Poliks; Mark D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Poliks; Mark D..The latest application filed is for "nanoparticle sensor having a nanofibrous membrane scaffold".

Company Profile

1.35.35

Poliks; Mark D. - Vestal NY
Poliks; Mark D. - Vetal NY
Poliks, Mark D - Vestal NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Nanoparticle Sensor Having A Nanofibrous Membrane Scaffold App 20220265173 - Zhong; Chuan-Jian ; et al.	2022-08-25
Nanoparticle sensor having a nanofibrous membrane scaffold Grant 11,331,019 - Zhong , et al. May 17, 2	2022-05-17
Nanoparticle Sensor Having A Nanofibrous Membrane Scaffold App 20190038190 - Zhong; Chuan-Jian ; et al.	2019-02-07
Embedded thin films Grant 10,064,283 - Cho , et al. August 28, 2	2018-08-28
Autonomous gamma, X-ray, and particle detector Grant 9,835,737 - Czarnecki , et al. December 5, 2	2017-12-05
Autonomous gamma, X-ray, and particle detector Grant 9,606,245 - Czarnecki , et al. March 28, 2	2017-03-28
Embedded Thin Films App 20170013721 - Cho; Junghyun ; et al.	2017-01-12
Embedded Thin Films App 20160135303 - Cho; Junghyun ; et al.	2016-05-12
Embedded thin films Grant 8,882,983 - Cho , et al. November 11, 2	2014-11-11
Conducting paste for device level interconnects Grant 8,685,284 - Das , et al. April 1, 2	2014-04-01
Anti-tamper microchip package based on thermal nanofluids or fluids Grant 8,288,857 - Das , et al. October 16, 2	2012-10-16
Conductive Metal Micro-pillars For Enhanced Electrical Interconnection App 20120257343 - Das; Rabindra N. ; et al.	2012-10-11
Circuitized Substrate With Internal Thin Film Capacitor And Method Of Making Same App 20120228014 - Das; Rabindra N. ; et al.	2012-09-13
Multilayered circuitized substrate with P-aramid dielectric layers and method of making same Grant 8,211,790 - Japp , et al. July 3, 2	2012-07-03
Anti-tamper Microchip Package Based On Thermal Nanofluids Or Fluids App 20120068326 - Das; Rabindra N. ; et al.	2012-03-22
Conducting Paste For Device Level Interconnects App 20120069531 - Das; Rabindra N. ; et al.	2012-03-22
Circuitized substrate with continuous thermoplastic support film dielectric layers Grant 8,084,863 - Japp , et al. December 27, 2	2011-12-27
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 7,981,245 - Egitto , et al. July 19, 2	2011-07-19
Multi-layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric App 20100218891 - Egitto; Frank D. ; et al.	2010-09-02
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 7,777,136 - Egitto , et al. August 17, 2	2010-08-17
Method of making circuitized substrate with internal optical pathway using photolithography Grant 7,713,767 - Chan , et al. May 11, 2	2010-05-11
Multilayered circuitized substrate with p-aramid dielectric layers and method of making same Grant 7,646,098 - Japp , et al. January 12, 2	2010-01-12
Embedded Thin Films App 20090301770 - Cho; Junghyun ; et al.	2009-12-10
Circuitized substrate with P-aramid dielectric layers and method of making same App 20090258161 - Japp; Robert M. ; et al.	2009-10-15
Multilayered circuitized substrate with p-aramid dielectric layers and method of making same App 20090173426 - Japp; Robert M. ; et al.	2009-07-09
Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate Grant 7,541,265 - Das , et al. June 2, 2	2009-06-02
Method of making circuitized substrate with internal optical pathway Grant 7,541,058 - Chan , et al. June 2, 2	2009-06-02
Method of making circuitized substrate with internal optical pathway App 20090092353 - Chan; Benson ; et al.	2009-04-09
Method of making circuitized substrate with internal optical pathway using photolithography App 20090093073 - Chan; Benson ; et al.	2009-04-09
Multi-layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric App 20080217050 - Egitto; Frank D. ; et al.	2008-09-11
Multilayered circuitized substrate with p-aramid dielectric layers and method of making same App 20080191353 - Japp; Robert M. ; et al.	2008-08-14
Circuitized substrate with p-aramid dielectric layers and method of making same App 20080191354 - Japp; Robert M. ; et al.	2008-08-14
Multi-layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric App 20080178999 - Egitto; Frank D. ; et al.	2008-07-31
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Grant 7,402,254 - Curcio , et al. July 22, 2	2008-07-22
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 7,301,108 - Egitto , et al. November 27, 2	2007-11-27
Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate App 20060154501 - Das; Rabindra N. ; et al.	2006-07-13
Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate App 20060151863 - Das; Rabindra N. ; et al.	2006-07-13
Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate Grant 7,025,607 - Das , et al. April 11, 2	2006-04-11
Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same Grant 7,014,731 - Farquhar , et al. March 21, 2	2006-03-21
Lamination of liquid crystal polymer dielectric films Grant 6,967,705 - Farquhar , et al. November 22, 2	2005-11-22
Porous power and ground planes for reduced PCB delamination and better reliability Grant 6,944,946 - Japp , et al. September 20, 2	2005-09-20
Tamper-responding encapsulated enclosure having flexible protective mesh structure Grant 6,929,900 - Farquhar , et al. August 16, 2	2005-08-16
Multi-layered interconnect structure using liquid crystalline polymer dielectric App 20050057908 - Egitto, Frank D. ; et al.	2005-03-17
Lamination of liquid crystal polymer dielectric films App 20050019527 - Farquhar, Donald S. ; et al.	2005-01-27
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 6,826,830 - Egitto , et al. December 7, 2	2004-12-07
Lamination of liquid crystal polymer dielectric films Grant 6,819,373 - Farquhar , et al. November 16, 2	2004-11-16
Tamper-responding encapsulated enclosure having flexible protective mesh structure App 20040195001 - Farquhar, Donald S. ; et al.	2004-10-07
Method for making printed circuit board having low coefficient of thermal expansion power/ground plane Grant 6,722,031 - Japp , et al. April 20, 2	2004-04-20
Lamination of liquid crystal polymer dielectric films App 20040066478 - Farquhar, Donald S. ; et al.	2004-04-08
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements App 20040052945 - Curcio, Brian E. ; et al.	2004-03-18
Tamper-responding encapsulated enclosure having flexible protective mesh structure Grant 6,686,539 - Farquhar , et al. February 3, 2	2004-02-03
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Grant 6,645,607 - Curcio , et al. November 11, 2	2003-11-11
Porous power and ground planes for reduced PCB delamination and better reliability App 20030196749 - Japp, Robert M. ; et al.	2003-10-23
Porous power and ground planes for reduced PCB delamination and better reliability Grant 6,613,413 - Japp , et al. September 2, 2	2003-09-02
Multi-layered interconnect structure using liquid crystalline polymer dielectric App 20030147227 - Egitto, Frank D. ; et al.	2003-08-07
Thin film attachment to laminate using a dendritic interconnection Grant 6,600,224 - Farquhar , et al. July 29, 2	2003-07-29
Method of joining laminates for z-axis interconnection App 20030041966 - Casey, Jon A. ; et al.	2003-03-06
Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use App 20030003305 - Japp, Robert Maynard ; et al.	2003-01-02
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements App 20020192444 - Curcio, Brian E. ; et al.	2002-12-19
Method And Structure For Producing Z-axis Interconnection Assembly Of Printed Wiring Board Elements App 20020150741 - Curcio, Brian E. ; et al.	2002-10-17
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Grant 6,465,084 - Curcio , et al. October 15, 2	2002-10-15
Tamper-responding encapsulated enclosure having flexible protective mesh structure App 20020084090 - Farquhar, Donald S. ; et al.	2002-07-04
Low CTE power and ground planes App 20020050402 - Japp, Robert M. ; et al.	2002-05-02
Low CTE power and ground planes Grant 6,329,603 - Japp , et al. December 11, 2	2001-12-11
Smiconductor device having a thermoset- containing dielectric material and methods for fabricating the same App 20010041389 - Farquhar, Donald S. ; et al.	2001-11-15
Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same Grant 6,254,972 - Farquhar , et al. July 3, 2	2001-07-03
Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same App 20010005548 - Farquhar, Donald S. ; et al.	2001-06-28
Dielectric composition and solder interconnection structure for its use Grant 5,194,930 - Papathomas , et al. March 16, 1	1993-03-16

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