Park; Sangmi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Sangmi.The latest application filed is for "semiconductor device and method of forming conductive vias to have enhanced contact to shielding layer".

Company Profile

1.16.17

Park; Sangmi - Seoul KR
Park; SangMi - Kyunggi-Do KR
Park; SangMi - Incheon KR
Park; Sangmi - Gyeonggi-do KR
Park; SangMi - Pucheon-Si N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for authentication and electronic device supporting the same Grant 10,735,390 - Kim , et al.	2020-08-04
Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package Grant 10,665,534 - Lee , et al.	2020-05-26
Semiconductor Device and Method of Forming Conductive Vias to Have Enhanced Contact to Shielding Layer App 20190318984 - Kim; SungSoo ; et al.	2019-10-17
Semiconductor Device and Method of Using Partial Wafer Singulation for Improved Wafer Level Embedded System In Package App 20180019195 - Lee; KyungHoon ; et al.	2018-01-18
Method for processing authentication, electronic device and server for supporting the same Grant 9,872,176 - Kim , et al. January 16, 2	2018-01-16
Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package Grant 9,799,590 - Lee , et al. October 24, 2	2017-10-24
Transmission of digital content to select devices Grant 9,794,606 - Park , et al. October 17, 2	2017-10-17
Method For Authentication And Electronic Device Supporting The Same App 20170244688 - Kim; Jaehwan ; et al.	2017-08-24
Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant Grant 9,318,380 - Kim , et al. April 19, 2	2016-04-19
Method For Processing Authentication, Electronic Device And Server For Supporting The Same App 20160080938 - KIM; Junghun ; et al.	2016-03-17
Semiconductor Device and Method of Forming Stacked Semiconductor Die and Conductive Interconnect Structure Through an Encapsulant App 20140322865 - Kim; YoungJoon ; et al.	2014-10-30
Transmission Of Digital Content To Select Devices App 20140325554 - PARK; Sangmi ; et al.	2014-10-30
Semiconductor Device and Method of Using Partial Wafer Singulation for Improved Wafer Level Embedded System in Package App 20140264817 - Lee; KyungHoon ; et al.	2014-09-18
Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant Grant 8,816,404 - Kim , et al. August 26, 2	2014-08-26
Integrated circuit packaging system having warpage prevention structures Grant 8,723,310 - Park , et al. May 13, 2	2014-05-13
Integrated circuit packaging system with heat conduction and method of manufacture thereof Grant 8,679,900 - Choi , et al. March 25, 2	2014-03-25
Integrated Circuit Packaging System With Warpage Prevention Mechanism And Method Of Manufacture Thereof App 20130334714 - Park; YiSu ; et al.	2013-12-19
Integrated Circuit Packaging System With Film Assist And Method Of Manufacture Thereof App 20130328220 - Lee; KyungHoon ; et al.	2013-12-12
Integrated Circuit Packaging System With Heat Conduction And Method Of Manufacture Thereof App 20130154085 - Choi; DaeSik ; et al.	2013-06-20
Integrated circuit packaging system with stack interconnect and method of manufacture thereof Grant 8,466,567 - Choi , et al. June 18, 2	2013-06-18
Semiconductor Device and Method of Forming Stacked Semiconductor Die and Conductive Interconnect Structure Through an Encapsulant App 20130069239 - Kim; YoungJoon ; et al.	2013-03-21
Integrated circuit packaging system with stack interconnect and method of manufacture thereof Grant 8,372,695 - Park , et al. February 12, 2	2013-02-12
Integrated Circuit Packaging System With Stack Interconnect And Method Of Manufacture Thereof App 20120126428 - Park; SangMi ; et al.	2012-05-24
Integrated Circuit Packaging System With Stack Interconnect And Method Of Manufacture Thereof App 20120068319 - Choi; DaeSik ; et al.	2012-03-22

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