| Patent | Date |
|---|
Method For Manufacturing A Microelectronic Media Sensor Assembly, And Microelectronic Media Sensor Assembly
App 20180208458 - Reichenbach; Ralf | 2018-07-26 |
MEMS element including a stress decoupling structure and a component including such a MEMS element
Grant 10,017,376 - Classen , et al. July 10, 2 | 2018-07-10 |
Mems Element Including A Stress Decoupling Structure And A Component Including Such A Mems Element
App 20170096331 - Classen; Johannes ; et al. | 2017-04-06 |
Interposer For Mounting A Vertically Integrated Hybrid Component On A Component Carrier
App 20170081177 - Neul; Reinhard ; et al. | 2017-03-23 |
Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements
Grant 9,416,000 - Schelling , et al. August 16, 2 | 2016-08-16 |
Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements
App 20150353347 - Schelling; Christoph ; et al. | 2015-12-10 |
Vertical Hybrid Integrated MEMS ASIC Component Having A Stress Decoupling Structure
App 20150353345 - HEUCK; Friedjof ; et al. | 2015-12-10 |
Method for manufacturing at least one mechanical-electrical energy conversion system
Grant 9,032,608 - Laermer , et al. May 19, 2 | 2015-05-19 |
Multifunction sensor as PoP microwave PCB
Grant 8,987,921 - Scholz , et al. March 24, 2 | 2015-03-24 |
Microvalve, micropump and manufacturing method
Grant 8,939,165 - Reichenbach , et al. January 27, 2 | 2015-01-27 |
Piezoelectric generator
Grant 8,671,746 - Laermer , et al. March 18, 2 | 2014-03-18 |
Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip
Grant 8,638,000 - Trautmann , et al. January 28, 2 | 2014-01-28 |
Method for manufacturing a micropump and micropump
Grant 8,607,450 - Cassemeyer , et al. December 17, 2 | 2013-12-17 |
Multifunction Sensor As Pop Microwave Pcb
App 20130256919 - Scholz; Ulrike ; et al. | 2013-10-03 |
Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type
Grant 8,492,850 - Lammel , et al. July 23, 2 | 2013-07-23 |
Multiaxial micromechanical acceleration sensor
Grant 8,429,971 - Classen , et al. April 30, 2 | 2013-04-30 |
Method for manufacturing porous microstructures, porous microstructures manufactured according to this method, and the use thereof
Grant 8,377,315 - Scholten , et al. February 19, 2 | 2013-02-19 |
Micromechanical Method and Corresponding Assembly for Bonding Semiconductor Substrates and Correspondingly Bonded Semiconductor Chip
App 20120280409 - Trautmann; Achim ; et al. | 2012-11-08 |
Method For Manufacturing A Semiconductor Structure, And A Corresponding Semiconductor Structure
App 20120132925 - Lammel; Gerhard ; et al. | 2012-05-31 |
Bending transducer device for generating electrical energy from deformations and circuit module
Grant 8,154,174 - Laermer , et al. April 10, 2 | 2012-04-10 |
Method for manufacturing a semiconductor structure, and a corresponding Semiconductor Structure
Grant 8,148,234 - Lammel , et al. April 3, 2 | 2012-04-03 |
Circuit module
Grant 8,113,059 - Buck , et al. February 14, 2 | 2012-02-14 |
Piezoelectric Generator
App 20110296906 - Laermer; Franz ; et al. | 2011-12-08 |
Method For Manufacturing Porous Microstructures, Porous Microstructures Manufactured According To This Method, And The Use Thereof
App 20110281102 - Scholten; Dick ; et al. | 2011-11-17 |
Bending transducer for generating electrical energy from mechanical deformations
Grant 8,040,023 - Laermer , et al. October 18, 2 | 2011-10-18 |
Method For Manufacturing At Least One Mechanical-electrical Energy Conversion System, And Mechanical-electrical Energy Conversion System
App 20110248604 - Laermer; Franz ; et al. | 2011-10-13 |
Multiaxial micromechanical acceleration sensor
App 20110174076 - Classen; Johannes ; et al. | 2011-07-21 |
Microvalve, Micropump and Manufacturing Method
App 20110168936 - Reichenbach; Ralf ; et al. | 2011-07-14 |
Circuit module
Grant 7,919,907 - Reichenbach , et al. April 5, 2 | 2011-04-05 |
Method For Manufacturing A Micropump And Micropump
App 20110034873 - Cassemeyer; Julia ; et al. | 2011-02-10 |
Microdosing Device for Dosing of Smallest Quantities of a Medium
App 20100166585 - Reichenbach; Ralf | 2010-07-01 |
Bending Transducer For Generating Electrical Energy From Mechanical Deformations
App 20100033060 - Laermer; Franz ; et al. | 2010-02-11 |
Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type
App 20100035068 - Lammel; Gerhard ; et al. | 2010-02-11 |
Bending transducer device for generating electrical energy from deformations and circuit module
App 20100007246 - Laermer; Franz ; et al. | 2010-01-14 |
Method for Treating a Material Having Nanoscale Pores
App 20100009077 - Laermer; Franz ; et al. | 2010-01-14 |
Method for Manufacturing a Semiconductor Structure, and a Corresponding Semiconductor Structure
App 20090236610 - Lammel; Gerhard ; et al. | 2009-09-24 |
Circuit Module
App 20090205435 - Buck; Thomas ; et al. | 2009-08-20 |
Circuit Module
App 20090206703 - Reichenbach; Ralf ; et al. | 2009-08-20 |
Method for Depositing an Anti-Adhesion Layer
App 20090004388 - Larmer; Franz ; et al. | 2009-01-01 |
Method for manufacturing an at least partially porous, hollow silicon body, hollow silicon bodies manufacturable by this method, and uses of these hollow silicon bodies
App 20080050610 - Stumber; Michael ; et al. | 2008-02-28 |
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