Park; Yun-Hwi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Park; Yun-Hwi.The latest application filed is for "low temperature co-fired ceramic substrate with embeded capacitors".
- Park; Yun-Hwi - Suwon-Si KR
- Park; Yun Hwi - Gyeonggi-do KR
- PARK; Yun Hwi - Suwon KR
- Park; Yun Hwi - Gyunggi-do N/A KR
- PARK; Yun Hwi - Yongin KR
| Patent | Date |
|---|---|
| Low temperature co-fired ceramic substrate with embeded capacitors Grant 9,681,551 - Na , et al. June 13, 2 | 2017-06-13 |
| Thin film electrode ceramic substrate and method for manufacturing the same Grant 9,101,064 - Yoo , et al. August 4, 2 | 2015-08-04 |
| Low Temperature Co-fired Ceramic Substrate With Embeded Capacitors App 20150122536 - NA; Ji-Sung ; et al. | 2015-05-07 |
| Board For Probe Card, Method Of Manufacturing The Same, And Probe Card App 20150028912 - CHO; Beom Joon ; et al. | 2015-01-29 |
| LTCC composition, LTCC substrate comprising the same and method of manufacturing the same Grant 8,637,143 - Cho , et al. January 28, 2 | 2014-01-28 |
| Thin Film Electrode Ceramic Substrate And Method For Manufacturing The Same App 20130032384 - Yoo; Won Hee ; et al. | 2013-02-07 |
| Thin Film Electrode Ceramic Substrate And Method For Manufacturing The Same App 20130032383 - Yoo; Won Hee ; et al. | 2013-02-07 |
| Furnace App 20130017504 - YOO; Won Hee ; et al. | 2013-01-17 |
| Method Of Manufacturing Ceramic Substrate For Probe Card And Ceramic Substrate For Probe Card App 20120048602 - LEE; Taek Jung ; et al. | 2012-03-01 |
| Ceramic Firing Furnace App 20120037610 - YOO; Won Hee ; et al. | 2012-02-16 |
| Ltcc Composition, Ltcc Substrate Comprising The Same And Method Of Manufacturing The Same App 20120028018 - CHO; Beom Joon ; et al. | 2012-02-02 |
| Antenna Module App 20120007781 - KIM; Joo Yong ; et al. | 2012-01-12 |
| Multilayer ceramic substrate Grant 8,053,682 - Park , et al. November 8, 2 | 2011-11-08 |
| Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip package including an inclined via hole Grant 8,043,896 - Lee , et al. October 25, 2 | 2011-10-25 |
| Space Transformer For Probe Card And Method Of Repairing Space Transformer App 20110063066 - CHOI; Yong Seok ; et al. | 2011-03-17 |
| Electronic chip module Grant 7,872,869 - Lee , et al. January 18, 2 | 2011-01-18 |
| Semiconductor Chip Package App 20100171200 - LEE; Tae Soo ; et al. | 2010-07-08 |
| Semiconductor chip package Grant 7,745,911 - Lee , et al. June 29, 2 | 2010-06-29 |
| Semiconductor Chip, Method Of Manufacturing The Semiconductor Chip And Semiconductor Chip Package App 20100105171 - LEE; Tae Soo ; et al. | 2010-04-29 |
| Semiconductor Multi-chip Package App 20100102430 - LEE; Tae Soo ; et al. | 2010-04-29 |
| Power amplifying device having linearizer Grant 7,692,490 - Cho , et al. April 6, 2 | 2010-04-06 |
| Electric device module App 20100053908 - Hwang; Gyu Man ; et al. | 2010-03-04 |
| Multilayer Ceramic Substrate App 20100055393 - PARK; Yun Hwi ; et al. | 2010-03-04 |
| Electronic Chip Module App 20100020499 - LEE; Tae Soo ; et al. | 2010-01-28 |
| Band pass filter Grant 7,649,431 - Cho , et al. January 19, 2 | 2010-01-19 |
| Wireless Communication Module App 20090184779 - CHO; Yun Hee ; et al. | 2009-07-23 |
| Semiconductor chip package App 20080303120 - Lee; Tae Soo ; et al. | 2008-12-11 |
| Power Amplifying Device Having Linearizer App 20080238553 - CHO; Yun Hee ; et al. | 2008-10-02 |
| Multi-layered band pass filter App 20080100401 - Cho; Yun Hee ; et al. | 2008-05-01 |
| Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip package App 20070267725 - Lee; Tae Soo ; et al. | 2007-11-22 |
| Low temperature co-fired ceramic module and method of manufacturing the same App 20070176302 - Lee; Tae Soo ; et al. | 2007-08-02 |
| RF balanced matching device App 20070139129 - Park; Yun Hwi | 2007-06-21 |
| Stacked semiconductor multi-chip package App 20060091517 - Yoo; Jin O. ; et al. | 2006-05-04 |
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