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Patent applications and USPTO patent grants for Rattner, Michael B..The latest application filed is for "substrate carrier for processing substrates".
Patent | Date |
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Substrate carrier for processing substrates App 20050241771 - Rattner, Michael B. ;   et al. | 2005-11-03 |
Integrated method for release and passivation of MEMS structures Grant 6,902,947 - Chinn , et al. June 7, 2 | 2005-06-07 |
Method of etching variable depth features in a crystalline substrate Grant 6,900,133 - Chinn , et al. May 31, 2 | 2005-05-31 |
Integrated method for release and passivation of MEMS structures Grant 6,830,950 - Chinn , et al. December 14, 2 | 2004-12-14 |
Disposable barrier technique for through wafer etching in MEMS App 20040087054 - Chinn, Jeffrey D. ;   et al. | 2004-05-06 |
Method of etching variable depth features in a crystalline substrate App 20040053505 - Chinn, Jeffrey D. ;   et al. | 2004-03-18 |
Integrated method for release and passivation of MEMS structures App 20040033639 - Chinn, Jeffrey D. ;   et al. | 2004-02-19 |
Substrate support assembly having an edge protector App 20030217693 - Rattner, Michael B. ;   et al. | 2003-11-27 |
Substrate carrier for processing substrates App 20030219986 - Rattner, Michael B. ;   et al. | 2003-11-27 |
Integrated method for release and passivation of MEMS structures App 20030166342 - Chinn, Jeffrey D. ;   et al. | 2003-09-04 |
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