PHOENIX PRECISION TECHNOLOGY CORPORATION

Patent Applications and Registrations

Patent applications and USPTO patent grants for PHOENIX PRECISION TECHNOLOGY CORPORATION.The latest application filed is for "circuit board having semiconductor chip embedded therein".

Company Profile

0.89.167

PHOENIX PRECISION TECHNOLOGY CORPORATION - Hsinchu TW
PHOENIX PRECISION TECHNOLOGY CORPORATION - Hsin-Chu TW
Phoenix Precision Technology Corporation - TW TW
Phoenix Precision Technology Corp. - Hsinchu TW
Phoenix Precision Technology Corporation - Science-Based Industrial Park Hsin-chu TW
PHOENIX PRECISION TECHNOLOGY CORPORATION - No. 6, Li-Hsin Road Science-Based Industrial Par Hsin-chu TW
Phoenix Precision Technology Corp. - TW TW
PHOENIX PRECISION TECHNOLOGY CORPORATION -
PHOENIX PRECISION TECHNOLOGY CORPORATION - No. 6, Li-Hsin Rd., Science-Based Industrial Par Hsinchu TW
Phoenix Precision Technology Corporation - CN CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit Board Having Semiconductor Chip Embedded Therein App 20120281375 - Hsu; Shih-Ping	2012-11-08
Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereof Grant 8,058,723 - Chia November 15, 2	2011-11-15
Package Substrate Having Semiconductor Component Embedded Therein And Fabrication Method Thereof App 20110057305 - Chia; Kan-Jung	2011-03-10
Package Substrate And Manufacturing Method Thereof App 20110056738 - Hu; Wen Hung	2011-03-10
Package Structure App 20110042800 - Hsu; Shin-Ping ; et al.	2011-02-24
Carrier structure embedded with semiconductor chip Grant 7,768,119 - Chia August 3, 2	2010-08-03
Structure with semiconductor chips embeded therein Grant 7,763,969 - Zeng , et al. July 27, 2	2010-07-27
Packaging substrate structure with electronic components embedded therein and method for manufacturing the same Grant 7,754,538 - Hsu July 13, 2	2010-07-13
Method for manufacturing coreless packaging substrate Grant 7,754,598 - Lin , et al. July 13, 2	2010-07-13
Circuit board structure with embedded semiconductor chip and method for fabricating the same Grant 7,719,104 - Hsu , et al. May 18, 2	2010-05-18
Electrically connecting terminal structure of circuit board and manufacturing method thereof Grant 7,719,853 - Shih May 18, 2	2010-05-18
Package substrate and method for fabricating the same Grant 7,718,470 - Hsu May 18, 2	2010-05-18
Method For Fabricating Printed Circuit Board Having Capacitance Components App 20100115767 - Hsu; Shin-Ping ; et al.	2010-05-13
Package structure having semiconductor chip embedded therein and method for fabricating the same Grant 7,705,446 - Chia , et al. April 27, 2	2010-04-27
Stack structure of circuit boards embedded with semiconductor chips Grant 7,706,148 - Hsu , et al. April 27, 2	2010-04-27
Conductive bump structure of circuit board and method for forming the same Grant 7,705,471 - Hu April 27, 2	2010-04-27
Semiconductor package substrate Grant 7,705,456 - Hu April 27, 2	2010-04-27
Packaging substrate App 20100096750 - Shih; Chao-Wen ; et al.	2010-04-22
Electrical connection element of packaging substrate App 20100089612 - Hsu; Shih-Ping	2010-04-15
Method for fabrication of a conductive bump structure of a circuit board Grant 7,674,362 - Hu March 9, 2	2010-03-09
Circuit board structure having capacitor array and embedded electronic component and method for fabricating the same Grant 7,674,986 - Chang , et al. March 9, 2	2010-03-09
Conductive structures for electrically conductive pads of circuit board and fabrication method thereof Grant 7,659,193 - Hu , et al. February 9, 2	2010-02-09
Method Of Fabricating Printed Circuit Board Having Semiconductor Components Embedded Therein App 20100029047 - Hsu; Shih-Ping ; et al.	2010-02-04
Stack structure of circuit board with semiconductor component embedded therein Grant 7,656,040 - Hsu , et al. February 2, 2	2010-02-02
Packaging substrate having heat-dissipating structure Grant 7,656,015 - Wong , et al. February 2, 2	2010-02-02
Package Substrate Structure App 20100002405 - Hsu; Shin-Ping	2010-01-07
Circuit Board Having Semiconductor Chip Embedded Therein App 20100002406 - Hsu; Shin-Ping	2010-01-07
Circuit board structure with embedded electronic components Grant 7,639,473 - Hsu , et al. December 29, 2	2009-12-29
Package Substrate Having Embedded Photosensitive Semiconductor Chip And Fabrication Method Thereof App 20090309179 - Hsu; Shih-Ping ; et al.	2009-12-17
Package Substrate Having Double-sided Circuits And Fabrication Method Thereof App 20090308652 - Shih; Chao-Wen	2009-12-17
Package Substrate Having Embedded Semiconductor Chip And Fabrication Method Thereof App 20090309202 - Hsu; Shin-Ping ; et al.	2009-12-17
Surface roughening method for embedded semiconductor chip structure Grant 7,629,204 - Hsu December 8, 2	2009-12-08
Method for fabricating a metal protection layer on electrically connecting pad of circuit board Grant 7,627,946 - Chou December 8, 2	2009-12-08
Packaging substrate structure App 20090294993 - Hsu; Shih-Ping	2009-12-03
Packaging Substrate And Method For Fabricating The Same App 20090294962 - Hsu; Shih-Ping	2009-12-03
Coreless package substrate with conductive structures Grant 7,626,270 - Chen , et al. December 1, 2	2009-12-01
Carrier structure for semiconductor chip and method for manufacturing the same Grant 7,619,317 - Lien , et al. November 17, 2	2009-11-17
Method for fabricating circuit board structure Grant 7,614,146 - Hsu November 10, 2	2009-11-10
Electrical connector structure of circuit board and method for fabricating the same Grant 7,608,929 - Hu October 27, 2	2009-10-27
Plate structure having chip embedded therein and the manufacturing method of the same Grant 7,598,610 - Hsu , et al. October 6, 2	2009-10-06
Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereof App 20090236750 - Chia; Kan-Jung	2009-09-24
Multi-layer circuit board with fine pitches and fabricating method thereof Grant 7,592,706 - Hsu September 22, 2	2009-09-22
Package structure with circuits directly connected to semiconductor chip Grant 7,582,961 - Chia , et al. September 1, 2	2009-09-01
Semiconductor package structure Grant 7,579,690 - Chia August 25, 2	2009-08-25
Circuit Board Structure Embedded With Semiconductor Chips App 20090200658 - HSU; Shih Ping ; et al.	2009-08-13
Package Substrate Embedded With Semiconductor Component App 20090168380 - Hsu; Shih-Ping ; et al.	2009-07-02
Package Substrate Embedded With Semiconductor Component App 20090166841 - Hsu; Shih-Ping ; et al.	2009-07-02
Method for fabricating electrical conductive structure of circuit board Grant 7,553,750 - Shih June 30, 2	2009-06-30
Chip embedded package structure and fabrication method thereof Grant 7,554,131 - Zeng June 30, 2	2009-06-30
Methods for repairing circuit board having defective pre-soldering bump Grant 7,546,682 - Hsu , et al. June 16, 2	2009-06-16
Package Substrate Having Electrically Connecting Structure App 20090146317 - Shih; Chao-Wen	2009-06-11
Manufacturing method of solder ball disposing surface structure of package substrate Grant 7,544,599 - Hsu June 9, 2	2009-06-09
Semiconductor Package Substrate App 20090134515 - Hu; Wen-Hung	2009-05-28
Chip embedded packaging structure Grant 7,539,022 - Hsu May 26, 2	2009-05-26
Circuit board having power source App 20090129040 - Hsu; Shih-Ping	2009-05-21
Stacked package module and method for fabricating the same App 20090115045 - Hsu; Shih-Ping ; et al.	2009-05-07
Packaging substrate having capacitor embedded therein App 20090102045 - Hsu; Shih-Ping ; et al.	2009-04-23
Package on package structure App 20090102039 - Hsu; Shih-Ping ; et al.	2009-04-23
Solder Ball Disposing Surface Structure Of Package Substrate App 20090102050 - HSU; Shih-Ping	2009-04-23
Package Substrate And Method For Fabricating The Same App 20090096099 - HSU; Shih-Ping	2009-04-16
Circuit board with optoelectronic component embedded therein Grant 7,519,244 - Hsu April 14, 2	2009-04-14
Stack structure of circuit boards embedded with semiconductor chips App 20090091903 - Hsu; Shih Ping ; et al.	2009-04-09
Stacked Semiconductor Device And Fabricating Method Thereof App 20090090541 - Chia; Kan-Jung	2009-04-09
Circuit Board And Fabrication Method Thereof App 20090090548 - Shih; Chao-Wen ; et al.	2009-04-09
Semiconductor chip electrical connection structure Grant 7,514,786 - Hsu April 7, 2	2009-04-07
Stack structure of carrier board embedded with semiconductor components and method for fabricating the same Grant 7,514,770 - Chang , et al. April 7, 2	2009-04-07
Packaging substrate structure having semiconductor chip embedded therein and fabricating method thereof App 20090085192 - Hsu; Shih-Ping ; et al.	2009-04-02
Manufacturing Method Of Solder Ball Disposing Surface Structure Of Package Substrate App 20090081861 - HSU; Shih-Ping	2009-03-26
Circuit board structure with capacitor embedded therein and method for fabricating the same App 20090077799 - Yang; Chih Kui	2009-03-26
Circuit board structure of integrated optoelectronic component Grant 7,508,006 - Hsu March 24, 2	2009-03-24
Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same Grant 7,507,915 - Chang , et al. March 24, 2	2009-03-24
Packaging substrate having heat-dissipating structure App 20090072384 - Wong; Lin-Yin ; et al.	2009-03-19
Circuit board and method for fabricating the same App 20090071704 - Hsu; Shih-Ping	2009-03-19
Packaging Substrate Structure And Method For Manufacturing The Same App 20090071699 - HSU; Shih-Ping	2009-03-19
Circuit Board Structure And Fabrication Method Thereof App 20090065245 - Hsu; Shih-Ping	2009-03-12
Circuit board structure and method for manufacturing the same App 20090065246 - Shih; Chao-Wen	2009-03-12
Packaging substrate structure with electronic component embedded therein and method for manufacture of the same App 20090057873 - Hsu; Shih-Ping	2009-03-05
Packaging substrate structure with electronic components embedded therein and method for fabricating the same App 20090057913 - Hsu; Shih-Ping	2009-03-05
Semiconductor Package Structure App 20090051024 - Chia; Kan-Jung	2009-02-26
Circuit board having electrically connecting structure and fabrication method thereof App 20090050359 - Hu; Wen-Hung ; et al.	2009-02-26
Packaging substrate structure with electronic components embedded therein and method for manufacturing the same App 20090046432 - Hsu; Shih-Ping	2009-02-19
Packaging Substrate Having Electrical Connection Structure And Method For Fabricating The Same App 20090041981 - Hsu; Shih-Ping	2009-02-12
Circuit Board And Method For Fabricating The Same App 20090038838 - Chang; Chia-Wei	2009-02-12
Packaging substrate and application thereof App 20090039493 - Chou; Pao-Hung ; et al.	2009-02-12
Packaging Substrate Having Chip Embedded Therein And Manufacturing Method Thereof App 20090032930 - Hsu; Shih-Ping ; et al.	2009-02-05
Circuit Board App 20090032294 - Hsu; Shih-Ping	2009-02-05
Semiconductor package substrate having contact pad protective layer formed thereon Grant 7,485,970 - Hsu , et al. February 3, 2	2009-02-03
Flip chip package structure and method for manufacturing the same App 20090026633 - Hsu; Shih-Ping	2009-01-29
Packaging Substrate With Conductive Structure App 20090020322 - Hsu; Shih-Ping	2009-01-22
Flip-chip package structure, and the substrate and the chip thereof App 20090014896 - Hsu; Shih-Ping	2009-01-15
Heat-conductive Package Structure App 20090014865 - Chou; Pao-Hung ; et al.	2009-01-15
Packaging Substrate Structure And Manufacturing Method Thereof App 20090000813 - Hsu; Shih-Ping	2009-01-01
Structure of packaging substrate having capacitor embedded therein and method for fabricating the same App 20080308309 - Lien; Chung-Cheng ; et al.	2008-12-18
Semiconductor Package Substrate Having Electrical Connecting Pads App 20080290528 - HSU; Shih-Ping	2008-11-27
Method for fabricating a flip chip package Grant 7,453,155 - Hsu November 18, 2	2008-11-18
Semiconductor package substrate with embedded chip and fabrication method thereof Grant 7,449,363 - Hsu November 11, 2	2008-11-11
Semiconductor device integrated with opto-electric component and method for fabricating the same Grant 7,450,793 - Hsu November 11, 2	2008-11-11
Semiconductor Package Substrate Structure And Manufacturing Method Thereof App 20080272501 - Hu; Wen-Hung	2008-11-06
Circuit board structure having embedded capacitor and fabrication method thereof App 20080264677 - Hsu; Shih-Ping	2008-10-30
Structure of packaging substrate and method for making the same App 20080265411 - Hu; Wen-Hung	2008-10-30
Packaging substrate and method for manufacturing the same App 20080257595 - Hu; Wen-Hung	2008-10-23
Structure of semiconductor chip and package structure having semiconductor chip embedded therein App 20080251915 - HSU; Shih-Ping ; et al.	2008-10-16
Method to manufacture a coreless packaging substrate Grant 7,435,618 - Chen , et al. October 14, 2	2008-10-14
Circuit Board Structure For Embedding Semiconductor Chip Therein And Method For Fabricating The Same App 20080245551 - Chou; Pao-Hung ; et al.	2008-10-09
Stacked package module App 20080246135 - Wong; Lin-Yin ; et al.	2008-10-09
Multi-chip Semiconductor Package Structure App 20080237833 - Hsu; Shih-Ping ; et al.	2008-10-02
Multi-chip Semiconductor Package Structure App 20080237831 - Hsu; Shih-Ping ; et al.	2008-10-02
Semiconductor Chip Embedding Structure App 20080237836 - Chia; Kan-Jung ; et al.	2008-10-02
Packaging substrate structure App 20080237884 - Hsu; Shih-Ping	2008-10-02
Multi-chip Semiconductor Package Structure App 20080237832 - Hsu; Shih-Ping ; et al.	2008-10-02
Flip-chip substrate App 20080230260 - SHIH; Chao-Wen	2008-09-25
Chip package module App 20080230892 - CHANG; Chia-Wei ; et al.	2008-09-25
Stacked package module App 20080230886 - Wong; Lin-Yin ; et al.	2008-09-25
Package structure and stacked package module using the same App 20080224295 - Lien; Chung-Cheng ; et al.	2008-09-18
Chip Carrier Structure Having Semiconductor Chip Embedded Therein And Metal Layer Formed Thereon App 20080217762 - Wong; Lin-Yin ; et al.	2008-09-11
Circuit Board Surface Structure And Fabrication Method Thereof App 20080217046 - Tang; Sao-Hsia ; et al.	2008-09-11
Semiconductor packaging substrate structure with capacitor embedded therein App 20080217739 - Lien; Chung-Cheng ; et al.	2008-09-11
Circuit Board Surface Structure App 20080217047 - Hu; Wen-Hung	2008-09-11
Warpage-proof Circuit Board Structure App 20080210459 - Lin; Wei-Hung	2008-09-04
Circuit board structure with capacitors embedded therein and method for fabricating the same App 20080210460 - Lien; Chung-Cheng ; et al.	2008-09-04
Method to manufacture a coreless packaging substrate Grant 7,419,850 - Chen , et al. September 2, 2	2008-09-02
Method of fabricating circuit board having different electrical connection structures Grant 7,419,897 - Shih September 2, 2	2008-09-02
Direct connection multi-chip semiconductor element structure Grant 7,417,299 - Hu August 26, 2	2008-08-26
Coreless packaging substrate and method for manufacturing the same App 20080191326 - Lin; Wei-Hung ; et al.	2008-08-14
Semiconductor Package Substrate App 20080185711 - Hsu; Shih-Ping	2008-08-07
Carrier plate structure havign a chip embedded therein and the manufacturing method of the same App 20080185704 - Hsu; Shih-Ping ; et al.	2008-08-07
Circuit Board Structure For Electrical Testing And Fabrication Method Thereof App 20080185177 - Chou; Pao-Hung	2008-08-07
Package Structure With Circuits Directly Connected To Semiconductor Chip App 20080179725 - CHIA; Kan-Jung ; et al.	2008-07-31
Method For Fabrication Of A Conductive Bump Structure Of A Circuit Board App 20080179190 - HU; Wen-Hung	2008-07-31
Circuit Board Structure And Fabrication Method Of The Same App 20080176035 - Shih; Chao-Wen ; et al.	2008-07-24
Circuit Board Structure And Fabrication Method Thereof App 20080174009 - Shih; Chao-Wen	2008-07-24
Method for manufacturing semiconductor package substrate Grant 7,399,399 - Chou , et al. July 15, 2	2008-07-15
Circuit Board Structure Having Electronic Components Integrated Therein App 20080165515 - Hsu; Shih-Ping ; et al.	2008-07-10
Plate structure having chip embedded therein and the manufacturing method of the same App 20080164597 - Hsu; Shih-Ping ; et al.	2008-07-10
Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same Grant 7,396,753 - Chu , et al. July 8, 2	2008-07-08
Method for fabricating thermally enhanced semiconductor device Grant 7,396,700 - Hsu July 8, 2	2008-07-08
Circuit Board Structure With Embedded Electronic Components App 20080151518 - HSU; Shih-Ping ; et al.	2008-06-26
Circuit Board Structure Having Embedded Semiconductor Element And Fabrication Method Thereof App 20080153324 - HSU; Shih-Ping	2008-06-26
Carrier structure embedded with semiconductor chips and method for manufacturing the same App 20080150164 - Chia; Kan-Jung	2008-06-26
Circuit Board Structure With Embedded Semiconductor Chip App 20080142951 - Hsu; Shih-Ping ; et al.	2008-06-19
Method For Fabricating Circuit Board Structure With Embedded Semiconductor Chip App 20080145975 - Hsu; Shih-Ping ; et al.	2008-06-19
Surface structure of flip chip substrate Grant 7,382,057 - Hsu June 3, 2	2008-06-03
Package Substrate And Manufacturing Method Thereof App 20080122079 - Chen; Bo-Wei ; et al.	2008-05-29
Metal electroplating process of an electrically connecting pad structure of circuit board and structure thereof Grant 7,378,345 - Chou May 27, 2	2008-05-27
Circuit Board Structure With Embedded Semiconductor Chip And Method For Fabricating The Same App 20080116565 - HSU; Shih-Ping ; et al.	2008-05-22
Carrier structure for semiconductor chip and method for manufacturing the same App 20080116562 - Lien; Chung-Cheng ; et al.	2008-05-22
Circuit board with identifiable information and method for fabricating the same Grant 7,365,272 - Hsu , et al. April 29, 2	2008-04-29
Method For Fabricating Circuit Board Structure App 20080092379 - HSU; Shih-Ping	2008-04-24
Substrate with surface finished structure and method for making the same App 20080093109 - Hsu; Shih-Ping ; et al.	2008-04-24
Circuit Board Structure App 20080094813 - HSU; Shih-Ping	2008-04-24
Semiconductor device integrated with optoelectronic components Grant 7,359,590 - Hsu April 15, 2	2008-04-15
Thin circuit board Grant 7,351,916 - Hsu April 1, 2	2008-04-01
Method for fabricating circuit board with conductive structure Grant 7,350,298 - Hsu , et al. April 1, 2	2008-04-01
Method for fabricating a flip chip substrate structure App 20080075836 - Chen; Bo-Wei ; et al.	2008-03-27
Circuit Board Structure With Embedded Semiconductor Chip And Method For Fabricating The Same App 20080067666 - HSU; Shih-Ping	2008-03-20
Flip chip substrate structure and the method for manufacturing the same App 20080060838 - Chen; Bo-Wei ; et al.	2008-03-13
Method for fabricating conductive bump of circuit board Grant 7,341,934 - Hsu , et al. March 11, 2	2008-03-11
Method for fabricating electrical connection structure of circuit board Grant 7,340,829 - Wang March 11, 2	2008-03-11
Circuit Board Assembly Having Passive Component and Stack Structure Thereof App 20080047740 - Lien; Chung-Cheng ; et al.	2008-02-28
Carrier Board Structure Embedded with Semiconductor Component and Method for Fabricating the Carrier Board Structure App 20080048310 - Zeng; Zhao Chong	2008-02-28
Circuit Board Structure And Method For Fabricating The Same App 20080041621 - HSU; Shih-Ping ; et al.	2008-02-21
Conductive connection structure formed on the surface of circuit board and manufacturing method thereof App 20080036079 - Chen; Chien-Chih ; et al.	2008-02-14
Circuit board structure with capacitors embedded therein and method for fabricating the same App 20080030965 - Lien; Chung-Cheng ; et al.	2008-02-07
Plate structure having chip embedded therein and the manufacturing method of the same App 20080029872 - Hsu; Shih-Ping ; et al.	2008-02-07
Flip-chip package substrate and a method for fabricating the same App 20080029894 - Wang; Hsien-Shou	2008-02-07
Carrier Board Structure With Embedded Semiconductor Chip And Fabrication Method Thereof App 20080029895 - HU; Chu-Chin ; et al.	2008-02-07
Package Structure Having Semiconductor Chip Embedded Therein And Method For Fabricating The Same App 20080023819 - Chia; Kan-Jung ; et al.	2008-01-31
Semiconductor package substrate with embedded resistors and method for fabricating the same Grant 7,323,762 - Lai , et al. January 29, 2	2008-01-29
Electrically Connecting Terminal Structure of Circuit Board and Manufacturing Method Thereof App 20080020602 - SHIH; Chao-Wen	2008-01-24
Stack structure with semiconductor chip embedded in carrier Grant 7,321,164 - Hsu January 22, 2	2008-01-22
Substrate for pre-soldering material and fabrication method thereof Grant 7,319,276 - Hsu , et al. January 15, 2	2008-01-15
Module structure having embedded chips Grant 7,312,405 - Hsu December 25, 2	2007-12-25
Device Embedded With Semiconductor Chip And Stack Structure Of The Same App 20070284717 - Lien; Chung Cheng ; et al.	2007-12-13
Method For Fabricating Electrical Conductive Structure Of Circuit Board App 20070281389 - Shih; Chao Wen	2007-12-06
Method Of Fabricating Circuit Board Having Different Electrical Connection Structures App 20070281557 - Shih; Chao-Wen	2007-12-06
Method For Repairing Conductive Structure Of Circuit Board App 20070281503 - Hsu; Shih-Ping ; et al.	2007-12-06
Stack Structure Of Circuit Board With Semiconductor Component Embedded Therein App 20070278644 - Hsu; Shih-Ping ; et al.	2007-12-06
Method For Repairing Elecrical Circuit Of Circuit Board App 20070274028 - HSU; Shih-Ping ; et al.	2007-11-29
Circuit board structure of integrated optoelectronic componenet Grant 7,302,126 - Hsu November 27, 2	2007-11-27
Method to manufacture a coreless packaging substrate App 20070249154 - Chen; Bo-Wei ; et al.	2007-10-25
Method to manufacture a coreless packaging substrate App 20070249155 - Chen; Bo-Wei ; et al.	2007-10-25
Method of manufacturing a coreless package substrate and conductive structure of the substrate App 20070246744 - Chen; Bo-Wei ; et al.	2007-10-25
Carrier Board Structure With Chip Embedded Therein And Method For Fabricating The Same App 20070241444 - HSU; Shih-Ping ; et al.	2007-10-18
Carrying structure of electronic components Grant 7,276,800 - Hsu October 2, 2	2007-10-02
Method of embedding semiconductor chip in support plate Grant 7,274,099 - Hsu September 25, 2	2007-09-25
Method For Fabricating A Metal Protection Layer On Electrically Connecting Pad Of Circuit Board App 20070218591 - CHOU; Pao-Hung	2007-09-20
Embedded chip package structure App 20070210423 - Hsu; Shih-Ping	2007-09-13
Method for Fabricating Circuit Board with Conductive Structure App 20070186412 - Hsu; Shih-Ping ; et al.	2007-08-16
Circuit board having electrically conductive structure formed between circuit layers thereof and method for fabricating the same Grant 7,253,364 - Tang , et al. August 7, 2	2007-08-07
Embedded capacitor structure in circuit board and method for fabricating the same Grant 7,244,647 - Chang July 17, 2	2007-07-17
Circuit Board with Conductive Structure and Method for Fabricating the same App 20070158852 - Hsu; Shih-Ping	2007-07-12
Circuit Board Device With Fine Conductive Structure App 20070158847 - Hsu; Shih-Ping	2007-07-12
Conductive structures for electrically conductive pads of circuit board and fabrication method thereof App 20070161223 - Hu; Wen-Hung ; et al.	2007-07-12
Substrate assembly with direct electrical connection as a semiconductor package Grant 7,242,092 - Hsu July 10, 2	2007-07-10
Circuit board structure with embedded selectable passive components and method for fabricating the same Grant 7,239,525 - Hsu July 3, 2	2007-07-03
Structure with semiconductor chips embeded therein and method of fabricating same App 20070145577 - Zeng; Zhao-Chong ; et al.	2007-06-28
Circuit Board Structure Having Capacitor Array and Embedded Electronic Component and Method for Fabricating the Same App 20070147014 - Chang; Chia-Wei ; et al.	2007-06-28
Structure of circuit board and method for fabricating same App 20070138630 - Wang; Shing-Ru ; et al.	2007-06-21
Method of fabricating electrical connection terminal of embedded chip App 20070130763 - Hsu; Shih-Ping ; et al.	2007-06-14
Method for fabricating electrical connections of circuit board Grant 7,216,424 - Wang May 15, 2	2007-05-15
Stack Structure of Carrier Board Embedded with Semiconductor Components and Method for Fabricating the same App 20070085188 - Chang; Chia Wei ; et al.	2007-04-19
Circuit Board Structure of Integrated Optoelectronic Component App 20070086695 - Hsu; Shih-Ping	2007-04-19
Integrated library core for embedded passive components and method for forming electronic device thereon Grant 7,190,592 - Hu March 13, 2	2007-03-13
Method for fabricating connection terminal of circuit board Grant 7,174,630 - Hsu , et al. February 13, 2	2007-02-13
Method of fabricating electrical connection terminal of embedded chip Grant 7,174,631 - Hsu , et al. February 13, 2	2007-02-13
Circuit board structure integrated with semiconductor chip and method of fabricating the same App 20070020812 - Hsu; Shih-Ping ; et al.	2007-01-25
Method for fabricating electrical connection structure of circuit board Grant 7,151,050 - Hsu , et al. December 19, 2	2006-12-19
Substrate for Pre-Soldering Material and Fabrication Method Thereof App 20060278999 - Hsu; Shih-Ping ; et al.	2006-12-14
Semiconductior Package Substrate With Embedded Resistors And Method For Fabricating Same App 20060261462 - Lai; Zao-Kuo ; et al.	2006-11-23
Surface roughening method for embedded semiconductor chip structure App 20060263936 - Hsu; Shih-Ping	2006-11-23
Semiconductor package substrate with embedded resistors and method for fabricating same Grant 7,135,377 - Lai , et al. November 14, 2	2006-11-14
Method of embedding semiconductor chip in support plate and embedded structure thereof Grant 7,129,117 - Hsu October 31, 2	2006-10-31
Substrate for pre-soldering material and fabrication method thereof Grant 7,112,524 - Hsu , et al. September 26, 2	2006-09-26
Fine Pad Pitch Organic Circuit Board With Plating Solder And Method For Fabricating The Same App 20060201997 - Tung; I-Chung	2006-09-14
Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints Grant 7,098,126 - Hsieh , et al. August 29, 2	2006-08-29
Package structure with chip embedded in substrate App 20060186531 - Hsu; Shih-Ping	2006-08-24
Method of fabricating a circuit board Grant 7,089,660 - Hsu , et al. August 15, 2	2006-08-15
Method for fabricating semiconductor packages with semiconductor chips App 20060177968 - Hsu; Shih-Ping	2006-08-10
Semiconductor chip electrical connection structure App 20060163722 - Hsu; Shih-Ping	2006-07-27
Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same Grant 7,081,402 - Hsu , et al. July 25, 2	2006-07-25
Semiconductor package structure and method for fabricating the same App 20060125080 - Hsu; Shih-Ping	2006-06-15
Package structure with embedded chip and method for fabricating the same App 20060128069 - Hsu; Shih-Ping	2006-06-15
Semiconductor package substrate with embedded chip and fabrication method thereof App 20060115931 - Hsu; Shih-Ping	2006-06-01
Heat sink structure with embedded electronic components for semiconductor package Grant 7,050,304 - Hsu , et al. May 23, 2	2006-05-23
Method for fabricating semiconductor package substrate with plated metal layer over conductive pad Grant 7,041,591 - Lee , et al. May 9, 2	2006-05-09
Semiconductor package substrate with embedded resistors and method for fabricating the same App 20060094156 - Lai; Zao-Kuo ; et al.	2006-05-04
Method for fabricating connection terminal of circuit board App 20060090335 - Hsu; Shih-Ping ; et al.	2006-05-04
Substrate structure with embedded chip of semiconductor package and method for fabricating the same App 20060087037 - Hsu; Shih-Ping	2006-04-27
Method of embedding semiconductor element in carrier and embedded structure thereof Grant 7,033,862 - Chen April 25, 2	2006-04-25
Semiconductor electrical connection structure and method of fabricating the same App 20060073638 - HSU; Shih-Ping	2006-04-06
Method for fabricating carrier structure integrated with semiconductor element App 20060068332 - Chen; Chi-Ming	2006-03-30
Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same Grant 7,012,019 - Hsu , et al. March 14, 2	2006-03-14
Method of embedding semiconductor chip in support plate and embedded structure thereof App 20060049530 - Hsu; Shih-Ping	2006-03-09
Method for fabricating conductive bump of circuit board App 20060051952 - Hsu; Shih-Ping ; et al.	2006-03-09
Micro-electronic package structure and method for fabricating the same App 20060043549 - Hsu; Shih-Ping	2006-03-02
Method for fabricating electrical connections of circuit board App 20060043158 - Wang; Ying-Tung	2006-03-02
Direct connection multi-chip semiconductor element structure App 20060001152 - Hu; Chu-Chin	2006-01-05
Method for fabricating electrical connection structure of circuit board App 20060000877 - Wang; Ying-Tung	2006-01-05
Method of embedding semiconductor element in carrier and embedded structure thereof App 20050285244 - Chen, Chi-Ming	2005-12-29
Circuit board with asymmetrical structure and method for fabricating the same App 20050284655 - Hsu, Shih-Ping ; et al.	2005-12-29
Substrate structure integrated with passive components App 20050270748 - Hsu, Shih-Ping	2005-12-08
Circuit board with identifiable information and method for fabricating the same App 20050236176 - Hsu, Shih-Ping ; et al.	2005-10-27
Method for releasing stress of embedded chip and chip embedded structure App 20050239269 - Hu, Chu-Chin ; et al.	2005-10-27
Electrical connection terminal of embedded chip and method for fabricating the same App 20050224976 - Hsu, Shih-Ping ; et al.	2005-10-13
Pre-solder structure on semiconductor package substrate and method for fabricating the same App 20050167830 - Chang, Ruei-Chih ; et al.	2005-08-04
Method of plating metal layer over isolated pads on semiconductor package substrate Grant 6,916,685 - Yang , et al. July 12, 2	2005-07-12
Method for making a multilayer circuit board having embedded passive components Grant 6,910,264 - Tung June 28, 2	2005-06-28
Multi-layer circuit board and method for fabricating the same App 20050121225 - Hsu, Shih-Ping	2005-06-09
Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same App 20050082672 - Hsu, Shih-Ping ; et al.	2005-04-21
Method for fabricating thermally enhanced semiconductor device App 20050048759 - Hsu, Shih-Ping	2005-03-03
Substrate with stacked vias and fine circuits thereon, and method for fabricating the same Grant 6,838,314 - Chang January 4, 2	2005-01-04
Method of fabricating vias in solder pads of a ball grid array (BGA) substrate Grant 6,649,506 - Hsu November 18, 2	2003-11-18
Substrate within a Ni/Au structure electroplated on electrical contact pads and method for fabricating the same App 20030122256 - Hsu, Shih-Ping ; et al.	2003-07-03
Method and structure for producing bumps on an IC package substrate Grant 6,576,541 - Hu June 10, 2	2003-06-10
BGA substrate with direct heat dissipating structure App 20020189853 - Hsu, Shih-Ping	2002-12-19
Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier Grant 6,475,327 - Tung , et al. November 5, 2	2002-11-05