PATEL; VISHNUBHAI VITTHALBHAI

Patent Applications and Registrations

Patent applications and USPTO patent grants for PATEL; VISHNUBHAI VITTHALBHAI.The latest application filed is for "adhesion layer and multiphase ultra-low k dielectric material".

Company Profile

0.25.8

PATEL; VISHNUBHAI VITTHALBHAI - YORKTOWN HEIGHTS NY
Patel; Vishnubhai Vitthalbhai - Yorktown NY
Patel; Vishnubhai Vitthalbhai - Yorktown Hts. NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
ADHESION LAYER AND MULTIPHASE ULTRA-LOW k DIELECTRIC MATERIAL App 20140203336 - GRILL; ALFRED ; et al.	2014-07-24
Process to form an adhesion layer and multiphase ultra-low k dielectric material using PECVD Grant 8,637,412 - Grill , et al. January 28, 2	2014-01-28
Hydrogenated oxidized silicon carbon material Grant 6,953,984 - Grill , et al. October 11, 2	2005-10-11
Hydrogenated oxidized silicon carbon material App 20040195659 - Grill, Alfred ; et al.	2004-10-07
Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation Grant 6,759,321 - Babich , et al. July 6, 2	2004-07-06
Hydrogenated oxidized silicon carbon material Grant 6,724,086 - Grill , et al. April 20, 2	2004-04-20
Tunable vapor deposited materials as antireflective coatings, hardmasks and as combined antireflective coating/hardmasks and methods of fabrication thereof and applications thereof Grant 6,514,667 - Angelopoulos , et al. February 4, 2	2003-02-04
Hydrogenated oxidized silicon carbon material Grant 6,497,963 - Grill , et al. December 24, 2	2002-12-24
Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation App 20020185741 - Babich, Katherina ; et al.	2002-12-12
Multiphase low dielectric constant material and method of deposition Grant 6,479,110 - Grill , et al. November 12, 2	2002-11-12
Dual damascene processing for semiconductor chip interconnects Grant 6,448,176 - Grill , et al. September 10, 2	2002-09-10
Multiphase low dielectric constant material and method of deposition Grant 6,437,443 - Grill , et al. August 20, 2	2002-08-20
Tunable and removable plasma deposited antireflective coatings Grant 6,428,894 - Babich , et al. August 6, 2	2002-08-06
Multiphase low dielectric constant material and method of deposition App 20020037442 - Grill, Alfred ; et al.	2002-03-28
Multiphase low dielectric constant material and method of deposition App 20020034625 - Grill, Alfred ; et al.	2002-03-21
Stabilization Of Fluorine-containing Low-k Dielectrics In A Metal/insulator Wiring Structure By Ultraviolet Irradiation App 20020033535 - BABICH, KATHERINA ; et al.	2002-03-21
Method for fabricating a thermally stable diamond-like carbon film as an intralevel or interlevel dielectric in a semiconductor device and device made Grant 6,346,747 - Grill , et al. February 12, 2	2002-02-12
Tunable vapor deposited materials as antireflective coatings, hardmasks and as combined antireflective coating/hardmasks and methods of fabrication thereof and applications thereof App 20020012876 - Angelopoulos, Marie ; et al.	2002-01-31
Tunabale vapor deposited materials as antireflective coatings, hardmasks and as combined antireflective coating/hardmasks and methods of fabrication thereof and application thereof Grant 6,316,167 - Angelopoulos , et al. November 13, 2	2001-11-13
Multiphase low dielectric constant material Grant 6,312,793 - Grill , et al. November 6, 2	2001-11-06
Method and materials for integration of fluorine-containing low-k dielectrics App 20010022398 - Grill, Alfred ; et al.	2001-09-20
Method and material for integration of fuorine-containing low-k dielectrics Grant 6,265,779 - Grill , et al. July 24, 2	2001-07-24
Hydrogenated oxidized silicon carbon material Grant 6,147,009 - Grill , et al. November 14, 2	2000-11-14
Dual damascene processing for semiconductor chip interconnects Grant 6,140,226 - Grill , et al. October 31, 2	2000-10-31
Suspension bent by stressed patch Grant 6,049,443 - Grill , et al. April 11, 2	2000-04-11
Stabilization of low-k carbon-based dielectrics Grant 6,030,904 - Grill , et al. February 29, 2	2000-02-29
Method for fabricating a thermally stable diamond-like carbon film Grant 5,981,000 - Grill , et al. November 9, 1	1999-11-09
Low dielectric constant amorphous fluorinated carbon and method of preparation Grant 5,945,155 - Grill , et al. August 31, 1	1999-08-31
Low dielectric constant amorphous fluorinated carbon and method of preparation Grant 5,942,769 - Grill , et al. August 24, 1	1999-08-24
Plating of noble metal electrodes for DRAM and FRAM Grant 5,789,320 - Andricacos , et al. August 4, 1	1998-08-04
Diamond-like carbon for use in VLSI and ULSI interconnect systems Grant 5,679,269 - Cohen , et al. October 21, 1	1997-10-21
Prebent ceramic suspension Grant 5,663,854 - Grill , et al. September 2, 1	1997-09-02

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.