Redeker; Fritz

Patent Applications and Registrations

Patent applications and USPTO patent grants for Redeker; Fritz.The latest application filed is for "methods and apparatuses for three dimensional integrated circuits".

Company Profile

0.43.40

Redeker; Fritz - Fremont CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Cleaning solution formulations for substrates Grant 9,058,975 - Kolics , et al. June 16, 2	2015-06-16
Devices for metallization Grant 9,006,893 - Kolics , et al. April 14, 2	2015-04-14
Metallization mixtures and electronic devices Grant 8,970,027 - Kolics , et al. March 3, 2	2015-03-03
Methods And Apparatuses For Three Dimensional Integrated Circuits App 20140145334 - BOYD; John ; et al.	2014-05-29
Methods and apparatuses for three dimensional integrated circuits Grant 8,673,769 - Boyd , et al. March 18, 2	2014-03-18
Methods, Devices, And Materials For Metallization App 20140054776 - KOLICS; Artur ; et al.	2014-02-27
Metallization Mixtures And Electronic Devices App 20140034370 - KOLICS; Artur ; et al.	2014-02-06
Apparatus for cleaning contaminants from substrate Grant 8,590,550 - Korolik , et al. November 26, 2	2013-11-26
Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids Grant 8,535,451 - de Larios , et al. September 17, 2	2013-09-17
Methods, devices, and materials for metallization Grant 8,518,815 - Kolics , et al. August 27, 2	2013-08-27
Metallization processes, mixtures, and electronic devices Grant 8,518,826 - Kolics , et al. August 27, 2	2013-08-27
Device with post-contact back end of line through-hole via integration Grant 8,519,461 - Boyd , et al. August 27, 2	2013-08-27
Methods For Three-dimensional Integrated Circuit Through Hole Via Gapfill And Overburden Removal App 20130171820 - Boyd; John ; et al.	2013-07-04
Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal Grant 8,323,460 - Boyd , et al. December 4, 2	2012-12-04
Device With Post-contact Back End Of Line Through-hole Via Integration App 20120205807 - Boyd; John ; et al.	2012-08-16
Two-phase substrate cleaning material Grant 8,242,067 - Korolik , et al. August 14, 2	2012-08-14
Methods of post-contact back end of line through-hole via integration Grant 8,187,968 - Boyd , et al. May 29, 2	2012-05-29
Methods and systems for barrier layer surface passivation Grant 8,133,812 - Dordi , et al. March 13, 2	2012-03-13
Apparatuses And Systems For Fabricating Three Dimensional Integrated Circuits App 20120024230 - Li; Shijian ; et al.	2012-02-02
Metallization Processes, Mixtures, And Electronic Devices App 20120013008 - Kolics; Artur ; et al.	2012-01-19
Methods, Devices, And Materials For Metallization App 20120007239 - Kolics; Artur ; et al.	2012-01-12
Methods and systems for low interfacial oxide contact between barrier and copper metallization Grant 8,053,355 - Redeker , et al. November 8, 2	2011-11-08
Methods, apparatuses, and systems for fabricating three dimensional integrated circuits Grant 8,034,409 - Li , et al. October 11, 2	2011-10-11
Integrated Tool Sets And Process To Keep Substrate Surface Wet During Plating And Clean In Fabrication Of Advanced Nano-electronic Devices App 20110143553 - Wang; Yaxin ; et al.	2011-06-16
Apparatus for Contained Chemical Surface Treatment App 20110061687 - Mikhaylichenko; Katrina ; et al.	2011-03-17
Methods of Fabricating a Barrier Layer Over Interconnect Structures in Atomic Deposition Environments App 20110065273 - YOON; Hyungsuk Alexander ; et al.	2011-03-17
Methods for contained chemical surface treatment Grant 7,897,213 - Mikhaylichenko , et al. March 1, 2	2011-03-01
Methods of fabricating a barrier layer with varying composition for copper metallization Grant 7,863,179 - Yoon , et al. January 4, 2	2011-01-04
Two-Phase Substrate Cleaning Material App 20100317556 - Korolik; Mikhail ; et al.	2010-12-16
Apparatus for Cleaning Contaminants from Substrate App 20100313918 - Korolik; Mikhail ; et al.	2010-12-16
Methods And Systems For Low Interfacial Oxide Contact Between Barrier And Copper Metallization App 20100267229 - Redeker; Fritz ; et al.	2010-10-21
Method and system for using a two-phases substrate cleaning compound Grant 7,799,141 - Korolik , et al. September 21, 2	2010-09-21
Apparatus for cleaning edge of substrate and method for using the same Grant 7,758,404 - Ryder , et al. July 20, 2	2010-07-20
Methods and systems for low interfacial oxide contact between barrier and copper metallization Grant 7,749,893 - Redeker , et al. July 6, 2	2010-07-06
Methods Of Post-contact Back End Of Line Through-hole Via Integration App 20100044867 - Boyd; John ; et al.	2010-02-25
Methods And Systems For Barrier Layer Surface Passivation App 20100009535 - Dordi; Yezdi ; et al.	2010-01-14
Apparatuses and methods for cleaning a substrate Grant 7,625,452 - de Larios , et al. December 1, 2	2009-12-01
Methods of post-contact back end of the line through-hole via integration Grant 7,615,480 - Boyd , et al. November 10, 2	2009-11-10
Methods and systems for barrier layer surface passivation Grant 7,592,259 - Dordi , et al. September 22, 2	2009-09-22
Wafer edge surface treatment with liquid meniscus Grant 7,584,761 - Yun , et al. September 8, 2	2009-09-08
Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids Grant 7,568,490 - de Larios , et al. August 4, 2	2009-08-04
Methods for processing wafer surfaces using thin, high velocity fluid layer Grant 7,534,307 - Ravkin , et al. May 19, 2	2009-05-19
System and method for contained chemical surface treatment App 20090114249 - Mikhaylichenko; Katrina ; et al.	2009-05-07
Method and Apparatus for Cleaning Semiconductor Wafers Using Compressed and/or Pressurized Foams, Bubbles, and/or Liquids App 20090078282 - de Larios; John M. ; et al.	2009-03-26
Cleaning Solution Formulations For Substrates App 20090065735 - KOLICS; Artur ; et al.	2009-03-12
Apparatuses And Methods For Cleaning A Substrate App 20090000044 - de Larios; John M. ; et al.	2009-01-01
Methods and apparatuses for three dimensional integrated circuits App 20080315422 - Boyd; John ; et al.	2008-12-25
Methods of post-contact back end of line through-hole via integration App 20080315418 - Boyd; John ; et al.	2008-12-25
Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal App 20080314756 - Boyd; John ; et al.	2008-12-25
Apparatuses and methods for cleaning a substrate Grant 7,441,299 - de Larios , et al. October 28, 2	2008-10-28
Methods for Processing Wafer Surfaces Using Thin, High Velocity Fluid Layer App 20080230097 - Ravkin; Michael ; et al.	2008-09-25
Methods, Apparatuses, And Systems For Fabricating Three Dimensional Integrated Circuits App 20080152464 - LI; Shijian ; et al.	2008-06-26
Methods and systems for barrier layer surface passivation App 20080146025 - Dordi; Yezdi ; et al.	2008-06-19
Methods and systems for low interfacial oxide contact between barrier and copper metallization App 20080142972 - Redeker; Fritz ; et al.	2008-06-19
Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces Grant 7,387,689 - de Larios , et al. June 17, 2	2008-06-17
Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer Grant 7,383,843 - Ravkin , et al. June 10, 2	2008-06-10
Methods of fabricating a barrier layer with varying composition for copper metallization App 20080102621 - Yoon; Hyungsuk Alexander ; et al.	2008-05-01
Methods For Drying Semiconductor Wafer Surfaces Using A Plurality Of Inlets And Outlets Held In Close Proximity To The Wafer Surfaces App 20070218653 - de Larios; John M. ; et al.	2007-09-20
Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces Grant 7,234,477 - de Larios , et al. June 26, 2	2007-06-26
Method and system for using a two-phases substrate cleaning compound App 20070087950 - Korolik; Mikhail ; et al.	2007-04-19
Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassette Grant 7,179,154 - Boyd , et al. February 20, 2	2007-02-20
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus Grant 7,077,725 - Sun , et al. July 18, 2	2006-07-18
Self-draining edge wheel system and method App 20060000494 - Garcia; James P. ; et al.	2006-01-05
Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer App 20050145265 - Ravkin, Michael ; et al.	2005-07-07
Apparatuses and methods for cleaning a substrate App 20050133061 - de Larios, John M. ; et al.	2005-06-23
Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids App 20050133060 - Larios, John M. de ; et al.	2005-06-23
Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces App 20040069329 - de Larios, John M. ; et al.	2004-04-15
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus App 20040050817 - Sun, Lizhong ; et al.	2004-03-18
Method for abrasive-free metal CMP in passivation domain Grant 6,451,697 - Sun , et al. September 17, 2	2002-09-17
Method and apparatus for electrochemical-mechanical planarization App 20020111121 - Sun, Lizhong ; et al.	2002-08-15
Abrasive-free metal CMP in passivation domain App 20020092827 - Sun, Lizhong ; et al.	2002-07-18
Abrasive-free metal CMP in passivation domain App 20020022370 - Sun, Lizhong ; et al.	2002-02-21
Method For Cleaning Semiconductor Wafer Having Copper Structure Formed Thereon App 20010052351 - BROWN, BRIAN J. ; et al.	2001-12-20
Conditioning fixed abrasive articles Grant 6,322,427 - Li , et al. November 27, 2	2001-11-27
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus Grant 6,299,741 - Sun , et al. October 9, 2	2001-10-09
Plasma cleaning of a CVD or etch reactor using a low or mixed frequency excitation field Grant 5,882,424 - Taylor , et al. March 16, 1	1999-03-16

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