Ramachandran; Vidhya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ramachandran; Vidhya.The latest application filed is for "power management system switched capacitor voltage regulator with integrated passive device".

Company Profile

7.46.58

Ramachandran; Vidhya - Cupertino CA
Ramachandran; Vidhya - San Diego CA
Ramachandran; Vidhya - Ossining NY
Ramachandran; Vidhya - Colchester VT
Ramachandran, Vidhya - Essex Junction VT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer Reconstitution And Die-stitching App 20220013504 - Dabral; Sanjay ; et al.	2022-01-13
Power Management System Switched Capacitor Voltage Regulator With Integrated Passive Device App 20220014095 - Dabral; Sanjay ; et al.	2022-01-13
Wafer reconstitution and die-stitching Grant 11,158,607 - Dabral , et al. October 26, 2	2021-10-26
Power management system switched capacitor voltage regulator with integrated passive device Grant 11,101,732 - Dabral , et al. August 24, 2	2021-08-24
Trimmable banked capacitor Grant 11,069,665 - Ramachandran , et al. July 20, 2	2021-07-20
Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module App 20210043511 - Ramachandran; Vidhya ; et al.	2021-02-11
Power Management System Switched Capacitor Voltage Regulator With Integrated Passive Device App 20200358351 - Dabral; Sanjay ; et al.	2020-11-12
Structure and method for fabricating a computing system with an integrated voltage regulator module Grant 10,818,632 - Ramachandran , et al. October 27, 2	2020-10-27
Power management system switched capacitor voltage regulator with integrated passive device Grant 10,756,622 - Dabral , et al. A	2020-08-25
Power Management System Switched Capacitor Voltage Regulator With Integrated Passive Device App 20200204067 - Dabral; Sanjay ; et al.	2020-06-25
Trimmable Banked Capacitor App 20200176427 - Ramachandran; Vidhya ; et al.	2020-06-04
Wafer Reconstitution And Die-stitching App 20200176419 - Dabral; Sanjay ; et al.	2020-06-04
Integrated passive devices to reduce power supply voltage droop Grant 10,587,195 - Searles , et al.	2020-03-10
Dual-sided silicon integrated passive devices Grant 10,103,138 - Zhai , et al. October 16, 2	2018-10-16
Systems and methods to reduce parasitic capacitance Grant 9,941,156 - Gu , et al. April 10, 2	2018-04-10
Structure and method for fabricating a computing system with an integrated voltage regulator module Grant 9,935,076 - Ramachandran , et al. April 3, 2	2018-04-03
Interposer having stacked devices Grant 9,922,970 - Ramachandran , et al. March 20, 2	2018-03-20
Dual-sided Silicon Integrated Passive Devices App 20170323883 - Zhai; Jun ; et al.	2017-11-09
Integrated Passive Devices To Reduce Power Supply Voltage Droop App 20170317588 - Searles; Shawn ; et al.	2017-11-02
Dual-sided silicon integrated passive devices Grant 9,748,227 - Zhai , et al. August 29, 2	2017-08-29
Dual-sided Silicon Integrated Passive Devices App 20170018546 - Zhai; Jun ; et al.	2017-01-19
Integrated circuit die decoupling system with reduced inductance Grant 9,548,288 - Ramachandran , et al. January 17, 2	2017-01-17
Integrated interposer with embedded active devices Grant 9,510,454 - Ramachandran , et al. November 29, 2	2016-11-29
Electrically reconfigurable interposer with built-in resistive memory Grant 9,502,469 - Lu , et al. November 22, 2	2016-11-22
Systems And Methods To Reduce Parasitic Capacitance App 20160293475 - Gu; Shiqun ; et al.	2016-10-06
Stacked Devices App 20160240527 - Ramachandran; Vidhya ; et al.	2016-08-18
Interposer integrated with 3D passive devices Grant 9,401,353 - Ramachandran , et al. July 26, 2	2016-07-26
Electrostatic discharge diodes and methods of forming electrostatic discharge diodes Grant 9,379,201 - Ramachandran , et al. June 28, 2	2016-06-28
Method for strain-relieved through substrate vias Grant 9,355,904 - Ramachandran , et al. May 31, 2	2016-05-31
Electrically Reconfigurable Interposer With Built-in Resistive Memory App 20160126291 - LU; Yu ; et al.	2016-05-05
Integration Of Electronic Elements On The Backside Of A Semiconductor Die App 20160095221 - RAMACHANDRAN; Vidhya ; et al.	2016-03-31
Small form factor magnetic shield for magnetorestrictive random access memory (MRAM) Grant 9,276,199 - Gu , et al. March 1, 2	2016-03-01
Stress Sensor For A Semiconductor Device App 20160049340 - Ramachandran; Vidhya ; et al.	2016-02-18
Interposer Integrated With 3d Passive Devices App 20160043068 - RAMACHANDRAN; Vidhya ; et al.	2016-02-11
Structure And Method For Protecting Stress-sensitive Integrated Circuit App 20160013136 - RAMACHANDRAN; Vidhya ; et al.	2016-01-14
Integrating through substrate vias from wafer backside layers of integrated circuits Grant 9,219,032 - Ramachandran , et al. December 22, 2	2015-12-22
Electrostatic Discharge Diode App 20150333053 - Ramachandran; Vidhya ; et al.	2015-11-19
Integrated Interposer With Embedded Active Devices App 20150250058 - RAMACHANDRAN; Vidhya ; et al.	2015-09-03
Electrostatic discharge diode Grant 9,093,462 - Ramachandran , et al. July 28, 2	2015-07-28
Low-K dielectric protection spacer for patterning through substrate vias through a low-K wiring layer Grant 9,059,263 - Ramachandran , et al. June 16, 2	2015-06-16
Integrating through substrate vias into middle-of-line layers of integrated circuits Grant 8,975,729 - Ramachandran , et al. March 10, 2	2015-03-10
Small Form Factor Magnetic Shield For Magnetorestrictive Random Access Memory (mram) App 20150048465 - Gu; Shiqun ; et al.	2015-02-19
Small form factor magnetic shield for magnetorestrictive random access memory (MRAM) Grant 8,952,504 - Gu , et al. February 10, 2	2015-02-10
Electrostatic Discharge Diode App 20140327105 - Ramachandran; Vidhya ; et al.	2014-11-06
Method For Strain-relieved Through Substrate Vias App 20140302674 - RAMACHANDRAN; Vidhya ; et al.	2014-10-09
Through-substrate Via With A Fuse Structure App 20140266286 - Ramachandran; Vidhya ; et al.	2014-09-18
Via-enabled Package-on-package App 20140252561 - Lisk; Durodami Joscelyn ; et al.	2014-09-11
Small Form Factor Magnetic Shield For Magnetorestrictive Random Access Memory (mram) App 20140225208 - Gu; Shiqun ; et al.	2014-08-14
Structure and method for strain-relieved TSV Grant 8,779,559 - Ramachandran , et al. July 15, 2	2014-07-15
Integrating Through Substrate Vias From Wafer Backside Layers Of Integrated Circuits App 20140008757 - Ramachandran; Vidhya ; et al.	2014-01-09
Structure And Method For Strain-relieved Tsv App 20130221494 - Ramachandran; Vidhya ; et al.	2013-08-29
Integrating Through Substrate Vias Into Middle-of-line Layers Of Integrated Circuits App 20130181330 - Ramachandran; Vidhya ; et al.	2013-07-18
Low-k Dielectric Protection Spacer For Patterning Through Substrate Vias Through A Low-k Wiring Layer App 20130113068 - Ramachandran; Vidhya ; et al.	2013-05-09
Methods and Structures Involving Terminal Connections App 20120168210 - Hook; Terence B. ; et al.	2012-07-05
Self-aligned contact Grant 7,888,252 - Faltermeier , et al. February 15, 2	2011-02-15
Semiconductor integrated circuit devices having high-Q wafer back-side capacitors Grant 7,851,321 - Clevenger , et al. December 14, 2	2010-12-14
Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuits Grant 7,825,019 - Clevenger , et al. November 2, 2	2010-11-02
Self-aligned Contact App 20100210098 - Faltermeier; Johnathan E. ; et al.	2010-08-19
Trench metal-insulator metal (MIM) capacitors Grant 7,750,388 - Ho , et al. July 6, 2	2010-07-06
Bipolar and CMOS integration with reduced contact height Grant 7,701,015 - He , et al. April 20, 2	2010-04-20
Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme Grant 7,687,867 - Coolbaugh , et al. March 30, 2	2010-03-30
Trench metal-insulator-metal (MIM) capacitors integrated with middle-of-line metal contacts, and method of fabricating same Grant 7,682,896 - Ho , et al. March 23, 2	2010-03-23
Trench Metal-insulator Metal (mim) Capacitors App 20090159948 - Ho; Herbert L. ; et al.	2009-06-25
Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating same Grant 7,531,407 - Clevenger , et al. May 12, 2	2009-05-12
Semiconductor Integrated Circuit Devices Having High-Q Wafer Back-Side Capacitors App 20090111235 - Clevenger; Lawrence ; et al.	2009-04-30
Structures And Methods For Reduction Of Parasitic Capacitances In Semiconductor Integrated Circuits App 20090085210 - Clevenger; Lawrence A. ; et al.	2009-04-02
Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask Grant 7,511,940 - Coolbaugh , et al. March 31, 2	2009-03-31
Bipolar And Cmos Integration With Reduced Contact Height App 20090039522 - He; Zhong-Xiang ; et al.	2009-02-12
Semiconductor integrated circuit devices having high-Q wafer back-side capacitors Grant 7,473,979 - Clevenger , et al. January 6, 2	2009-01-06
Method of forming a structure for reducing lateral fringe capacitance in semiconductor devices Grant 7,456,099 - Clevenger , et al. November 25, 2	2008-11-25
Structure For Reducing Lateral Fringe Capacitance In Semiconductor Devices App 20080197495 - Clevenger; Lawrence A. ; et al.	2008-08-21
FEOL/MEOL metal resistor for high end CMOS Grant 7,397,087 - Chinthakindi , et al. July 8, 2	2008-07-08
Trench metal-insulator-metal (MIM) capacitors and method of fabricating same Grant 7,388,244 - Ho , et al. June 17, 2	2008-06-17
Non-continuous encapsulation layer for MIM capacitor Grant 7,326,987 - Abadeer , et al. February 5, 2	2008-02-05
Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating same App 20080020488 - Clevenger; Lawrence ; et al.	2008-01-24
Inexpensive Method Of Fabricating A Higher Performance Capacitance Density Mimcap Integrable Into A Copper Interconnect Scheme App 20070290359 - Coolbaugh; Douglas D. ; et al.	2007-12-20
Semiconductor integrated circuit devices having high-Q wafer back-side capacitors App 20070278619 - Clevenger; Lawrence ; et al.	2007-12-06
Structure For Reducing Lateral Fringe Capacitance In Semiconductor Devices And Method Of Forming The Same App 20070275552 - Clevenger; Lawrence A. ; et al.	2007-11-29
Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask Grant 7,301,752 - Coolbaugh , et al. November 27, 2	2007-11-27
Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme Grant 7,282,404 - Coolbaugh , et al. October 16, 2	2007-10-16
Trench metal-insulator-metal (MIM) capacitors integrated with middle-of-line metal contacts, and method of fabricating same Grant 7,276,751 - Ho , et al. October 2, 2	2007-10-02
Trench Metal-insulator-metal (mim) Capacitors Integrated With Middle-of-line Metal Contacts, And Method Of Fabricating Same App 20070218625 - Ho; Herbert Lei ; et al.	2007-09-20
Trench Metal-insulator-metal (mim) Capacitors And Method Of Fabricating Same App 20070063244 - Ho; Herbert L. ; et al.	2007-03-22
Trench Metal-insulator-metal (mim) Capacitors Integrated With Middle-of-line Metal Contacts, And Method Of Fabricating Same App 20070057302 - Ho; Herbert Lei ; et al.	2007-03-15
Structure And Method For Forming Thin Film Resistor With Topography Controlled Resistance Density App 20070046421 - Gogineni; Usha ; et al.	2007-03-01
Structure and method for integrating MIM capacitor in BEOL wiring levels Grant 7,160,772 - Coolbaugh , et al. January 9, 2	2007-01-09
Structure And Method For Integrating Mim Capacitor In Beol Wiring Levels App 20060189069 - Coolbaugh; Douglas D. ; et al.	2006-08-24
FEOL/MEOL metal resistor for high end CMOS App 20060027878 - Chinthakindi; Anil K. ; et al.	2006-02-09
Inexpensive Method Of Fabricating A Higher Performance Capacitance Density Mimcap Integrable Into A Copper Interconnect Scheme App 20050274987 - Coolbaugh, Douglas D. ; et al.	2005-12-15
Formation Of Metal-insulator-metal Capacitor Simultaneously With Aluminum Metal Wiring Level Using A Hardmask App 20050272219 - Coolbaugh, Douglas D. ; et al.	2005-12-08
Non-continuous Encapsulation Layer For Mim Capacitor App 20050189615 - Abadeer, Wagdi W. ; et al.	2005-09-01
Metal-insulator-metal capacitor and method of fabrication App 20050156278 - Coolbaugh, Douglas D. ; et al.	2005-07-21
Non-Continuous encapsulation layer for MIM capacitor Grant 6,913,965 - Abadeer , et al. July 5, 2	2005-07-05
Metal-insulator-metal capacitor and method of fabrication Grant 6,876,028 - Coolbaugh , et al. April 5, 2	2005-04-05
Metal-insulator-metal Capacitor And Method Of Fabrication App 20050067701 - Coolbaugh, Douglas D. ; et al.	2005-03-31
Non-continuous Encapsulation Layer For Mim Capacitor App 20040251514 - Abadeer, Wagdi William ; et al.	2004-12-16
A Dual Stacked Metal-insulator-metal Capacitor And Method For Making Same App 20030197215 - Coolbaugh, Douglas Duane ; et al.	2003-10-23
Nitride etchstop film to protect metal-insulator-metal capacitor dielectric from degradation and method for making same App 20030146492 - Malinowski, John Chester ; et al.	2003-08-07
Process for making a high voltage NPN Bipolar device with improved AC performance App 20020177253 - Johnson, Jeffrey B. ; et al.	2002-11-28
Multiple material stacks with a stress relief layer between a metal structure and a passivation layer App 20020163062 - Wang, Ping-Chuan ; et al.	2002-11-07

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