Podlesnik; Dragan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Podlesnik; Dragan.The latest application filed is for "systems for surface treatment of semiconductor substrates using sequential chemical applications".

Company Profile

0.23.14

Podlesnik; Dragan - Palo Alto CA US
Podlesnik; Dragan - New York City NY
Podlesnik; Dragan - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Arrangement for identifying uncontrolled events at the process module level and methods thereof Grant 8,983,631 - Huang , et al. March 17, 2	2015-03-17
Method of particle contaminant removal Grant 8,828,145 - Sabba , et al. September 9, 2	2014-09-09
Systems for Surface Treatment of Semiconductor Substrates using Sequential Chemical Applications App 20140116476 - Mikhaylichenko; Katrina ; et al.	2014-05-01
Method and apparatus for surface treatment of semiconductor substrates using sequential chemical applications Grant 8,652,266 - Mikhaylichenko , et al. February 18, 2	2014-02-18
Methods for particle removal by single-phase and two-phase media Grant 8,226,775 - Mui , et al. July 24, 2	2012-07-24
Materials for particle removal by single-phase and two-phase media Grant 8,211,846 - Mui , et al. July 3, 2	2012-07-03
Apparatus For Particle Removal By Single-phase And Two-phase Media App 20120132234 - Mui; David S.L. ; et al.	2012-05-31
Apparatus for particle removal by single-phase and two-phase media Grant 8,084,406 - Mui , et al. December 27, 2	2011-12-27
Arrangement For Identifying Uncontrolled Events At The Process Module Level And Methods Thereof App 20100332012 - Huang; Chung-Ho ; et al.	2010-12-30
Method of Particle Contaminant Removal App 20100229890 - Sabba; Yizhak T. ; et al.	2010-09-16
Method And Apparatus For Surface Treatment Of Semiconductor Substrates Using Sequential Chemical Applications App 20100018553 - Mikhaylichenko; Katrina ; et al.	2010-01-28
Materials For Particle Removal By Single-phase And Two-phase Media App 20090156452 - Mui; David S.L. ; et al.	2009-06-18
Apparatus For Particle Removal By Single-phase And Two-phase Media App 20090151757 - Mui; David S. L. ; et al.	2009-06-18
Methods For Particle Removal By Single-phase And Two-phase Media App 20090151752 - Mui; David S.L. ; et al.	2009-06-18
Method for etching high-aspect-ratio features Grant 6,897,155 - Kumar , et al. May 24, 2	2005-05-24
Method of micromachining a multi-part cavity Grant 6,827,869 - Podlesnik , et al. December 7, 2	2004-12-07
Methodologies to reduce process sensitivity to the chamber condition Grant 6,808,647 - Xu , et al. October 26, 2	2004-10-26
Apparatus for performing self cleaning method of forming deep trenches in silicon substrates Grant 6,802,933 - Khan , et al. October 12, 2	2004-10-12
Method for etching high-aspect-ratio features App 20040033697 - Kumar, Ajay ; et al.	2004-02-19
Plasma etching of silicon using fluorinated gas mixtures Grant 6,583,063 - Khan , et al. June 24, 2	2003-06-24
Method of micromachining a multi-part cavity App 20020185469 - Podlesnik, Dragan ; et al.	2002-12-12
Method of etching organic ARCs in patterns having variable spacings Grant 6,383,941 - Shen , et al. May 7, 2	2002-05-07
Two etchant etch method App 20020052113 - Khan, Anisul ; et al.	2002-05-02
Silicon trench etch using silicon-containing precursors to reduce or avoid mask erosion Grant 6,380,095 - Liu , et al. April 30, 2	2002-04-30
Two etchant etch method App 20020016080 - Khan, Anisul ; et al.	2002-02-07
Self cleaning method of forming deep trenches in silicon substrates App 20010051439 - Khan, Anisul ; et al.	2001-12-13
Self cleaning method of forming deep trenches in silicon substrates Grant 6,318,384 - Khan , et al. November 20, 2	2001-11-20
Apparatus for performing self cleaning method of forming deep trenches in silicon substrates App 20010020516 - Khan, Anisul ; et al.	2001-09-13
Method for plasma etching at a high etch rate Grant 6,270,634 - Kumar , et al. August 7, 2	2001-08-07
Method for etching a trench having rounded top and bottom corners in a silicon substrate Grant 6,235,643 - Mui , et al. May 22, 2	2001-05-22
Method for etching a trench having rounded top corners in a silicon substrate Grant 6,180,533 - Jain , et al. January 30, 2	2001-01-30
Apparatus for measuring plasma characteristics within a semiconductor wafer processing system and a method of fabricating and using same Grant 5,801,386 - Todorov , et al. September 1, 1	1998-09-01
Etching of silicon dioxide selectively to silicon nitride and polysilicon Grant 5,505,816 - Barnes , et al. April 9, 1	1996-04-09
Neutral beam apparatus for in-situ production of reactants and kinetic energy transfer Grant 5,468,955 - Chen , et al. November 21, 1	1995-11-21

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