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Pyo; Sung-Gyu Patent Filings

Pyo; Sung-Gyu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pyo; Sung-Gyu.The latest application filed is for "backside illuminated image sensor and manufacturing method thereof".

Company Profile
0.20.33
  • Pyo; Sung-Gyu - Gyeonggi-do KR
  • Pyo; Sung-Gyu - Chungcheongbuk-do N/A KR
  • Pyo; Sung-Gyu - Seoul KR
  • Pyo; Sung Gyu - Yongin-Shi KR
  • Pyo, Sung Gyu - Kyoungki-do KR
  • Pyo; Sung Gyu - Kyonggi-do KR
  • Pyo; Sung Gyu - Ichon KR
  • Pyo; Sung Gyu - Ichon-Shi KR
  • Pyo; Sung Gyu - Kyungki-Do KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Backside illuminated image sensor and manufacturing method thereof
Grant 8,969,194 - Pyo March 3, 2
2015-03-03
Backside illuminated image sensor
Grant 8,772,072 - Pyo July 8, 2
2014-07-08
Backside Illuminated Image Sensor And Manufacturing Method Thereof
App 20140038337 - Pyo; Sung-Gyu
2014-02-06
Backside illuminated sensor and manufacturing method thereof
Grant 8,564,135 - Pyo October 22, 2
2013-10-22
Package of MEMS device and method for fabricating the same
Grant 8,357,560 - Pyo , et al. January 22, 2
2013-01-22
Backside Illuminated Image Sensor
App 20120252154 - PYO; SUNG-GYU
2012-10-04
Backside illuminated image sensor
Grant 8,212,328 - Pyo July 3, 2
2012-07-03
Backside Illuminated Sensor And Manufacturing Method Thereof
App 20110186951 - Pyo; Sung-Gyu
2011-08-04
Method Of Manufacturing A Cmos Image Sensor
App 20110180895 - Pyo; Sung-Gyu
2011-07-28
MEMS package that includes MEMS device wafer bonded to cap wafer and exposed array pads
Grant 7,948,043 - Kim , et al. May 24, 2
2011-05-24
Package Of Mems Device And Method For Fabricating The Same
App 20100006959 - KIM; Dong-Joon ;   et al.
2010-01-14
Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap wafer
Grant 7,615,394 - Kim , et al. November 10, 2
2009-11-10
Package of MEMS device and method for fabricating the same
App 20090233395 - Pyo; Sung-Gyu ;   et al.
2009-09-17
Package of MEMS device and method for fabricating the same
Grant 7,557,441 - Pyo , et al. July 7, 2
2009-07-07
Backside illuminated image sensor
App 20090146148 - Pyo; Sung-Gyu
2009-06-11
Package of MEMS device and method for fabricating the same
App 20080029864 - Pyo; Sung-Gyu ;   et al.
2008-02-07
Package of MEMS device and method for fabricating the same
App 20070290308 - Kim; Dong-Joon ;   et al.
2007-12-20
Method for forming inductor in semiconductor device
Grant 7,041,566 - Pyo May 9, 2
2006-05-09
Radio frequency semiconductor device and method of manufacturing the same
Grant 7,037,800 - Pyo May 2, 2
2006-05-02
Chip scale image sensor and method for fabricating the same
App 20050253176 - Pyo, Sung Gyu
2005-11-17
Radio frequency semiconductor device and method of manufacturing the same
App 20050139954 - Pyo, Sung Gyu
2005-06-30
Method for forming inductor in semiconductor device
App 20050130423 - Pyo, Sung Gyu
2005-06-16
Method for forming diffusion barrier film of semiconductor device
Grant 6,849,298 - Pyo February 1, 2
2005-02-01
Heater block having catalyst spray means
Grant 6,846,364 - Pyo January 25, 2
2005-01-25
Method for forming inductor in semiconductor device
App 20050014317 - Pyo, Sung Gyu
2005-01-20
Cu film deposition equipment of semiconductor device
App 20040092101 - Pyo, Sung Gyu ;   et al.
2004-05-13
Method of forming a metal wiring in a semiconductor device
Grant 6,723,645 - Pyo April 20, 2
2004-04-20
Method of catalyzing copper deposition in a damascene structure by plasma treating the barrier layer and then applying a catalyst such as iodine or iodine compounds to the barrier layer
Grant 6,645,858 - Pyo , et al. November 11, 2
2003-11-11
Method of forming a metal wiring in a semiconductor device
Grant 6,627,523 - Pyo September 30, 2
2003-09-30
Method of manufacturing a metal wiring in a semiconductor device
Grant 6,617,238 - Pyo September 9, 2
2003-09-09
Chemical enhancer treatment chamber and a Cu, thin film deposition apparatus of a semiconductor device using the same
App 20030000469 - Pyo, Sung Gyu
2003-01-02
Cu film deposition equipment of semiconductor device
App 20020187635 - Pyo, Sung Gyu ;   et al.
2002-12-12
Method for forming diffusion barrier film of semiconductor device
App 20020187261 - Pyo, Sung Gyu
2002-12-12
Method of manufacturing a metal wiring in a semiconductor device
App 20020076922 - Pyo, Sung Gyu
2002-06-20
Method for forming metal line in a semiconductor device
App 20020052110 - Pyo, Sung Gyu
2002-05-02
Method of forming a metal wiring in a semiconductor device
App 20020048949 - Pyo, Sung Gyu
2002-04-25
Method of manufacturing a copper wiring in a semiconductor device
App 20020031912 - Pyo, Sung Gyu
2002-03-14
Method of manufacturing a copper metal wiring in a semiconductor device
App 20020031911 - Pyo, Sung Gyu
2002-03-14
Method of manufacturing a metal line in a semiconductor device
App 20020025671 - Pyo, Sung Gyu
2002-02-28
Liquid delivery system
Grant 6,349,887 - Pyo February 26, 2
2002-02-26
Showerhead and liquid raw material supply apparatus using the same
App 20020020767 - Pyo, Sung Gyu
2002-02-21
Showerhead in chemical-enhanced chemical vapor deposition equipment
App 20020017243 - Pyo, Sung Gyu
2002-02-14
Method of forming a metal wiring in a semiconductor device
App 20020019121 - Pyo, Sung Gyu
2002-02-14
Method of forming a metal line in a semiconductor device
App 20020016061 - Pyo, Sung Gyu
2002-02-07
Heater block having catalyst spray means
App 20020014204 - Pyo, Sung Gyu
2002-02-07
Method of forming a metal wiring in a semiconductor device
App 20020009884 - Pyo, Sung Gyu
2002-01-24
Method of forming a metal wiring in a semiconductor device
App 20020006727 - Pyo, Sung Gyu
2002-01-17
Apparatus for supplying a liquid raw material and method of manufacturing a copper layer using the same
App 20010053587 - Pyo, Sung Gyu
2001-12-20
Method of manufacturing a metal wiring in a semiconductor device
App 20010053599 - Pyo, Sung Gyu
2001-12-20
Method of manufacturing a copper metal wiring in a semiconductor device
App 20010053603 - Pyo, Sung Gyu ;   et al.
2001-12-20

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