| Patent | Date |
|---|
Hybrid Wafer Dicing Approach Using An Actively-focused Laser Beam Laser Scribing Process And Plasma Etch Process
App 20220246476 - Balakrishnan; Karthik ; et al. | 2022-08-04 |
Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process
Grant 11,342,226 - Balakrishnan , et al. May 24, 2 | 2022-05-24 |
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
Grant 11,217,536 - Park , et al. January 4, 2 | 2022-01-04 |
Automatic Kerf Offset Mapping And Correction System For Laser Dicing
App 20210398853 - Balakrishnan; Karthik ; et al. | 2021-12-23 |
Laser Scribing Trench Opening Control In Wafer Dicing Using Hybrid Laser Scribing And Plasma Etch Approach
App 20210398854 - Park; Jungrae ; et al. | 2021-12-23 |
Hybrid Wafer Dicing Approach Using A Spatially Multi-focused Laser Beam Laser Scribing Process And Plasma Etch Process
App 20210233816 - Park; Jungrae ; et al. | 2021-07-29 |
Methods And Apparatus For Wafer-level Packaging Using Direct Writing
App 20210202334 - SUO; PENG ; et al. | 2021-07-01 |
Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process
Grant 11,011,424 - Park , et al. May 18, 2 | 2021-05-18 |
Hybrid Wafer Dicing Approach Using A Uniform Rotating Beam Laser Scribing Process And Plasma Etch Process
App 20210050263 - Park; Jungrae ; et al. | 2021-02-18 |
Hybrid Wafer Dicing Approach Using An Actively-focused Laser Beam Laser Scribing Process And Plasma Etch Process
App 20210050262 - Balakrishnan; Karthik ; et al. | 2021-02-18 |
Hybrid Wafer Dicing Approach Using A Spatially Multi-focused Laser Beam Laser Scribing Process And Plasma Etch Process
App 20210043515 - Park; Jungrae ; et al. | 2021-02-11 |
Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process
Grant 10,903,121 - Park , et al. January 26, 2 | 2021-01-26 |
Mitigation of particle contamination for wafer dicing processes
Grant 10,661,383 - Lei , et al. | 2020-05-26 |
Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process
Grant 10,535,561 - Park , et al. Ja | 2020-01-14 |
Mitigation Of Particle Contamination For Wafer Dicing Processes
App 20190291206 - Lei; Wei-Sheng ; et al. | 2019-09-26 |
Hybrid Wafer Dicing Approach Using A Multiple Pass Laser Scribing Process And Plasma Etch Process
App 20190279902 - PARK; Jungrae ; et al. | 2019-09-12 |
Mitigation of particle contamination for wafer dicing processes
Grant 10,363,629 - Lei , et al. | 2019-07-30 |
Mitigation Of Particle Contamination For Wafer Dicing Processes
App 20180345418 - Lei; Wei-Sheng ; et al. | 2018-12-06 |
Hybrid Wafer Dicing Approach Using A Split Beam Laser Scribing Process And Plasma Etch Process
App 20180226355 - PARK; JUNGRAE ; et al. | 2018-08-09 |
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
Grant 9,972,575 - Park , et al. May 15, 2 | 2018-05-15 |
Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
Grant 9,852,997 - Park , et al. December 26, 2 | 2017-12-26 |
Hybrid Wafer Dicing Approach Using A Rotating Beam Laser Scribing Process And Plasma Etch Process
App 20170278801 - Park; Jungrae ; et al. | 2017-09-28 |
Wafer coating
Grant 9,768,014 - Park , et al. September 19, 2 | 2017-09-19 |
Hybrid Wafer Dicing Approach Using A Split Beam Laser Scribing Process And Plasma Etch Process
App 20170256500 - Park; Jungrae ; et al. | 2017-09-07 |
UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach
Grant 9,601,375 - Lei , et al. March 21, 2 | 2017-03-21 |
Uv-cure Pre-treatment Of Carrier Film For Wafer Dicing Using Hybrid Laser Scribing And Plasma Etch Approach
App 20160315009 - Lei; Wei-Sheng ; et al. | 2016-10-27 |
Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process
Grant 9,355,907 - Lei , et al. May 31, 2 | 2016-05-31 |
Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process
Grant 9,349,648 - Lei , et al. May 24, 2 | 2016-05-24 |
Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance
Grant 9,299,611 - Lei , et al. March 29, 2 | 2016-03-29 |
Hybrid Wafer Dicing Approach Using An Adaptive Optics-controlled Laser Scribing Process And Plasma Etch Process
App 20160086851 - Park; Jungrae ; et al. | 2016-03-24 |
Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process
Grant 9,281,244 - Park , et al. March 8, 2 | 2016-03-08 |
Hybrid Wafer Dicing Approach Using A Rectangular Shaped Two-dimensional Top Hat Laser Beam Profile Or A Linear Shaped One-dimensiional Top Hat Laser Beam Profile Laser Scribing Process And Plasma Etch Process
App 20160027697 - Lei; Wei-Sheng ; et al. | 2016-01-28 |
Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process
Grant 9,245,803 - Park , et al. January 26, 2 | 2016-01-26 |
Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process
Grant 9,196,536 - Park , et al. November 24, 2 | 2015-11-24 |
Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile
Grant 9,177,861 - Park , et al. November 3, 2 | 2015-11-03 |
Method of die singulation using laser ablation and induction of internal defects with a laser
Grant 9,165,832 - Papanu , et al. October 20, 2 | 2015-10-20 |
Hybrid Wafer Dicing Approach Using Collimated Laser Scribing Process And Plasma Etch
App 20150287638 - Park; Jungrae ; et al. | 2015-10-08 |
Baking Tool For Improved Wafer Coating Process
App 20150255346 - PARK; Jungrae ; et al. | 2015-09-10 |
Baking tool for improved wafer coating process
Grant 9,130,030 - Park , et al. September 8, 2 | 2015-09-08 |
Hybrid Wafer Dicing Approach Using Temporally-controlled Laser Scribing Process And Plasma Etch
App 20150243559 - Park; Jungrae ; et al. | 2015-08-27 |
Wafer dicing method for improving die packaging quality
Grant 9,105,710 - Lei , et al. August 11, 2 | 2015-08-11 |
Improved Wafer Coating
App 20150221505 - Park; Jungrae ; et al. | 2015-08-06 |
Wafer Dicing Using Hybrid Laser Scribing And Plasma Etch Approach With Mask Plasma Treatment For Improved Mask Etch Resistance
App 20150214109 - Lei; Wei-Sheng ; et al. | 2015-07-30 |
Wireless passive radio-frequency strain and displacement sensors
Grant 9,038,483 - Nagarajan , et al. May 26, 2 | 2015-05-26 |
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean
Grant 9,012,305 - Lei , et al. April 21, 2 | 2015-04-21 |
Wafer coating
Grant 8,991,329 - Park , et al. March 31, 2 | 2015-03-31 |
Wafer Dicing Method For Improving Die Packaging Quality
App 20150064878 - LEI; Wei-Sheng ; et al. | 2015-03-05 |
Wireless Passive Radio-Frequency Strain And Displacement Sensors
App 20120297888 - Nagarajan; Ramaswamy ; et al. | 2012-11-29 |
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