Park; Hwa-sun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Hwa-sun.The latest application filed is for "led package".

Company Profile

2.16.20

Park; Hwa-sun - Suwon-si KR
- Suwon-si KR
Park; Hwa Sun - Gyunggi-do KR
Park; Hwa Sun - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package of light emitting diode with heat sink Grant 9,356,005 - Suh , et al. May 31, 2	2016-05-31
Led Package App 20150348950 - SUH; Su-jeong ; et al.	2015-12-03
Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof Grant 9,136,455 - Suh , et al. September 15, 2	2015-09-15
Substrate For Light Emitting Diode And Method Of Manufacturing The Same And Light Source Apparatus Including The Substrate App 20150200343 - SUH; Su-jeong ; et al.	2015-07-16
Substrate For Semiconductor Device, Semiconductor Device Having The Substrate, And Manufacturing Method Thereof App 20150179908 - SUH; Su Jeong ; et al.	2015-06-25
Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof Grant 9,000,593 - Suh , et al. April 7, 2	2015-04-07
Method Of Processing Cavity Of Core Substrate App 20140123486 - JEONG; Jin-Soo ; et al.	2014-05-08
Method of processing cavity of core substrate Grant 8,633,397 - Jeong , et al. January 21, 2	2014-01-21
Electronics component embedded PCB Grant 08618421 -	2013-12-31
Electronics component embedded PCB Grant 8,618,421 - Byun , et al. December 31, 2	2013-12-31
PCB strip and manufacturing method for electronic component embedded PCB Grant 8,482,890 - Kim , et al. July 9, 2	2013-07-09
Substrate For Semiconductor Device, Semiconductor Device Having The Substrate, And Manufacturing Method Thereof App 20130037955 - SUH; Su Jeong ; et al.	2013-02-14
Method of manufacturing capacitor-embedded PCB Grant 8,302,270 - Kim , et al. November 6, 2	2012-11-06
Method Of Manufacturing Substrate For Capacitor-embedded Printed Circuit Board And Capacitor-embedded Printed Circuit Board App 20120152886 - KIM; Woon-Chun ; et al.	2012-06-21
Method of manufacturing printed circuit board having embedded resistors Grant 8,166,653 - Park , et al. May 1, 2	2012-05-01
Pcb Strip And Manufacturing Method For Electronic Component Embedded Pcb App 20110176246 - KIM; Moon-il ; et al.	2011-07-21
Method of manufacturing capacitor-embedded PCB App 20110099779 - Kim; Woon-Chun ; et al.	2011-05-05
Electronics Component Embedded Pcb App 20110100689 - BYUN; Jung-Soo ; et al.	2011-05-05
Method Of Processing Cavity Of Core Substrate App 20110048780 - Jeong; Jin-Soo ; et al.	2011-03-03
Method of manufacturing capacitor-embedded PCB Grant 7,886,414 - Kim , et al. February 15, 2	2011-02-15
Method of manufacturing printed circuit board having embedded resistors App 20100269335 - Park; Hwa Sun ; et al.	2010-10-28
Method of manufacturing component-embedded printed circuit board Grant 7,730,612 - Park , et al. June 8, 2	2010-06-08
Printed Circuit Board And Manufacturing Method Thereof App 20100097770 - Park; Hwa-Sun ; et al.	2010-04-22
Printed circuit board including electronic component embedded therein and method of manufacturing the same App 20090301766 - Park; Hwa Sun ; et al.	2009-12-10
Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof App 20090244864 - Kim; Woon-Chun ; et al.	2009-10-01
Method of manufacturing component-embedded printed circuit board App 20090049686 - Park; Hwa-Sun ; et al.	2009-02-26
Method of manufacturing capacitor-embedded PCB App 20090025195 - Kim; Woon-Chun ; et al.	2009-01-29
Printed circuit board having embedded resistors and method of manufacturing the same App 20080110669 - Park; Hwa Sun ; et al.	2008-05-15
Method for manufacturing circuit board with built-in electronic components Grant 7,328,504 - Kim , et al. February 12, 2	2008-02-12
Method for manufacturing circuit board with built-in electronic components App 20070006456 - Kim; Seung Gu ; et al.	2007-01-11
Fabrication method of an epilayer structure InGaAsP/InP ridge waveguide phase modulator with high phase modulation efficiency Grant 7,037,739 - Byun , et al. May 2, 2	2006-05-02
Fabrication method of an epilayer structure InGaAsP/InP ridge waveguide phase modulator with high phase modulation efficiency App 20050148107 - Byun, Young Tae ; et al.	2005-07-07

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