| Patent | Date |
|---|
Protection Of Seed Layers During Electrodeposition Of Metals In Semiconductor Device Manufacturing
App 20220208604 - Zhu; Huanfeng ; et al. | 2022-06-30 |
Electrodeposition Of Cobalt Tungsten Films
App 20220102209 - Spurlin; Tighe A. ; et al. | 2022-03-31 |
Monitoring surface oxide on seed layers during electroplating
Grant 11,208,732 - Huang , et al. December 28, 2 | 2021-12-28 |
Process for optimizing cobalt electrofill using sacrificial oxidants
Grant 11,078,591 - Brogan , et al. August 3, 2 | 2021-08-03 |
Copper Electrofill On Non-copper Liner Layers
App 20210156045 - Brogan; Lee J. ; et al. | 2021-05-27 |
Configuration and method of operation of an electrodeposition system for improved process stability and performance
Grant 10,745,817 - Ganesan , et al. A | 2020-08-18 |
Monitoring Surface Oxide On Seed Layers During Electroplating
App 20190390361 - Huang; Ludan ; et al. | 2019-12-26 |
Electrolyte concentration control system for high rate electroplating
Grant 10,472,730 - Mayer , et al. Nov | 2019-11-12 |
Monitoring surface oxide on seed layers during electroplating
Grant 10,443,146 - Huang , et al. Oc | 2019-10-15 |
Process For Optimizing Cobalt Electrofill Using Sacrificial Oxidants
App 20190271094 - Brogan; Lee J. ; et al. | 2019-09-05 |
Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step
Grant 10,358,738 - Ma , et al. July 23, 2 | 2019-07-23 |
Process for optimizing cobalt electrofill using sacrificial oxidants
Grant 10,329,683 - Brogan , et al. | 2019-06-25 |
Low Copper Electroplating Solutions For Fill And Defect Control
App 20190145017 - Zhou; Jian ; et al. | 2019-05-16 |
Method And Apparatus For Remote Plasma Treatment For Reducing Metal Oxides On A Metal Seed Layer
App 20180350670 - Spurlin; Tighe A. ; et al. | 2018-12-06 |
Monitoring Surface Oxide On Seed Layers During Electroplating
App 20180282894 - Huang; Ludan ; et al. | 2018-10-04 |
Process For Optimizing Cobalt Electrofill Using Sacrificial Oxidants
App 20180119305 - Brogan; Lee J. ; et al. | 2018-05-03 |
Gap Fill Process Stability Monitoring Of An Electroplating Process Using A Potential-controlled Exit Step
App 20180080140 - Ma; Quan ; et al. | 2018-03-22 |
Configuration And Method Of Operation Of An Electrodeposition System For Improved Process Stability And Performance
App 20180038007 - Ganesan; Kousik ; et al. | 2018-02-08 |
Method And Apparatus For Electroplating Semiconductor Wafer When Controlling Cations In Electrolyte
App 20180030611 - Spurlin; Tighe A. ; et al. | 2018-02-01 |
Chemistry additives and process for cobalt film electrodeposition
Grant 9,777,386 - Doubina , et al. October 3, 2 | 2017-10-03 |
Geometry and process optimization for ultra-high RPM plating
Grant 9,481,942 - Zhou , et al. November 1, 2 | 2016-11-01 |
Chemistry Additives And Process For Cobalt Film Electrodeposition
App 20160273117 - Doubina; Natalia V. ; et al. | 2016-09-22 |
Geometry And Process Optimization For Ultra-high Rpm Plating
App 20160222535 - Zhou; Jian ; et al. | 2016-08-04 |
Low Copper/high Halide Electroplating Solutions For Fill And Defect Control
App 20160102416 - Zhou; Jian ; et al. | 2016-04-14 |
Electrolyte Concentration Control System For High Rate Electroplating
App 20150315720 - Mayer; Steven T. ; et al. | 2015-11-05 |
Method for electrochemical planarization of metal surfaces
Grant 6,653,226 - Reid November 25, 2 | 2003-11-25 |
Membrane partition system for plating of wafers
Grant 6,569,299 - Reid , et al. May 27, 2 | 2003-05-27 |
Passivation of copper in dual damascene metalization
Grant 6,554,914 - Rozbicki , et al. April 29, 2 | 2003-04-29 |
Electroplating chemistry on-line monitoring and control system
Grant 6,458,262 - Reid October 1, 2 | 2002-10-01 |
Electroplating system including additive for filling sub-micron features
Grant 6,284,121 - Reid September 4, 2 | 2001-09-04 |
Method and apparatus for treating surface including virtual anode
Grant 6,179,983 - Reid , et al. January 30, 2 | 2001-01-30 |
Electroplating anode including membrane partition system and method of preventing passivation of same
Grant 6,126,798 - Reid , et al. October 3, 2 | 2000-10-03 |
Electroplating additive for filling sub-micron features
Grant 6,024,857 - Reid February 15, 2 | 2000-02-15 |
| 