1 | 1991-07-02 |
Tab mounted chip burn-in apparatus Grant 4,956,605 - Bickford , et al. September 11, 1 | 1990-09-11 |
Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween Grant 4,862,322 - Bickford , et al. August 29, 1 | 1989-08-29 |
Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape Grant 4,814,855 - Hodgson , et al. March 21, 1 | 1989-03-21 |
Forming patterns in metallic or ceramic substrates Grant 4,555,285 - Chance , et al. November 26, 1 | 1985-11-26 |
Low inductance MLC capacitor with metal impregnation and solder bar contact Grant 4,430,690 - Chance , et al. February 7, 1 | 1984-02-07 |