loadpatents
name:-0.0087578296661377
name:-0.024199962615967
name:-0.00053095817565918
Reiley; Timothy C. Patent Filings

Reiley; Timothy C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Reiley; Timothy C..The latest application filed is for "laser power sensor for thermally assisted magnetic recording".

Company Profile
0.19.6
  • Reiley; Timothy C. - San Jose CA US
  • Reiley; Timothy C. - Cupertino CA
  • Reiley; Timothy C. - Los Gatos CA
  • Reiley; Timothy C. - Losgatos CA
  • Reiley; Timothy C. - Ridgefield CT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laser power sensor for thermally assisted magnetic recording
Grant 8,406,090 - Juang , et al. March 26, 2
2013-03-26
Components and assembly procedure for thermal assisted recording
Grant 7,986,592 - Hirano , et al. July 26, 2
2011-07-26
Components and assembly procedure for thermal assisted recording
App 20090225636 - Hirano; Toshiki ;   et al.
2009-09-10
Laser Power Sensor For Thermally Assisted Magnetic Recording
App 20090225464 - Juang; Jia-Yang ;   et al.
2009-09-10
System and method for compliant, adaptive hard drive sliders
App 20080151426 - Huang; Fu-Ying ;   et al.
2008-06-26
Fabrication process for preparing recording head sliders made from silicon substrates with SiO.sub.2 overcoats
Grant 7,196,016 - Buchan , et al. March 27, 2
2007-03-27
Fabrication process for preparing recording head sliders made from silicon substrates with SiO2 overcoats
App 20050070118 - Buchan, Nicholas I. ;   et al.
2005-03-31
Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication
Grant 6,802,761 - Beaucage , et al. October 12, 2
2004-10-12
Pattern-electroplated Lapping Plates For Reduced Loads During Single Slider Lapping And Process For Their Fabrication
App 20040185753 - Beaucage, Jacey R. ;   et al.
2004-09-23
Disk drive with improved retract circuit and method
Grant 6,643,087 - Kuroki , et al. November 4, 2
2003-11-04
Silicon sliders with trapezoidal shape and drie process for fabrication
App 20020145827 - Bunch, Richard ;   et al.
2002-10-10
Solder balltape and method for making electrical connection between a head transducer and an electrical lead
Grant 6,318,624 - Pattanaik , et al. November 20, 2
2001-11-20
Solder balltape and method for making electrical connection between a head transducer and an electrical lead
Grant 6,046,882 - Pattanaik , et al. April 4, 2
2000-04-04
Microfabricated rotary motion wobble motor and disk drive incorporating it
Grant 5,539,267 - Fan , et al. July 23, 1
1996-07-23
Magnetic recording disk having a contiguous fullerene film and a protective overcoat
Grant 5,374,463 - Bethune , et al. December 20, 1
1994-12-20
Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester
Grant 5,189,363 - Bregman , et al. February 23, 1
1993-02-23
Thermocompression bonding in integrated circuit packaging
Grant 5,135,155 - Kang , et al. August 4, 1
1992-08-04
Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding
Grant 5,134,460 - Brady , et al. July 28, 1
1992-07-28
Multilevel integrated circuit packaging structures
Grant 5,028,983 - Bickford , et al. July 2, 1
1991-07-02
Tab mounted chip burn-in apparatus
Grant 4,956,605 - Bickford , et al. September 11, 1
1990-09-11
Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
Grant 4,862,322 - Bickford , et al. August 29, 1
1989-08-29
Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
Grant 4,814,855 - Hodgson , et al. March 21, 1
1989-03-21
Forming patterns in metallic or ceramic substrates
Grant 4,555,285 - Chance , et al. November 26, 1
1985-11-26
Low inductance MLC capacitor with metal impregnation and solder bar contact
Grant 4,430,690 - Chance , et al. February 7, 1
1984-02-07

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