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name:-0.031455993652344
name:-0.024736881256104
name:-0.015138149261475
Qu; Xiaopeng Patent Filings

Qu; Xiaopeng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Qu; Xiaopeng.The latest application filed is for "lidded microelectronic device packages and related systems, apparatus, and methods of manufacture".

Company Profile
11.14.24
  • Qu; Xiaopeng - Redmond WA
  • Qu; Xiaopeng - Boise ID
  • Qu; Xiaopeng - Bellevue WA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Lidded Microelectronic Device Packages And Related Systems, Apparatus, And Methods Of Manufacture
App 20220293486 - Qu; Xiaopeng
2022-09-15
Heat Spreaders For Use In Semiconductor Device Testing, Such As Burn-in Testing
App 20220291280 - Qu; Xiaopeng ;   et al.
2022-09-15
Semiconductor Devices With Flexible Connector Array
App 20220285281 - Sinha; Koustav ;   et al.
2022-09-08
Thermal management of circuit boards
Grant 11,419,239 - Qu , et al. August 16, 2
2022-08-16
Heat spreaders for use in semiconductor device testing, such as burn-in testing
Grant 11,385,281 - Qu , et al. July 12, 2
2022-07-12
Heat spreaders for use in semiconductor device testing, such as burn-in testing
Grant 11,372,043 - Qu , et al. June 28, 2
2022-06-28
Lidded microelectronic device packages and related systems, apparatus, and methods of manufacture
Grant 11,348,857 - Qu May 31, 2
2022-05-31
Semiconductor devices with flexible connector array
Grant 11,348,875 - Sinha , et al. May 31, 2
2022-05-31
Semiconductor Device Assemblies And Systems With Improved Thermal Performance And Methods For Making The Same
App 20220122942 - Chun; Hyunsuk ;   et al.
2022-04-21
Heat spreaders for multiple semiconductor device modules
Grant 11,270,924 - Qu March 8, 2
2022-03-08
Apparatus and method for dissipating heat in multiple semiconductor device modules
Grant 11,239,133 - Qu , et al. February 1, 2
2022-02-01
Semiconductor Devices, Semiconductor Device Packages, Electronic Systems Including Same, And Related Methods
App 20220028850 - Arifeen; Shams U. ;   et al.
2022-01-27
Semiconductor Device Assemblies And Systems With Improved Thermal Performance And Methods For Making The Same
App 20210407964 - Chun; Hyunsuk ;   et al.
2021-12-30
Thermal Management Of Gpu-hbm Package By Microchannel Integrated Substrate
App 20210407889 - Qu; Xiaopeng ;   et al.
2021-12-30
Thermal Management Of Circuit Boards
App 20210410278 - Qu; Xiaopeng ;   et al.
2021-12-30
Substrates For Semiconductor Device Assemblies And Systems With Improved Thermal Performance And Methods For Making The Same
App 20210407882 - Chun; Hyunsuk ;   et al.
2021-12-30
Semiconductor device assemblies and systems with improved thermal performance and methods for making the same
Grant 11,211,364 - Chun , et al. December 28, 2
2021-12-28
Lidded Microelectronic Device Packages And Related Systems, Apparatus, And Methods Of Manufacture
App 20210391235 - Qu; Xiaopeng
2021-12-16
Methods And Apparatus For Temperature Modification And Reduction Of Contamination In Bonding Stacked Microelectronic Devices
App 20210384042 - Qu; Xiaopeng ;   et al.
2021-12-09
Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods
Grant 11,171,130 - Arifeen , et al. November 9, 2
2021-11-09
Apparatus And Method For Dissipating Heat In Multiple Semiconductor Device Modules
App 20210272870 - Qu; Xiaopeng ;   et al.
2021-09-02
Thermal Management Materials For Semiconductor Devices, And Associated Systems And Methods
App 20210272872 - Qu; Xiaopeng ;   et al.
2021-09-02
Semiconductor Devices With Flexible Connector Array
App 20210272908 - Sinha; Koustav ;   et al.
2021-09-02
Heat Spreaders For Semiconductor Devices, And Associated Systems And Methods
App 20210225733 - Qu; Xiaopeng ;   et al.
2021-07-22
Assemblies Including Heat Dispersing Elements And Related Systems And Methods
App 20210204446 - Qu; Xiaopeng
2021-07-01
Semiconductor Devices, Semiconductor Device Packages, Electronic Systems Including Same, And Related Methods
App 20210183843 - Arifeen; Shams U. ;   et al.
2021-06-17
Heat spreaders for semiconductor devices, and associated systems and methods
Grant 11,011,452 - Qu , et al. May 18, 2
2021-05-18
Apparatus and method for dissipating heat in multiple semiconductor device modules
Grant 11,011,449 - Qu , et al. May 18, 2
2021-05-18
Assemblies including heat dispersing elements and related systems and methods
Grant 10,952,352 - Qu March 16, 2
2021-03-16
Heat Spreaders For Use In Semiconductor Device Testing, Such As Burn-in Testing
App 20210055343 - Qu; Xiaopeng ;   et al.
2021-02-25
Heat Spreaders For Use In Semiconductor Device Testing, Such As Burn-in Testing
App 20210055342 - Qu; Xiaopeng ;   et al.
2021-02-25
Heat Spreaders For Multiple Semiconductor Device Modules
App 20200286805 - Qu; Xiaopeng
2020-09-10
Heat Spreaders For Semiconductor Devices, And Associated Systems And Methods
App 20200176353 - Qu; Xiaopeng ;   et al.
2020-06-04
Heat spreaders for multiple semiconductor device modules
Grant 10,672,679 - Qu
2020-06-02
Kits for enhanced cooling of components of computing devices and related computing devices, systems and methods
Grant 10,653,033 - Qu , et al.
2020-05-12
Kits For Enhanced Cooling Of Components Of Computing Devices And Related Computing Devices, Systems And Methods
App 20200137923 - Qu; Xiaopeng ;   et al.
2020-04-30
Heat Spreaders For Multiple Semiconductor Device Modules
App 20200075451 - Qu; Xiaopeng
2020-03-05
Assemblies Including Heat Dispersing Elements And Related Systems And Methods
App 20190132995 - Qu; Xiaopeng
2019-05-02

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