U.S. patent application number 17/224358 was filed with the patent office on 2021-07-22 for heat spreaders for semiconductor devices, and associated systems and methods.
The applicant listed for this patent is Micron Technology, Inc.. Invention is credited to Hyunsuk Chun, Amy R. Griffin, Xiaopeng Qu.
Application Number | 20210225733 17/224358 |
Document ID | / |
Family ID | 1000005505079 |
Filed Date | 2021-07-22 |
United States Patent
Application |
20210225733 |
Kind Code |
A1 |
Qu; Xiaopeng ; et
al. |
July 22, 2021 |
HEAT SPREADERS FOR SEMICONDUCTOR DEVICES, AND ASSOCIATED SYSTEMS
AND METHODS
Abstract
A memory system having heat spreaders with different
arrangements of projections are provided. In some embodiments, the
memory system comprises a substrate, a first semiconductor device
attached to a first side of the substrate, a second semiconductor
device attached to a second side of the substrate, a first heat
spreader attached to the first semiconductor device, and a second
heat spreader attached the second semiconductor device. The first
heat spreader has a plurality of first projections facing a first
direction and positioned in a first arrangement, and the second
heat spreader has a plurality of second projections facing a second
direction and positioned in a second arrangement different than the
first arrangement. In some embodiments, the first projections are
aligned with a majority of the second projections in a first
direction and are offset with a majority of the second projections
in a second direction.
Inventors: |
Qu; Xiaopeng; (Boise,
ID) ; Griffin; Amy R.; (Boise, ID) ; Chun;
Hyunsuk; (Boise, ID) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Micron Technology, Inc. |
Boise |
ID |
US |
|
|
Family ID: |
1000005505079 |
Appl. No.: |
17/224358 |
Filed: |
April 7, 2021 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
16205151 |
Nov 29, 2018 |
11011452 |
|
|
17224358 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 23/4334 20130101;
H01L 23/3114 20130101; H01L 23/3675 20130101 |
International
Class: |
H01L 23/433 20060101
H01L023/433; H01L 23/367 20060101 H01L023/367; H01L 23/31 20060101
H01L023/31 |
Claims
1. An electronic system comprising: a first circuit module
including a first semiconductor device; a second circuit module
including a second semiconductor device; a first heat spreader
configured to be attached to the first semiconductor device and
including a plurality of first projections projecting away from the
first memory module; and a second heat spreader configured to be
attached to the second semiconductor device and including a
plurality of second projections projecting away from the second
memory module, wherein the second projections are offset to be
positioned between the first projections when the first and second
memory modules are arranged with the first and second semiconductor
devices facing and mirroring each other, wherein at least one
projection in the plurality of first and/or second projections has
a non-rectangular projection shape or a projection shape having an
air channel therein.
2. The electronic system of claim 1 wherein the at least one
projection has one or more rounded edges in the non-rectangular
projection shape.
3. The electronic system of claim 2 wherein the one or more rounded
edges have a concave shape.
4. The electronic system of claim 1 wherein the non-rectangular
projection shape is a triangular shape.
5. The electronic system of claim 1 wherein the projection includes
a set of thermally coupled or structurally integral walls that
define the air channel.
6. The electronic system of claim 5 wherein two or more projections
in the plurality of first and/or second projections have the air
channel therein, wherein air channels are oriented along parallel
directions.
7. The electronic system of claim 6 wherein: when the first memory
module is attached to the first connector and the second memory
module is attached to the second connector, the plurality of first
and/or second projections form a plurality of air channels between
the first and second memory modules; the air channels are
configured to receive a forced air flow from a fan disposed at an
end of the memory system; and the projection shape is a front
shape.
8. A memory module, comprising: a substrate; a semiconductor device
attached to the substrate; a heat spreader attached to the
semiconductor device, the heat spreader including at least one
projection having a non-rectangular projection shape or a
projection shape having an air channel therein.
9. The memory module of claim 8 wherein: the semiconductor device
is a first semiconductor device; the first semiconductor device is
attached to a first side of the substrate; the heat spreader is a
first heat spreader and the at least one projection is at least one
first projection; further comprising: a second semiconductor device
attached to a second side of the substrate, wherein the second side
is opposite the first side; and a second heat spreader attached to
the second semiconductor device, the second heat spreader including
at least one second projection extending toward a direction
different than that of the at least one first projection.
10. The memory module of claim 9 wherein the at least one first
projection and the at least one second projection are
non-reflective about the substrate.
11. The memory module of claim 9 wherein the at least one first
projection and the at least one second projection are
non-reflective about the substrate.
12. The memory module of claim 8 wherein the at least one
projection has one or more rounded edges in the non-rectangular
projection shape.
13. The memory module of claim 12 wherein the one or more rounded
edges have a concave shape.
14. The memory module of claim 8, wherein the non-rectangular
projection shape is a triangular shape.
15. The memory module of claim 8 wherein the projection includes a
set of thermally coupled or structurally integral walls that define
the air channel.
16. The memory module of claim 15 wherein two or more projections
in the plurality of first and/or second projections have the air
channel therein, wherein air channels are oriented along parallel
directions.
17. The memory module of claim 15 wherein the projection extends
away from the substrate, and the air channel is location at a
distal portion of the projection.
18. A method of manufacturing a memory module, the method
comprising: attaching a first semiconductor device and a second
semiconductor device on opposing sides of a substrate; disposing a
first heat spreader on the first semiconductor device, the first
heat spreader having a first set of projections extending away from
the substrate; disposing a second heat spreader on the second
semiconductor device, the second heat spreader having a second set
of projections extending away from the substrate, wherein the first
set of projections and the second set of projections are offset
about the substrate; and at least one projection in the first and
second sets of projections has a non-rectangular projection shape
or a projection shape having an air channel therein.
19. The method of claim 18 wherein the non-rectangular projection
shape includes one or more rounded edges or a set of angled edges
that intersect each other at an angle.
20. The method of claim 18 wherein the at least one projection
extends away from the substrate and includes an opening located at
a distal portion of the at least one projection, wherein the
opening comprises the air channel.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. application Ser.
No. 16/205,151, filed Nov. 29, 2018; which is incorporated herein
by reference in its entirety.
[0002] U.S. patent application Ser. No. 16/118,889, filed on Aug.
31, 2018, now U.S. Pat. No. 10,672,679, is incorporated herein by
reference in its entirety.
TECHNICAL FIELD
[0003] The present disclosure generally relates to semiconductor
devices, and more particularly relates to heat spreaders for
semiconductor device modules.
BACKGROUND
[0004] Memory packages or modules typically include multiple memory
devices mounted on a substrate. Memory devices are widely used to
store information related to various electronic devices such as
computers, wireless communication devices, cameras, digital
displays, and the like. Information is stored by programing
different states of a memory cell. Various types of memory devices
exist, including magnetic hard disks, random access memory (RAM),
read only memory (ROM), dynamic RAM (DRAM), synchronous dynamic RAM
(SDRAM), and others.
[0005] Improving memory packages, generally, may include increasing
memory cell density, increasing read/write speeds or otherwise
reducing operational latency, increasing reliability, increasing
data retention, reducing power consumption, reducing manufacturing
costs, and reducing the size or footprint of the memory packages
and/or components of the memory devices, among other metrics. A
challenge associated with improving memory packages is that
improvements often result in increased heat generation--e.g., as a
result of increasing memory device density, increasing the speed or
processing ability of the memory devices, etc. Without sufficient
cooling, the additional heating can cause the memory devices to
reach temperatures above their maximum operating temperatures
(T.sub.max).
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] FIGS. 1 and 2 illustrate memory systems with multiple memory
modules.
[0007] FIG. 3A illustrates a front view of a memory system
including heat spreaders in accordance with embodiments of the
present disclosure.
[0008] FIG. 3B illustrates a top view of the memory system shown in
FIG. 3A.
[0009] FIGS. 3C and 3D illustrate side views of the memory system
shown in FIG. 3A.
[0010] FIG. 4A illustrates a front view of a memory system
including heat spreaders in accordance with embodiments of the
present disclosure.
[0011] FIG. 4B illustrates a top view of the memory system shown in
FIG. 4A.
[0012] FIG. 5 illustrates a front view of a memory system including
heat spreaders in accordance with embodiments of the present
disclosure.
[0013] FIG. 6 illustrates a top view of a memory system including
heat spreaders and a fan unit in accordance with embodiments of the
present disclosure.
[0014] FIGS. 7A-7C illustrate heat spreaders in accordance with
various embodiments of the present disclosure.
[0015] FIG. 8 is a flow chart illustrating a method of configuring
a memory system in accordance with embodiments of the present
disclosure.
DETAILED DESCRIPTION
[0016] Specific details of several embodiments of memory modules
having heat spreaders, and associated systems and methods, are
described below with reference to the appended Figures. In several
of the embodiments, a memory system can include multiple memory
modules, such as dual in-line memory modules (DIMMs), each having a
substrate, and one or more memory device(s) on front and back sides
of the substrate. One or more heat spreaders can be attached to the
memory device(s) to aid in the removal of heat from the memory
device(s). In some embodiments, the heat spreaders can include a
first heat spreader attached to the memory device(s) on a first
side of the substrate and a second heat spreader attached to the
memory device(s) on a second side of the substrate. The first heat
spreader can have first projections arranged in a first arrangement
and the second heat spreader can have second projections arranged
in a second arrangement different than the first arrangement. As
explained in further detail below, the first projections can be
generally aligned with the second projections in a first direction
(e.g., a vertical direction) and be generally offset (e.g., not
aligned) with the second projections in a second direction (e.g., a
horizontal direction). In some embodiments, substrates may be
positioned next to one another on a computing device, with a first
substrate having the first heat spreader with the first projections
attached thereto, and the second substrate having the second heat
spreader with the second projections attached thereto. In such a
position, the first projections can face the second projections
such that the first projections are generally aligned with a
majority of the second projections in a first direction and
generally offset with a majority of the second projections in a
second direction.
[0017] FIG. 1 illustrates a memory system including multiple memory
modules. Memory system 100 may include a computing device 101
(e.g., a motherboard) to which memory modules 111 and 112 are
connected (e.g., by memory connectors 102 and 103). Memory modules
111 and 112 can each include multiple semiconductor memory devices
on either side thereof (e.g., memory dies), such as memory devices
121 and 122. In operation, memory devices 121 and 122 can generate
waste heat, which can negatively impact the operation of memory
system 100 if left unaddressed. Accordingly, memory system 100 can
include heat spreaders, such as heat spreaders 131a and 131b
attached to opposing sides of memory module 111, and heat spreaders
132a and 132b attached to opposing sides of memory module 112.
[0018] In a DDR4 memory system, memory modules 111 and 112 may be
spaced apart by a predetermined pitch (e.g., of about 10 mm).
Accordingly, the space available between adjacent memory modules
111 and 112 for the heat spreaders 131b and 132a is about equal to
this pitch minus the thickness of one of the memory modules (e.g.,
with a distance between outer surfaces of opposing memory devices
of a memory module being about 2.8 mm, space available for the two
heat spreaders 131b and 132a to occupy is about 7.2 mm).
Accordingly, if each of the heat spreaders 132a and 132b is about 2
mm thick, there remains an air gap of about 3.2 mm between the
adjacent heat spreaders 132a and 132b, which is generally
sufficient for airflow to help dissipate the heat conducted away
from the memory devices 121 and 122.
[0019] Turning to FIG. 2, a similar memory system 200 is
illustrated, in which the pitch between adjacent memory modules is
reduced. Memory system 200 may be a DDR5 memory system, in which
the pitch between adjacent memory modules is about 7.62 mm. As can
be seen with reference to FIG. 2, memory system 200 includes a
computing device 201 (e.g., a motherboard) to which memory modules
211 and 212 are connected (e.g., by memory connectors 202 and 203).
Memory modules 211 and 212 can each include multiple semiconductor
memory devices on either side thereof (e.g., memory dies), such as
memory devices 221 and 222. Memory system 200 can further include
heat spreaders, such as heat spreaders 231a and 231b attached to
opposing sides of memory module 211, and heat spreaders 232a and
232b attached to opposing sides of memory module 212.
[0020] Because of the reduction of pitch in a DDR5 system when
compared to a DDR4 system, the space available between adjacent
memory modules 211 and 212 for the heat spreaders 231b and 232a is
about equal to the reduced pitch of 7.62 mm minus the thickness of
one of the memory modules (e.g., with a distance between outer
surfaces of opposing memory devices of a memory module being about
2.8 mm, space available for the two heat spreaders 231b and 232a to
occupy is about 4.82 mm). Accordingly, if each of the heat
spreaders 232a and 232b is about 2 mm thick, there remains an air
gap of about 0.82 mm between the adjacent heat spreaders 232a and
232b, which is generally insufficient for airflow to help dissipate
the heat conducted away from the memory devices 221 and 222.
[0021] To address the foregoing problems, embodiments described in
the present disclosure can provide heat spreaders for semiconductor
device modules, to provide improved performance in memory systems
with reduced spacing between adjacent memory modules. For example,
FIG. 3A illustrates a front view of a memory system 300 including
heat spreaders, FIG. 3B illustrates a top view of the memory system
300 shown in FIG. 3A, and FIGS. 3C and 3D illustrate side views of
the memory system 300 shown in FIG. 3A. Referring to FIGS. 3A and
3B together, the memory system 300 includes a computing device 301,
a first memory connector 302, a second memory connector 303, a
first memory module 305 connected to the computing device 301 via
the first memory connector 302, and a second memory module 306
connected to the computing device 301 via the second memory
connector 302. As shown in the illustrated embodiment, the first
memory module 305 and the second memory module 306 are identical,
and are included in FIG. 3A to illustrate the interface between
memory modules when positioned next to one another on the computing
device 301. Accordingly, details regarding the first memory module
305 can generally be applied to the second memory module 306,
unless indicated otherwise. The first memory module 305 can include
a substrate 311 and one or more semiconductor memory devices 321
attached to opposing sides of the substrate 311 via electrical
connectors 324 (e.g., solder balls). The second memory module 306
similarly can include a substrate 312 and one or more semiconductor
memory devices 321 attached to opposing sides of the substrate 312
via electrical connectors 324.
[0022] The memory system 300 can further include heat spreaders,
such as heat spreaders 330 and 335 attached to opposing sides of
the first memory module 305, and heat spreaders 340 and 345
attached to opposing sides of the second memory module 306. In some
embodiments, the heat spreaders 330, 335, 340, 345 can be attached
to the semiconductor memory devices 321 via a thermally conductive
adhesive. The heat spreaders 330, 335, 340, 345 can each include a
first side having a generally planar surface attached to the one or
more corresponding semiconductor devices 321, and a second side
having a plurality of projections, such as projections 331 of heat
spreader 330, projections 336 of heat spreader 335, projections 341
of heat spreader 340, and projections 346 of heat spreader 345. The
heat spreaders 330, 335, 340, 345 can include a thermally
conductive body formed from a metal or another thermally conductive
material (e.g., copper, aluminum, alloys thereof, graphite,
thermally-conductive polymers, etc.). As shown in the illustrated
embodiment, the projections are part of a continuous outermost
surface of the heat spreader. Each of the projections 331, 336,
341, 346 resembles a rectangular shape, and includes sidewalls and
an outermost edge perpendicular to the sidewalls. As described in
detail below (e.g., with reference to FIGS. 7A-7C), the projections
can assume shapes other than rectangles, including those that
increase the surface area of the outermost surface of the heat
spreader.
[0023] The projections of the heat spreaders attached to opposing
sides of a single memory module can include different arrangements
(e.g., as shown in FIGS. 3A and 3B) or the same arrangements (e.g.,
as shown in FIGS. 4A and 4B). As shown in the illustrated
embodiments of FIGS. 3A and 3B, the heat spreaders 330 and 340 have
a first arrangement of projections, and the heat spreaders 335 and
345 have a second arrangement of projections different than the
first arrangement. The projections of the first and second
arrangements can be generally aligned or offset with one another in
one or more directions. For example, as shown in the illustrated
embodiment of FIG. 3A, the projections 336 of the heat spreader 335
are generally aligned with the projections 341 of the heat spreader
340 in a vertical direction. The alignment of the projections 336,
341 can effectively form a plurality of air channels 360 configured
to permit airflow from one end of the heat spreaders 335, 340 to an
opposing end thereof. The permitted airflow through the air
channels 360 can facilitate the dissipation of heat from the memory
devices attached thereto. As explained in further detail below
(e.g., with reference to FIG. 6), the plurality of air channels 360
can be configured to receive a forced air flow from a fan disposed
at one of the ends (e.g., the top, bottom and/or sides) of the heat
spreaders 335, 340.
[0024] As shown in the illustrated embodiment of FIG. 3B, the
projections 336 of the heat spreader 335 are offset (i.e., not
generally aligned) with the projections 341 of the heat spreader
340 in a horizontal direction. As a result of the different first
and second arrangements, the projections of heat spreaders having
the first arrangement can be interleaved with the projections of
heat spreaders having the second arrangement when the first and
second memory modules 305, 306 are positioned next to one another.
In such a position, as shown in the illustrated embodiment, an
outermost surface of the projections 341 (i.e., the outermost
surface facing the first memory module 305) is configured to extend
beyond a plane (P) defined by an outermost surface of the
projections 336.
[0025] FIG. 3C illustrates a side view of the memory system 300,
showing the first arrangement of projections 331 of the heat
spreader 330, and FIG. 3D illustrates an opposing side view of the
memory system 300, showing the second arrangement of projections
346 of the heat spreader 345. As shown in the illustrated
embodiments of FIGS. 3C and 3D, individual projections 331, 346 can
be spaced apart from neighboring projections by a first distance
(d.sub.1) in the horizontal direction (e.g., the x-direction) and
by a second distance (d.sub.2) in the vertical direction (e.g., the
y-direction). In some embodiments, such as the embodiment shown in
FIGS. 3C and 3D, the spacing between individual projections of the
first arrangement in the horizontal and/or vertical direction is
the same as that of individual projections of the second
arrangement. In other embodiments, however, the spacings may
differ.
[0026] As stated above with reference to FIG. 3B, the projections
of the first arrangements may be aligned with and/or offset with
projections of the second arrangement in one or more directions. As
shown in the illustrated embodiment, for example, the projections
331 of the first arrangement are generally aligned with the
projections 346 of the second arrangement in the vertical
direction, but are offset in the horizontal direction. As such, the
horizontal spacing between an edge and an outermost row of
projections for the first arrangement will differ relative to the
horizontal spacing between an edge and an outermost row of
projections for the second arrangement. As shown in the illustrated
embodiments, for example, an outermost row of projections 370 of
the first arrangement is spaced apart from an edge 355 of the heat
spreader 330 by a third distance (d.sub.3), and an outermost row of
projections 380 of the first arrangement is spaced apart from an
edge 356 of the heat spreader 345 by a fourth distance (d.sub.4)
different (e.g., smaller) than the third distance.
[0027] Embodiments of the present technology have multiple
advantages over conventional or traditional technologies, one of
which is the ability to use heat spreaders with memory modules that
have a limited space next to adjacent memory modules. For example,
as noted above, many memory systems, such as the DDR5 memory
systems, have less than 5 mm between adjacent modules. As a result,
a conventional heat spreader used would have to be limited in size,
thereby limiting the surface area of the heat spreader and the
amount of heat that can be dissipated therefrom. Embodiments of the
present technology directly address this challenge because adjacent
memory modules can have heat spreaders with different arrangements
of projections, thereby allowing individual projections of one heat
spreader to be interleaved (e.g., in a vertical or horizontal
direction) between projections of the heat spreader adjacent
thereto. Stated differently, by having different arrangements of
projections, the individual projections can extend beyond an
outermost surface or plane of the adjacent individual projections.
As a result, projections of heat spreaders of the present
technology can be larger and the exposed surface area increased
relative to conventional heat spreaders, thereby increasing the
thermal capacity of the heat spreaders and their ability to
dissipate heat.
[0028] FIG. 4A illustrates a front view of a memory system 400
including heat spreaders in accordance with embodiments of the
present disclosure, and FIG. 4B illustrates a top view of the
memory system 400. The embodiment illustrated in FIGS. 4A and 4B is
similar to the embodiments illustrated in FIGS. 3A-3D, but differs
in that the heat spreaders attached to opposing sides of the memory
modules in FIGS. 4A and 4B have the same arrangement of
projections.
[0029] As shown in the illustrated embodiment, the memory system
400 includes the computing device 301, the first memory connector
302, and the second memory connector 303, as well as a first memory
module 405 connected to the computing device 301 via the first
memory connector 302, and a second memory module 406 connected to
the computing device 301 via the second memory connector 302. The
first memory module 405 includes the substrate 311 and
semiconductor memory devices 321 attached to opposing sides of the
substrate 311, and the second memory module 406 includes the
substrate 312 and semiconductor memory devices 321 attached to
opposing sides of the substrate 312. Furthermore, the first memory
module 405 includes heat spreaders 430a, 430b (collectively
referred to as "heat spreaders 430") having the first arrangement
of projections, and the second memory module 406 includes heat
spreaders 435a, 435b (collectively referred to as "heat spreaders
435") having the second arrangement of projections, as described
above with reference to FIGS. 3A-3D. As shown in the illustrated
embodiments of FIGS. 4A and 4B, the interface between heat spreader
430b and 435a is identical to that described above with reference
to FIGS. 3A and 3B. For example, as shown in FIG. 4A, the
projections 431 of the heat spreader 430b are generally aligned
with the projections 436 of the heat spreader 435b in a vertical
direction, and as shown in FIG. 4B, the projections 431 of the heat
spreader 430b are offset (i.e., not aligned) with the projections
436 of the heat spreader 435b in a horizontal direction.
[0030] In accordance with another embodiment of the present
disclosure, providing a memory system with multiple heat spreaders
that have co-planar top surfaces either at or above a top surface
of the memory modules to which they are attached can permit the
attachment of an upper heat spreader to further increase the
surface area used for heat exchange between the memory system and
the surrounding atmosphere. For example, FIG. 5 illustrates a
memory system 500 that is similar to the memory system 300 shown in
FIG. 3, but further includes an upper heat spreader 550 that
includes a thermally conductive body and can further optionally
include a plurality of projections or other structures configured
to increase a surface area thereof. By passing the forced air flow
through the plurality of air channels 360 (FIG. 3A), and/or other
surface-area-increasing structures of the heat spreaders 330, 335,
340, 345, 550, heat from the memory devices of the memory system
500 can be dissipated in an effective manner.
[0031] FIG. 6 illustrates a top view of a memory system 600
including multiple heat spreaders and a fan unit in accordance with
embodiments of the present disclosure. Memory system 600 is similar
to the memory system 300 described with reference to FIGS. 3A-3D,
but further includes a fan unit 660. The fan unit 660 is configured
to provide a forced air flow (F) over the memory system 600. As
stated above, the interface of the heat spreaders between memory
modules 305, 306 can form a plurality of air channels 360 (FIG.
3A), and these air channels can be configured to receive the forced
air flow from the fan unit 660. As such, heat from the memory
devices of the memory system 600 can be dissipated in an effective
manner using the fan unit 660. As shown in the illustrated
embodiment, the fan unit 660 is disposed on a side surface of the
heat spreaders 330, 335, 340, 345 and memory modules 305, 306, and
is configured to provide forced air flow from one side of the
memory system 600 to an opposing side thereof. In other
embodiments, the fan unit may be disposed on another portion (e.g.,
a top portion) of the memory system 600, depending on what
direction the air channels are facing if they exist. Furthermore,
while the fan unit 660 is shown in FIG. 6 to be over two memory
modules, in some embodiments the fan unit 660 may be sized to cover
more (e.g., three) or less (e.g., one) memory modules.
[0032] Although in the foregoing example embodiments the
projections of heat spreaders has been illustrated to have a
generally rectangular shape, in other embodiments of the present
disclosure, projections having other configurations can be
provided. For example, FIGS. 7A-7C illustrate a memory system
including heat spreaders for multiple semiconductor device modules
that have a variety of projection shapes. FIG. 7A includes a heat
spreader 705 having projections 706 with rounded concave edges 707,
FIG. 7B includes a heat spreader 710 having projections 711 with a
triangular shape, and FIG. 7C includes a heat spreader 715 having
rectangular projections 716 with air channels 717.
[0033] FIG. 8 is a flow chart illustrating a method 800 of
manufacturing a memory module in accordance with an embodiment of
the present disclosure. The method 800 includes attaching a first
semiconductor device to a first side of a substrate (process
portion 802). In some embodiments, the substrate may be part of a
memory module, as described above, and be attached to a memory
connector that is attached to a computing device. The method 800
can further include disposing a first heat spreader on the first
semiconductor device, with the first heat spreader having a
plurality of first projections arranged in a first arrangement
(process portion 804). The method 800 can further include attaching
a second semiconductor device to a second side of the substrate
(process portion 806), and disposing a second heat spreader on the
second semiconductor device, with the second heat spreader having a
plurality of second projections arranged in a second arrangement
different than the first arrangement (process portion 808). The
first and second arrangements can correspond to the first and
second arrangements described above with reference to FIGS. 3A-3D.
For example, in some embodiments, the first projections in the
first arrangement can be generally aligned with the second
projections in the second arrangement in a first direction (e.g., a
vertical direction), and be generally offset with the second
projections in a second direction (e.g., a horizontal
direction).
[0034] Numerous specific details are discussed to provide a
thorough and enabling description of embodiments of the present
technology. A person skilled in the art, however, will understand
that the technology may have additional embodiments and that the
technology may be practiced without several of the details of the
embodiments described below with reference to the appended Figures.
For example, while the projections of certain heat spreaders were
shown to align with other projections in a vertical direction and
be offset from other projections in a horizontal direction, in some
embodiments, the opposite may be true (i.e., projections can be
aligned in a horizontal direction and offset in a vertical
direction). In other instances, well-known structures or operations
often associated with memory devices are not shown, or are not
described in detail, to avoid obscuring other aspects of the
technology. In general, it should be understood that various other
devices and systems in addition to those specific embodiments
disclosed herein may be within the scope of the present technology.
For example, in the illustrated embodiments, the memory devices and
systems are primarily described in the context of DIMMs compatible
with DRAM and flash (e.g., NAND and/or NOR) storage media. Memory
devices and systems configured in accordance with other embodiments
of the present technology, however, can include memory modules
compatible with other types of storage media, including PCM, RRAM,
MRAM, read only memory (ROM), erasable programmable ROM (EPROM),
electrically erasable programmable ROM (EEROM), ferroelectric,
magnetoresistive, and other storage media, including static
random-access memory (SRAM). Additionally, at least some of the
heat spreaders described herein may be useful in semiconductor
packages other than memory packages.
[0035] As used herein, the terms "vertical," "horizontal,"
"lateral," "upper," "lower," "above," and "below" can refer to
relative directions or positions of features in the semiconductor
devices in view of the orientation shown in the Figures. For
example, "upper" or "uppermost" can refer to a feature positioned
closer to the top of a page than another feature. These terms,
however, should be construed broadly to include semiconductor
devices having other orientations, such as inverted or inclined
orientations where top/bottom, over/under, above/below, up/down,
and left/right can be interchanged depending on the
orientation.
[0036] From the foregoing, it will be appreciated that specific
embodiments of the technology have been described herein for
purposes of illustration, but that various modifications may be
made without deviating from the disclosure. For example, while a
certain number of projections of heat spreaders are shown in FIGS.
3A-8, this number can vary according to the needs of the particular
application. Accordingly, the invention is not limited except as by
the appended claims. Furthermore, certain aspects of the new
technology described in the context of particular embodiments may
also be combined or eliminated in other embodiments. For example,
the fan unit 660 shown in FIG. 6 can be incorporated into the
embodiment shown in FIGS. 4A-5, and the third heat spreader 550
shown in FIG. 5 can be incorporated into the embodiment shown in
FIGS. 4A and 4B. Moreover, although advantages associated with
certain embodiments of the new technology have been described in
the context of those embodiments, other embodiments may also
exhibit such advantages and not all embodiments need necessarily
exhibit such advantages to fall within the scope of the technology.
Accordingly, the disclosure and associated technology can encompass
other embodiments not expressly shown or described herein.
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