loadpatents
Patent applications and USPTO patent grants for Park; Seungbae.The latest application filed is for "measurement equipment".
Patent | Date |
---|---|
Measurement equipment Grant 10,222,209 - Park , et al. | 2019-03-05 |
Measurement Equipment App 20180128612 - Park; Seungbae ;   et al. | 2018-05-10 |
Measurement equipment Grant 9,891,048 - Park , et al. February 13, 2 | 2018-02-13 |
Measurement Equipment App 20150211852 - PARK; Seungbae ;   et al. | 2015-07-30 |
Printed Circuit Board Assembly Manufacturing Device And Method App 20120018084 - Jang; Kyung Woon ;   et al. | 2012-01-26 |
Wafer Scale Thin Film Package App 20080119029 - Caletka; David Vincent ;   et al. | 2008-05-22 |
Wafer scale thin film package Grant 7,348,261 - Caletka , et al. March 25, 2 | 2008-03-25 |
Solder Interconnect Joints For A Semiconductor Package App 20080029888 - Park; Seungbae ;   et al. | 2008-02-07 |
Wafer scale thin film package App 20030199121 - Caletka, David Vincent ;   et al. | 2003-10-23 |
Wafer scale thin film package Grant 6,627,998 - Caletka , et al. September 30, 2 | 2003-09-30 |
Warpage compensating heat spreader Grant 6,288,900 - Johnson , et al. September 11, 2 | 2001-09-11 |
NCAGE Code | 4BYN0 | PARK SEUNGBAE!DBA SB |
CAGE Code | 4BYN0 | PARK SEUNGBAE SB |
DUNS | 619138527 | PARK SEUNGBAE |
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