Pu; Bryan Y.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pu; Bryan Y..The latest application filed is for "method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor".

Company Profile

0.23.22

Pu; Bryan Y. - San Jose CA US
Pu; Bryan Y. - Sun Jose CA
Pu; Bryan Y - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor Grant 8,936,696 - Lindley , et al. January 20, 2	2015-01-20
Plasma etch reactor with distribution of etch gases across a wafer surface and a polymer oxidizing gas in an independently fed center gas zone Grant 8,187,415 - Kim , et al. May 29, 2	2012-05-29
Method And Apparatus For Shaping A Magnetic Field In A Magnetic Field-enhanced Plasma Reactor App 20110115589 - LINDLEY; ROGER ALAN ; et al.	2011-05-19
Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor Grant 7,879,186 - Lindley , et al. February 1, 2	2011-02-01
Plasma control using dual cathode frequency mixing Grant 7,838,430 - Shannon , et al. November 23, 2	2010-11-23
Halogen-free amorphous carbon mask etch having high selectivity to photoresist Grant 7,807,064 - Kim , et al. October 5, 2	2010-10-05
Plasma control using dual cathode frequency mixing and controlling the level of polymer formation Grant 7,736,914 - Liu , et al. June 15, 2	2010-06-15
Plasma Control Using Dual Cathode Frequency Mixing App 20090142859 - LIU; JINGBAO ; et al.	2009-06-04
Method And Apparatus For Shaping A Magnetic Field In A Magnetic Field-enhanced Plasma Reactor App 20090008033 - Lindley; Roger Alan ; et al.	2009-01-08
Halogen-free Amorphous Carbon Mask Etch Having High Selectivity To Photoresist App 20080230511 - Kim; Jong Mun ; et al.	2008-09-25
Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor Grant 7,422,654 - Lindley , et al. September 9, 2	2008-09-09
Methods For Etching High Aspect Ratio Features App 20080203056 - WANG; JUDY ; et al.	2008-08-28
Method and apparatus for providing uniform plasma in a magnetic field enhanced plasma reactor Grant 7,374,636 - Horioka , et al. May 20, 2	2008-05-20
Method and apparatus for controlling the magnetic field intensity in a plasma enhanced semiconductor wafer processing chamber Grant 7,316,199 - Horioka , et al. January 8, 2	2008-01-08
Plasma etch process using etch uniformity control by using compositionally independent gas feed App 20070249173 - Kim; Jong Mun ; et al.	2007-10-25
Plasma etch reactor with distribution of etch gases across a wafer surface and a polymer oxidizing gas in an independently fed center gas zone App 20070247075 - Kim; Jong Mun ; et al.	2007-10-25
Plasma Control Using Dual Cathode Frequency Mixing App 20070000611 - Shannon; Steven C. ; et al.	2007-01-04
Plasma control using dual cathode frequency mixing App 20050090118 - Shannon, Steven C. ; et al.	2005-04-28
Dielectric etch chamber with expanded process window App 20050003675 - Carducci, James D. ; et al.	2005-01-06
Monitoring dimensions of features at different locations in the processing of substrates Grant 6,829,056 - Barnes , et al. December 7, 2	2004-12-07
Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply Grant 6,825,618 - Pu , et al. November 30, 2	2004-11-30
Dielectric etch chamber with expanded process window Grant 6,797,639 - Carducci , et al. September 28, 2	2004-09-28
Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor App 20040182516 - Lindley, Roger Alan ; et al.	2004-09-23
Apparatus for uniformly etching a dielectric layer App 20040149394 - Doan, Kenny L. ; et al.	2004-08-05
Dielectric etch chamber with expanded process window Grant 6,716,302 - Carducci , et al. April 6, 2	2004-04-06
Low loss RF bias electrode for a plasma reactor with enhanced wafer edge RF coupling and highly efficient wafer cooling App 20040027781 - Hanawa, Hiroji ; et al.	2004-02-12
Shield or ring surrounding semiconductor workpiece in plasma chamber Grant 6,689,249 - Ke , et al. February 10, 2	2004-02-10
Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply App 20030192644 - Pu, Bryan Y. ; et al.	2003-10-16
Magnetically enhanced plasma oxide etch using hexafluorobutadiene Grant 6,613,689 - Liu , et al. September 2, 2	2003-09-02
Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply Grant 6,568,346 - Pu , et al. May 27, 2	2003-05-27
Method and apparatus for controlling the magnetic field intensity in a plasma enhanced semiconductor wafer processing chamber App 20030085000 - Horioka, Keiji ; et al.	2003-05-08
Dielectric etch chamber with expanded process window App 20030038111 - Carducci, James D. ; et al.	2003-02-27
Dielectric etch chamber with expanded process window App 20030037880 - Carducci, James D. ; et al.	2003-02-27
Method and apparatus for providing uniform plasma in a magnetic field enhanced plasma reactor App 20030006008 - Horioka, Keiji ; et al.	2003-01-09
Magnetically enhanced plasma oxide etch using hexafluorobutadiene App 20020173162 - Liu, Jingbao ; et al.	2002-11-21
Magnetically enhanced plasma etch process using a heavy fluorocarbon etching gas Grant 6,451,703 - Liu , et al. September 17, 2	2002-09-17
Etch method using a dielectric etch chamber with expanded process window Grant 6,403,491 - Liu , et al. June 11, 2	2002-06-11
Shield or ring surrounding semiconductor workpiece in plasma chamber App 20020066531 - Ke, Kuang-Han ; et al.	2002-06-06
Distributed inductively-coupled plasma source and circuit for coupling induction coils to RF power supply App 20010054383 - Pu, Bryan Y. ; et al.	2001-12-27
Plasma pretreatment of photoresist in an oxide etch process Grant 6,326,307 - Lindley , et al. December 4, 2	2001-12-04
Shield or ring surrounding semiconductor workpiece in plasma chamber Grant 6,284,093 - Ke , et al. September 4, 2	2001-09-04
Adjusting DC bias voltage in plasma chamber App 20010014540 - Shan, Hongching ; et al.	2001-08-16
Distributed inductively-coupled plasma source Grant 6,273,022 - Pu , et al. August 14, 2	2001-08-14
Adjusting DC bias voltage in plasma chamber Grant 6,221,782 - Shan , et al. April 24, 2	2001-04-24

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