Pommer; Richard
Patent Applications and Registrations
Patent applications and USPTO patent grants for Pommer; Richard.The latest application filed is for "multi-layer interconnect".
- Pommer; Richard - San Clemente CA
- Pommer, Richard - Carlsbad CA
- Pommer; Richard - Trabuco Canyon CA
- Pommer; Richard - Orange CA
- POMMER, RICHARD - COSTA MESA CA
| Patent | Date |
|---|---|
| Small-scale optoelectronic package Grant 6,910,812 - Pommer , et al. June 28, 2 | 2005-06-28 |
| Multi-layer interconnect App 20040124534 - Pommer, Richard ; et al. | 2004-07-01 |
| Lasable bond-ply materials for high density printed wiring boards Grant 6,673,190 - Haas , et al. January 6, 2 | 2004-01-06 |
| Small-scale optoelectronic package App 20030201462 - Pommer, Richard ; et al. | 2003-10-30 |
| Power conditioning substrate stiffener App 20030197256 - Pommer, Richard | 2003-10-23 |
| Method of making a multi-layer interconnect Grant 6,607,939 - Pommer , et al. August 19, 2 | 2003-08-19 |
| Multi-layer interconnect App 20020092159 - Pommer, Richard ; et al. | 2002-07-18 |
| Lasable bond-ply materials for high density printed wiring boards App 20020004352 - Haas, David ; et al. | 2002-01-10 |
| Multi-layer Interconnect App 20020003303 - POMMER, RICHARD ; et al. | 2002-01-10 |
| Substrate Manufacturing Plant Having Minimum Footprint Skinned Lines App 20010039715 - POMMER, RICHARD ; et al. | 2001-11-15 |
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