Peterson; Brenda L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Peterson; Brenda L..The latest application filed is for "non-hermetic encapsulant removal for module rework".
- Peterson; Brenda L. - Wappingers Falls NY
| Patent | Date |
|---|---|
| Optical assemblies for transmitting and manipulating optical beams Grant 8,089,133 - Gupta , et al. January 3, 2 | 2012-01-03 |
| Non-hermetic Encapsulant Removal For Module Rework App 20080076690 - Coico; Patrick A. ; et al. | 2008-03-27 |
| Method of making an electronic package App 20070278654 - Jimarez; Lisa J. ; et al. | 2007-12-06 |
| Method of making an electronic package Grant 7,278,207 - Jimarez , et al. October 9, 2 | 2007-10-09 |
| Method of making an electronic package App 20050250249 - Jimarez, Lisa J. ; et al. | 2005-11-10 |
| Method of making an electronic package Grant 6,961,995 - Jimarez , et al. November 8, 2 | 2005-11-08 |
| Optical assemblies for transmitting and manipulating optical beams App 20050078376 - Gupta, Dinesh ; et al. | 2005-04-14 |
| Non-hermetic Encapsulant Removal For Module Rework App 20050066995 - Coico, Patrick A. ; et al. | 2005-03-31 |
| Optical assemblies for transmitting and manipulating optical beams Grant 6,836,015 - Denneau , et al. December 28, 2 | 2004-12-28 |
| Optical Assemblies For Transmitting And Manipulating Optical Beams App 20040217464 - Denneau, Monty M. ; et al. | 2004-11-04 |
| Compliant layer for encapsulated columns App 20030020150 - Jimarez, Lisa J. ; et al. | 2003-01-30 |
| Conductive adhesive interconnection with insulating polymer carrier Grant 6,458,623 - Goldmann , et al. October 1, 2 | 2002-10-01 |
| Compliant layer for encapsulated cloumns App 20020092676 - Jimarez, Lisa J. ; et al. | 2002-07-18 |
| Conductive adhesive interconnection with insulating polymer carrier App 20020093104 - Goldmann, Lewis S. ; et al. | 2002-07-18 |
| Pre-patterned substrate layers for being personalized as needed App 20020023779 - Gupta, Dinesh ; et al. | 2002-02-28 |
| Pre-patterned substrate layers for being personalized as needed Grant 6,341,417 - Gupta , et al. January 29, 2 | 2002-01-29 |
| Process For Screening Features On An Electronic Substrate With A Low Viscosity Paste App 20020009539 - CASEY, JON A. ; et al. | 2002-01-24 |
| Process for via fill Grant 5,927,193 - Balz , et al. July 27, 1 | 1999-07-27 |
| Method for marking substrates Grant 5,808,268 - Balz , et al. September 15, 1 | 1998-09-15 |
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