Peethala; Cornelius Brown

Patent Applications and Registrations

Patent applications and USPTO patent grants for Peethala; Cornelius Brown.The latest application filed is for "bottom barrier free interconnects without voids".

Company Profile

66.54.54

Peethala; Cornelius Brown - Slingerlands NY
Peethala; Cornelius Brown - Singerlands NY
Peethala; Cornelius Brown - Albany NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metallic interconnect structures with wrap around capping layers Grant 11,404,311 - Peethala , et al. August 2, 2	2022-08-02
Selective etching of silicon wafer Grant 11,322,361 - Song , et al. May 3, 2	2022-05-03
Metallic interconnect structures with wrap around capping layers Grant 11,315,830 - Peethala , et al. April 26, 2	2022-04-26
Adjustable via dimension and chamfer angle Grant 11,276,636 - Clevenger , et al. March 15, 2	2022-03-15
Replacement metal cap by an exchange reaction Grant 11,251,126 - Kelly , et al. February 15, 2	2022-02-15
Interconnects having a via-to-line spacer for preventing short circuit events between a conductive via and an adjacent line Grant 11,244,859 - Motoyama , et al. February 8, 2	2022-02-08
Bottom Barrier Free Interconnects Without Voids App 20220028797 - Cheng; Kenneth Chun Kuen ; et al.	2022-01-27
Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability Grant 11,205,587 - Fan , et al. December 21, 2	2021-12-21
Selective deposition with SAM for fully aligned via Grant 11,171,054 - Nguyen , et al. November 9, 2	2021-11-09
Multiple patterning scheme integration with planarized cut patterning Grant 11,171,001 - Chen , et al. November 9, 2	2021-11-09
Metallic interconnect structure Grant 11,164,776 - Nguyen , et al. November 2, 2	2021-11-02
Bottom barrier free interconnects without voids Grant 11,164,815 - Cheng , et al. November 2, 2	2021-11-02
Interconnect and memory structures having reduced topography variation formed in the BEOL Grant 11,164,878 - Yang , et al. November 2, 2	2021-11-02
Selective Deposition With Sam For Fully Aligned Via App 20210313228 - Nguyen; Son ; et al.	2021-10-07
Embedded Metal Contamination Removal from BEOL Wafers App 20210296118 - Sil; Devika ; et al.	2021-09-23
Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom Grant 11,101,172 - Motoyama , et al. August 24, 2	2021-08-24
Interconnect And Memory Structures Having Reduced Topography Variation Formed In The Beol App 20210242216 - Yang; Chih-Chao ; et al.	2021-08-05
Planarization Stop Region For Use With Low Pattern Density Interconnects App 20210242077 - Peethala; Cornelius Brown ; et al.	2021-08-05
Apparatus For Reducing Wafer Contamination During ION-Beam Etching Processes App 20210183627 - Arnold; John ; et al.	2021-06-17
Planarization of dielectric topography and stopping in dielectric Grant 11,037,795 - Amanapu , et al. June 15, 2	2021-06-15
Metal interconnects Grant 11,031,339 - Patlolla , et al. June 8, 2	2021-06-08
Metal interconnects Grant 11,018,087 - Patlolla , et al. May 25, 2	2021-05-25
Hybrid Metallization And Dielectric Interconnects In Top Via Configuration App 20210143061 - AMANAPU; Hari Prasad ; et al.	2021-05-13
Interconnects Having A Via-to-line Spacer For Preventing Short Circuit Events Between A Conductive Via And An Adjacent Line App 20210111069 - Motoyama; Koichi ; et al.	2021-04-15
Skip via for metal interconnects Grant 10,978,388 - Amanapu , et al. April 13, 2	2021-04-13
Bottom Barrier Free Interconnects Without Voids App 20210098388 - Cheng; Kenneth Chun Kuen ; et al.	2021-04-01
Metallic Interconnect Structure App 20210098292 - Nguyen; Son ; et al.	2021-04-01
Hybrid BEOL metallization utilizing selective reflection mask Grant 10,957,646 - Briggs , et al. March 23, 2	2021-03-23
Multiple patterning scheme integration with planarized cut patterning Grant 10,937,653 - Chen , et al. March 2, 2	2021-03-02
Robust gate cap for protecting a gate from downstream metallization etch operations Grant 10,916,431 - Patlolla , et al. February 9, 2	2021-02-09
Adjustable Via Dimension and Chamfer Angle App 20210035904 - Clevenger; Lawrence A. ; et al.	2021-02-04
Back end of line metallization structure Grant 10,910,307 - Patlolla , et al. February 2, 2	2021-02-02
Back end of line metallization structure Grant 10,903,161 - Patlolla , et al. January 26, 2	2021-01-26
Controlling performance and reliability of conductive regions in a metallization network Grant 10,896,846 - Patlolla , et al. January 19, 2	2021-01-19
Patterning integration scheme with trench alignment marks Grant 10,879,190 - Yang , et al. December 29, 2	2020-12-29
Bottom electrode and dielectric structure for MRAM applications Grant 10,833,122 - Amanapu , et al. November 10, 2	2020-11-10
Patterning Integration Scheme With Trench Alignment Marks App 20200350257 - Yang; Chih-Chao ; et al.	2020-11-05
Metal spacer self aligned multi-patterning integration Grant 10,825,726 - Chen , et al. November 3, 2	2020-11-03
Metal interconnect structures with self-forming sidewall barrier layer Grant 10,818,589 - Amanapu , et al. October 27, 2	2020-10-27
Robust Gate Cap For Protecting A Gate From Downstream Metallization Etch Operations App 20200335345 - Patlolla; Raghuveer Reddy ; et al.	2020-10-22
Metal spacer self aligned double patterning with airgap integration Grant 10,811,310 - Chen , et al. October 20, 2	2020-10-20
Low Aspect Ratio Interconnect App 20200328156 - Briggs; Benjamin D. ; et al.	2020-10-15
Metal Interconnect Structures with Self-Forming Sidewall Barrier Layer App 20200294911 - Amanapu; Hari Prasad ; et al.	2020-09-17
Back end of line metallization structures Grant 10,741,748 - Maniscalco , et al. A	2020-08-11
Dielectric Damage-Free Dual Damascene Cu Interconnects Without Barrier at Via Bottom App 20200243379 - Motoyama; Koichi ; et al.	2020-07-30
Controlling performance and reliability of conductive regions in a metallization network Grant 10,714,382 - Patlolla , et al.	2020-07-14
Embedded magnetic tunnel junction pillar having reduced height and uniform contact area Grant 10,714,681 - Rizzolo , et al.	2020-07-14
Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration Grant 10,714,389 - Chen , et al.	2020-07-14
Replacement Metal Cap By An Exchange Reaction App 20200219817 - KELLY; James J. ; et al.	2020-07-09
Bottom Electrode And Dielectric Structure For Mram Applications App 20200219931 - Amanapu; Hari Prasad ; et al.	2020-07-09
Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability Grant 10,685,876 - Fan , et al.	2020-06-16
Back end of line metallization structures Grant 10,686,126 - Maniscalco , et al.	2020-06-16
Hybrid Beol Metallization Utilizing Selective Reflection Mask App 20200176388 - BRIGGS; Benjamin D. ; et al.	2020-06-04
Metallic interconnect structures with wrap around capping layers Grant 10,672,653 - Peethala , et al.	2020-06-02
Low aspect ratio interconnect Grant 10,672,707 - Briggs , et al.	2020-06-02
Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom Grant 10,658,233 - Motoyama , et al.	2020-05-19
Metallic Interconnect Structures With Wrap Around Capping Layers App 20200152510 - Peethala; Cornelius Brown ; et al.	2020-05-14
Metallic Interconnect Structures With Wrap Around Capping Layers App 20200152511 - Peethala; Cornelius Brown ; et al.	2020-05-14
Replacement metal cap by an exchange reaction Grant 10,651,125 - Kelly , et al.	2020-05-12
Back End Of Line Metallization Structure App 20200144180 - Patlolla; Raghuveer R. ; et al.	2020-05-07
Back End Of Line Metallization Structure App 20200144178 - Patlolla; Raghuveer R. ; et al.	2020-05-07
Metal Spacer Self Aligned Double Patterning With Airgap Integration App 20200135537 - Chen; Hsueh-Chung ; et al.	2020-04-30
Dielectric Damage-Free Dual Damascene Cu Interconnects Without Barrier at Via Bottom App 20200126854 - Motoyama; Koichi ; et al.	2020-04-23
Embedded Magnetic Tunnel Junction Pillar Having Reduced Height And Uniform Contact Area App 20200127194 - Rizzolo; Michael ; et al.	2020-04-23
Metal Spacer Self Aligned Multi-patterning Integration App 20200118872 - CHEN; HSUEH-CHUNG ; et al.	2020-04-16
Controlling Performance And Reliability Of Conductive Regions In A Metallization Network App 20200118866 - Patlolla; Raghuveer ; et al.	2020-04-16
Controlling Performance And Reliability Of Conductive Regions In A Metallization Network App 20200118865 - Patlolla; Raghuveer ; et al.	2020-04-16
Skip Via For Metal Interconnects App 20200111736 - Amanapu; Hari Prasad ; et al.	2020-04-09
Liner And Cap Structures For Reducing Local Interconnect Vertical Resistance Without Compromising Reliability App 20200090990 - Fan; Su Chen ; et al.	2020-03-19
Liner And Cap Structures For Reducing Local Interconnect Vertical Resistance Without Compromising Reliability App 20200090989 - Fan; Su Chen ; et al.	2020-03-19
Back End Of Line Metallization Structures App 20200083435 - Maniscalco; Joseph F. ; et al.	2020-03-12
Metal Interconnects App 20200083169 - Patlolla; Raghuveer R. ; et al.	2020-03-12
Hybrid BEOL metallization utilizing selective reflection mask Grant 10,586,767 - Briggs , et al.	2020-03-10
Multiple Patterning Scheme Integration With Planarized Cut Patterning App 20200066525 - Chen; Hsueh-Chung ; et al.	2020-02-27
Multiple Patterning Scheme Integration With Planarized Cut Patterning App 20200066526 - Chen; Hsueh-Chung ; et al.	2020-02-27
Multiple patterning scheme integration with planarized cut patterning Grant 10,573,520 - Chen , et al. Feb	2020-02-25
Replacement Metal Cap By An Exchange Reaction App 20200058593 - KELLY; James J. ; et al.	2020-02-20
Hybrid Beol Metallization Utilizing Selective Reflection Mask App 20200027840 - BRIGGS; Benjamin D. ; et al.	2020-01-23
Lithographic photomask alignment using non-planar alignment structures formed on wafer Grant 10,534,276 - Yang , et al. Ja	2020-01-14
Back End Of Line Metallization Structures App 20190393409 - Maniscalco; Joseph F. ; et al.	2019-12-26
Multiple Patterning Scheme Integration With Planarized Cut Patterning App 20190378718 - Chen; Hsueh-Chung ; et al.	2019-12-12
Selective Etching Of Silicon Wafer App 20190371615 - Song; Da ; et al.	2019-12-05
Metal Interconnects App 20190333857 - Patlolla; Raghuveer R. ; et al.	2019-10-31
Cobalt contact and interconnect structures Grant 10,373,867 - Amanapu , et al.	2019-08-06
Selective surface modification of interconnect structures Grant 10,373,909 - Patlolla , et al.	2019-08-06
Dry and wet etch resistance for atomic layer deposited TiO2 for SIT spacer application Grant 10,366,879 - Peethala , et al. July 30, 2	2019-07-30
Enlarged contact area structure using noble metal cap and noble metal liner Grant 10,361,119 - Motoyama , et al.	2019-07-23
Low-resistivity Metallic Interconnect Structures With Self-forming Diffusion Barrier Layers App 20190221477 - Amanapu; Hari P. ; et al.	2019-07-18
Structure And Method Using Metal Spacer For Insertion Of Variable Wide Line Implantation In Sadp/saqp Integration App 20190206719 - Chen; Hsueh-Chung ; et al.	2019-07-04
Metallic Interconnect Structures With Wrap Around Capping Layers App 20190189508 - Peethala; Cornelius Brown ; et al.	2019-06-20
Dry And Wet Etch Resistance For Atomic Layer Deposited Tio2 For Sit Spacer Application App 20190148140 - Peethala; Cornelius Brown ; et al.	2019-05-16
Low Aspect Ratio Interconnect App 20190148296 - Briggs; Benjamin D. ; et al.	2019-05-16
Barrier layers in trenches and vias Grant 10,290,541 - Briggs , et al.	2019-05-14
Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration Grant 10,276,434 - Chen , et al.	2019-04-30
Low aspect ratio interconnect Grant 10,211,153 - Briggs , et al. Feb	2019-02-19
Enabling low resistance gates and contacts integrated with bilayer dielectrics Grant 10,204,828 - Bao , et al. Feb	2019-02-12
Low-resistivity metallic interconnect structures with self-forming diffusion barrier layers Grant 10,204,829 - Amanapu , et al. Feb	2019-02-12
Cobalt contact and interconnect structures Grant 10,177,030 - Amanapu , et al. J	2019-01-08
Cobalt Contact And Interconnect Structures App 20180197774 - Amanapu; Hari P. ; et al.	2018-07-12
Cobalt Contact And Interconnect Structures App 20180197773 - Amanapu; Hari P. ; et al.	2018-07-12
Barrier Layers In Trenches And Vias App 20180174899 - Briggs; Benjamin D. ; et al.	2018-06-21
Barrier layers in trenches and vias Grant 9,984,923 - Briggs , et al. May 29, 2	2018-05-29
Environmentally green process and composition for cobalt wet etch Grant 9,947,547 - Mont , et al. April 17, 2	2018-04-17
Selective Surface Modification Of Interconnect Structures App 20180082955 - Patlolla; Raghuveer R. ; et al.	2018-03-22
Low Aspect Ratio Interconnect App 20180061761 - Briggs; Benjamin D. ; et al.	2018-03-01
Environmentally Green Process And Composition For Cobalt Wet Etch App 20180005839 - Mont; Frank W. ; et al.	2018-01-04
Barrier Layers In Trenches And Vias App 20180005880 - Briggs; Benjamin D. ; et al.	2018-01-04
Selective surface modification of interconnect structures Grant 9,859,218 - Patlolla , et al. January 2, 2	2018-01-02