Qian; Qiuxiao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Qian; Qiuxiao.The latest application filed is for "four mosfet full bridge module".

Company Profile

1.19.18

Qian; Qiuxiao - Jiangsu N/A CN
Qian; Qiuxiao - Singapore CN
Qian; Qiuxiao - Suzhou N/A CN
Qian; Qiuxiao - Suzhou Jiangsu CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor die package including IC driver and bridge Grant 8,674,490 - Liu , et al. March 18, 2	2014-03-18
Embedded semiconductor power modules and packages Grant 8,421,204 - Liu , et al. April 16, 2	2013-04-16
Embedded die package on package (POP) with pre-molded leadframe Grant 8,389,338 - Liu , et al. March 5, 2	2013-03-05
Four MOSFET full bridge module Grant 8,367,481 - Liu , et al. February 5, 2	2013-02-05
Four Mosfet Full Bridge Module App 20130005083 - Liu; Yong ; et al.	2013-01-03
Wafer Level Molded Opto-couplers App 20120326170 - Liu; Yong ; et al.	2012-12-27
Embedded Semiconductor Power Modules And Packages App 20120292778 - Liu; Yong ; et al.	2012-11-22
Four Mosfet Full Bridge Module App 20120149149 - Liu; Yong ; et al.	2012-06-14
Embedded Die Package On Package (pop) With Pre-molded Leadframe App 20120094436 - Liu; Yong ; et al.	2012-04-19
Four mosfet full bridge module Grant 8,138,585 - Liu , et al. March 20, 2	2012-03-20
Embedded die package on package (POP) with pre-molded leadframe Grant 8,063,474 - Liu , et al. November 22, 2	2011-11-22
Semiconductor package with stacked dice for a buck converter Grant 8,063,472 - Liu , et al. November 22, 2	2011-11-22
FLMP buck converter with a molded capacitor and a method of the same Grant 8,023,279 - Qian , et al. September 20, 2	2011-09-20
Semiconductor die package including multiple semiconductor dice Grant 8,018,054 - Liu , et al. September 13, 2	2011-09-13
Semiconductor Die Package Including Ic Driver And Bridge App 20110140255 - Liu; Yong ; et al.	2011-06-16
Semiconductor die package including IC driver and bridge Grant 7,915,721 - Liu , et al. March 29, 2	2011-03-29
Stacking quad pre-molded component packages, systems using the same, and methods of making the same Grant 7,829,988 - Liu , et al. November 9, 2	2010-11-09
Semiconductor die packages having overlapping dice, system using the same, and methods of making the same Grant 7,825,502 - Irving , et al. November 2, 2	2010-11-02
Flmp Buck Converter With A Molded Capacitor App 20100232131 - Qian; Qiuxiao ; et al.	2010-09-16
Stacked dual-die packages, methods of making, and systems incorporating said packages Grant 7,768,123 - Liu , et al. August 3, 2	2010-08-03
Stacked synchronous buck converter Grant 7,750,445 - Liu , et al. July 6, 2	2010-07-06
Pin substrate and package Grant 7,745,244 - Yuan , et al. June 29, 2	2010-06-29
Stacking Quad Pre-Molded Component Packages, Systems Using the Same, and Methods of Making the Same App 20100072590 - Liu; Yong ; et al.	2010-03-25
Pin Substrate And Package App 20090315171 - Yuan; Zhongfa ; et al.	2009-12-24
Four Mosfet Full Bridge Module App 20090294936 - Liu; Yong ; et al.	2009-12-03
Stacked Micro-Module Packages, Systems Using the Same, and Methods of Making the Same App 20090256245 - Liu; Yong ; et al.	2009-10-15
Semiconductor Die Package Including Ic Driver And Bridge App 20090230518 - Liu; Yong ; et al.	2009-09-17
Semiconductor Die Package Including Multiple Semiconductor Dice App 20090230536 - Liu; Yong ; et al.	2009-09-17
Embedded Die Package On Package (pop) With Pre-molded Leadframe App 20090194887 - Liu; Yong ; et al.	2009-08-06
Semiconductor Package With Stacked Dice For A Buck Converter App 20090189266 - Liu; Yong ; et al.	2009-07-30
Semiconductor Die Packages Having Overlapping Dice, System Using the Same, and Methods of Making the Same App 20090174047 - Irving; Scott ; et al.	2009-07-09
Stacked Dual-Die Packages, Methods of Making, and Systems Incorporating Said Packages App 20090079092 - Liu; Yong ; et al.	2009-03-26
Stacked Synchronous Buck Converter App 20090072359 - Liu; Yong ; et al.	2009-03-19

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.