| Patent | Date |
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Semiconductor Device and Method of Making Wafer Level Chip Scale Package
App 20170236802 - Hsieh; Ming-Che ; et al. | 2017-08-17 |
Semiconductor device and method of making wafer level chip scale package
Grant 9,673,093 - Hsieh , et al. June 6, 2 | 2017-06-06 |
Chip package and manufacturing method thereof
Grant 9,093,450 - Perng , et al. July 28, 2 | 2015-07-28 |
Semiconductor Device and Method of Making Wafer Level Chip Scale Package
App 20150041985 - Hsieh; Ming-Che ; et al. | 2015-02-12 |
Chip package and manufacturing method thereof
Grant 8,916,420 - Perng , et al. December 23, 2 | 2014-12-23 |
Power MOSFET package
Grant 8,766,431 - Perng , et al. July 1, 2 | 2014-07-01 |
Chip Package And Manufacturing Method Thereof
App 20140073089 - PERNG; Baw-Ching ; et al. | 2014-03-13 |
Chip package and manufacturing method thereof
Grant 8,610,271 - Perng , et al. December 17, 2 | 2013-12-17 |
Chip package and method for forming the same
Grant 8,564,133 - Wen , et al. October 22, 2 | 2013-10-22 |
Chip Package And Manufacturing Method Thereof
App 20130256869 - PERNG; Baw-Ching ; et al. | 2013-10-03 |
Power Mosfet Package
App 20130193520 - PERNG; Baw-Ching ; et al. | 2013-08-01 |
Power MOSFET package
Grant 8,410,599 - Perng , et al. April 2, 2 | 2013-04-02 |
Surface treatment of metal interconnect lines
Grant 8,053,894 - Wan , et al. November 8, 2 | 2011-11-08 |
Chip Package And Manufacturing Method Thereof
App 20110127670 - PERNG; Baw-Ching ; et al. | 2011-06-02 |
Chip Package And Method For Forming The Same
App 20110042819 - WEN; Ying-Nan ; et al. | 2011-02-24 |
Chip Package And Manufacturing Method Thereof
App 20110024894 - PERNG; Baw-Ching ; et al. | 2011-02-03 |
Power Mosfet Package
App 20100289092 - PERNG; Baw-Ching ; et al. | 2010-11-18 |
Measuring low dielectric constant film properties during processing
Grant 7,400,401 - Tsai , et al. July 15, 2 | 2008-07-15 |
CMOS devices with improved gap-filling
Grant 7,378,308 - Hsu , et al. May 27, 2 | 2008-05-27 |
Method of trimming technology
Grant 7,354,847 - Chan , et al. April 8, 2 | 2008-04-08 |
CMOS devices with improved gap-filling
App 20070235823 - Hsu; Ju-Wang ; et al. | 2007-10-11 |
Surface treated low-k dielectric as diffusion barrier for copper metallization
Grant 7,271,103 - Huang , et al. September 18, 2 | 2007-09-18 |
Self-aligned double gate device and method for forming same
Grant 7,230,270 - Chen , et al. June 12, 2 | 2007-06-12 |
Methods and structures for critical dimension and profile measurement
Grant 7,208,331 - Shieh , et al. April 24, 2 | 2007-04-24 |
Method for multiple spacer width control
Grant 7,176,137 - Perng , et al. February 13, 2 | 2007-02-13 |
Recessed polysilicon gate structure for a strained silicon MOSFET device
Grant 7,172,933 - Huang , et al. February 6, 2 | 2007-02-06 |
Process for patterning high-k dielectric material
Grant 7,148,114 - Chiu , et al. December 12, 2 | 2006-12-12 |
Process for removing organic materials during formation of a metal interconnect
Grant 7,122,484 - Perng , et al. October 17, 2 | 2006-10-17 |
Measuring low dielectric constant film properties during processing
App 20060220653 - Tsai; Jang-Shiang ; et al. | 2006-10-05 |
Method for wet etching of high k thin film at low temperature
Grant 7,115,526 - Ho , et al. October 3, 2 | 2006-10-03 |
Method and structure for ultra narrow gate
Grant 7,081,413 - Chan , et al. July 25, 2 | 2006-07-25 |
Selective spacer layer deposition method for forming spacers with different widths
App 20060113616 - Liu; Ai-Sen ; et al. | 2006-06-01 |
Self-aligned double gate device and method for forming same
App 20060108644 - Chen; Hao-Yu ; et al. | 2006-05-25 |
Process for patterning high-k dielectric material
Grant 7,037,849 - Chiu , et al. May 2, 2 | 2006-05-02 |
Methods and structures for critical dimension and profile measurement
App 20060073620 - Shieh; Jyu-Horng ; et al. | 2006-04-06 |
Wet etchant composition and method for etching HfO2 and ZrO2
App 20060054597 - Perng; Baw-Ching ; et al. | 2006-03-16 |
Method for forming multiple spacer widths
Grant 7,011,929 - Lei , et al. March 14, 2 | 2006-03-14 |
Zirconium oxide and hafnium oxide etching using halogen containing chemicals
Grant 7,012,027 - Perng , et al. March 14, 2 | 2006-03-14 |
A Recessed Polysilicon Gate Structure for a Strained Silicon MOSFET Device
App 20060009001 - Huang; Yi-Chun ; et al. | 2006-01-12 |
Surface treatment of metal interconnect lines
App 20060001160 - Wan; Wen-Kai ; et al. | 2006-01-05 |
Wafer clean process
App 20050274393 - Perng, Baw-Ching ; et al. | 2005-12-15 |
Wet etchant composition and method for etching HfO2 and ZrO2
Grant 6,969,688 - Perng , et al. November 29, 2 | 2005-11-29 |
Process for removing organic materials during formation of a metal interconnect
App 20050245082 - Perng, Baw-Ching ; et al. | 2005-11-03 |
Surface treatment of metal interconnect lines
Grant 6,955,984 - Wan , et al. October 18, 2 | 2005-10-18 |
Selective spacer layer deposition method for forming spacers with different widths
Grant 6,943,077 - Liu , et al. September 13, 2 | 2005-09-13 |
Process for patterning high-k dielectric material
App 20050181590 - Chiu, Hsien-Kuang ; et al. | 2005-08-18 |
Method and structure for ultra narrow gate
App 20050164503 - Chan, Bor-Wen ; et al. | 2005-07-28 |
Novel method of trimming technology
App 20050164478 - Chan, Bor-Wen ; et al. | 2005-07-28 |
Zirconium oxide and hafnium oxide etching using halogen containing chemicals
App 20050164479 - Perng, Baw-Ching ; et al. | 2005-07-28 |
Surface treated low-k dielectric as diffusion barrier for copper metallization
App 20050085083 - Huang, Kuei-Wu ; et al. | 2005-04-21 |
Methods for improving sheet resistance of silicide layer after removal of etch stop layer
Grant 6,838,381 - Hsu , et al. January 4, 2 | 2005-01-04 |
Process for patterning high-k dielectric material
App 20040262262 - Chiu, Hsien-Kuang ; et al. | 2004-12-30 |
Surface treatment of metal interconnect lines
App 20040229460 - Wan, Wen-Kai ; et al. | 2004-11-18 |
Method for multiple spacer width control
App 20040222182 - Perng, Baw-Ching ; et al. | 2004-11-11 |
Advanced control for plasma process
Grant 6,812,044 - Chiu , et al. November 2, 2 | 2004-11-02 |
Selective spacer layer deposition method for forming spacers with different widths
App 20040198060 - Liu, Ai-Sen ; et al. | 2004-10-07 |
Method for forming multiple spacer widths
App 20040137373 - Lei, Ming-Ta ; et al. | 2004-07-15 |
Methods for improving sheet resistance of silicide layer after removal of etch stop layer
App 20040127026 - Hsu, Peng-Fu ; et al. | 2004-07-01 |
Advanced control for plasma process
App 20040121603 - Chiu, Hsien-Kuang ; et al. | 2004-06-24 |
Method for forming a semiconductor device having high-K gate dielectric material
Grant 6,746,900 - Liu , et al. June 8, 2 | 2004-06-08 |
Wet etchant composition and method for etching HfO2 and ZrO2
App 20040067657 - Perng, Baw-Ching ; et al. | 2004-04-08 |
Method for wet etching of high k thin film at low temperature
App 20030148625 - Ho, Hsieh Yue ; et al. | 2003-08-07 |
Integrated approach for controlling top dielectric loss during spacer etching
Grant 6,498,067 - Perng , et al. December 24, 2 | 2002-12-24 |
Method to pattern polysilicon gates with high-k material gate dielectric
Grant 6,479,403 - Tsei , et al. November 12, 2 | 2002-11-12 |
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