| Patent | Date |
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Chip package interaction (CPI) back-end-of-line (BEOL) monitoring structure and method
Grant 10,643,912 - Pozder , et al. | 2020-05-05 |
Chip Package Interaction (cpi) Back-end-of-line (beol) Monitoring Structure And Method
App 20190027413 - Pozder; Scott K. ; et al. | 2019-01-24 |
3-D semiconductor die structure with containing feature and method
Grant 8,581,383 - Pozder , et al. November 12, 2 | 2013-11-12 |
3-d Semiconductor Die Structure With Containing Feature And Method
App 20100327440 - POZDER; SCOTT K. ; et al. | 2010-12-30 |
3-D semiconductor die structure with containing feature and method
Grant 7,811,932 - Pozder , et al. October 12, 2 | 2010-10-12 |
Mechanical integrity evaluation of low-k devices with bump shear
Grant 7,622,309 - Su , et al. November 24, 2 | 2009-11-24 |
Fabrication of three dimensional integrated circuit employing multiple die panels
Grant 7,622,313 - Jones , et al. November 24, 2 | 2009-11-24 |
3-d Semiconductor Die Structure With Containing Feature And Method
App 20090166888 - Pozder; Scott K. ; et al. | 2009-07-02 |
Method of forming crack arrest features in embedded device build-up package and package thereof
Grant 7,553,753 - Zhao , et al. June 30, 2 | 2009-06-30 |
Semiconductor device having a fuse and method of forming thereof
Grant 7,535,078 - Kobayashi , et al. May 19, 2 | 2009-05-19 |
Barrier For Use In 3-d Integration Of Circuits
App 20080197497 - POZDER; SCOTT K. ; et al. | 2008-08-21 |
Barrier for use in 3-D integration of circuits
Grant 7,378,339 - Pozder , et al. May 27, 2 | 2008-05-27 |
Semiconductor stacked die/wafer configuration and packaging and method thereof
Grant 7,358,616 - Alam , et al. April 15, 2 | 2008-04-15 |
Method Of Forming Crack Arrest Features In Embedded Device Build-up Package And Package Thereof
App 20080057696 - Zhao; Jie-Hua ; et al. | 2008-03-06 |
Semiconductor device having a fuse and method of forming thereof
App 20070267651 - Kobayashi; Thomas S. ; et al. | 2007-11-22 |
Barrier For Use In 3-d Integration Of Circuits
App 20070231950 - Pozder; Scott K. ; et al. | 2007-10-04 |
Die level metal density gradient for improved flip chip package reliability
Grant 7,276,435 - Pozder , et al. October 2, 2 | 2007-10-02 |
Magnetic alignment of integrated circuits to each other
App 20070181653 - Michaelson; Lynne M. ; et al. | 2007-08-09 |
Integrated circuit having structural support for a flip-chip interconnect pad and method therefor
Grant 7,247,552 - Pozder , et al. July 24, 2 | 2007-07-24 |
Semiconductor stacked die/wafer configuration and packaging and method thereof
App 20070057384 - Alam; Syed M. ; et al. | 2007-03-15 |
Fabrication of three dimensional integrated circuit employing multiple die panels
App 20070023121 - Jones; Robert E. ; et al. | 2007-02-01 |
Method for forming a bond pad interface
Grant 7,169,694 - Pozder , et al. January 30, 2 | 2007-01-30 |
Mechanical integrity evaluation of low-k devices with bump shear
App 20060292711 - Su; Peng ; et al. | 2006-12-28 |
Semiconductor device with magnetically permeable heat sink
Grant 7,153,726 - Pozder , et al. December 26, 2 | 2006-12-26 |
Integrated circuit having structural support for a flip-chip interconnect pad and method therefor
App 20060154470 - Pozder; Scott K. ; et al. | 2006-07-13 |
Separately strained N-channel and P-channel transistors
Grant 7,041,576 - Pozder , et al. May 9, 2 | 2006-05-09 |
Semiconductor device with magnetically permeable heat sink
App 20050285259 - Pozder, Scott K. ; et al. | 2005-12-29 |
Backside body contact
App 20050280088 - Min, Byoung W. ; et al. | 2005-12-22 |
Separately strained N-channel and P-channel transistors
App 20050275017 - Pozder, Scott K. ; et al. | 2005-12-15 |
Semiconductor device with magnetically permeable heat sink
Grant 6,958,548 - Pozder , et al. October 25, 2 | 2005-10-25 |
Metal reduction in wafer scribe area
Grant 6,951,801 - Pozder , et al. October 4, 2 | 2005-10-04 |
Semiconductor device with magnetically permeable heat sink
App 20050104193 - Pozder, Scott K. ; et al. | 2005-05-19 |
Method for forming a bond pad interface
App 20050014356 - Pozder, Scott K. ; et al. | 2005-01-20 |
Method for forming a semiconductor device having a mechanically robust pad interface
Grant 6,803,302 - Pozder , et al. October 12, 2 | 2004-10-12 |
Metal reduction in wafer scribe area
App 20040147097 - Pozder, Scott K. ; et al. | 2004-07-29 |
Semiconductor device having a fuse and method of forming thereof
App 20030151060 - Kobayashi, Thomas S. ; et al. | 2003-08-14 |
Method Of Forming A Bond Pad And Structure Thereof
App 20030054626 - Kobayashi, Thomas S. ; et al. | 2003-03-20 |
Method of forming a bond pad and structure thereof
Grant 6,531,384 - Kobayashi , et al. March 11, 2 | 2003-03-11 |
Method and apparatus for manufacturing an interconnect structure
Grant 6,429,531 - Mistry , et al. August 6, 2 | 2002-08-06 |
Method of forming an alternative ground contact for a semiconductor die
Grant 6,420,208 - Pozder , et al. July 16, 2 | 2002-07-16 |
Method for forming a semiconductor device having a mechanically robust pad interface.
App 20010051426 - POZDER, SCOTT K. ; et al. | 2001-12-13 |
Semiconductor device adhesive layer structure and process for forming structure
Grant 6,294,458 - Zhang , et al. September 25, 2 | 2001-09-25 |
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