Papathomas; Kostas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Papathomas; Kostas.The latest application filed is for "power core for use in circuitized substrate and method of making same".

Company Profile

0.16.8

Papathomas; Kostas - Endicott NY US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers Grant 8,445,094 - Japp , et al. May 21, 2	2013-05-21
Power core for use in circuitized substrate and method of making same Grant 8,198,551 - Japp , et al. June 12, 2	2012-06-12
Power Core For Use In Circuitized Substrate And Method Of Making Same App 20110284273 - Japp; Robert M. ; et al.	2011-11-24
Information handling system including a circuitized substrate having a dielectric layer without continuous fibers Grant 7,508,076 - Japp , et al. March 24, 2	2009-03-24
Method of making circuitized substrate Grant 7,416,996 - Japp , et al. August 26, 2	2008-08-26
Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers App 20080003407 - Japp; Robert ; et al.	2008-01-03
Dielectric composition for forming dielectric layer for use in circuitized substrates Grant 7,270,845 - Japp , et al. September 18, 2	2007-09-18
Circuitized substrate Grant 7,078,816 - Japp , et al. July 18, 2	2006-07-18
Method of making circuitized substrate App 20060131755 - Japp; Robert ; et al.	2006-06-22
Information handling system App 20060125103 - Japp; Robert ; et al.	2006-06-15
Circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same App 20050224985 - Japp, Robert ; et al.	2005-10-13
Dielectric composition for forming dielectric layer for use in circuitized substrates App 20050224767 - Japp, Robert ; et al.	2005-10-13
Electrically conductive filled through holes App 20030162047 - Appelt, Bernd K. ; et al.	2003-08-28
An Electronic Package Having A Substrate With Electrically Conductive Filled Through Holes App 20030006066 - APPELT, BERND K. ; et al.	2003-01-09
Methods for selectively filling apertures Grant 6,376,158 - Jones , et al. April 23, 2	2002-04-23
High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer Grant 6,323,436 - Hedrick , et al. November 27, 2	2001-11-27
Information handling system with circuit assembly having holes filled with filler material Grant 6,178,093 - Bhatt , et al. January 23, 2	2001-01-23
Photoresist develop and strip solvent compositions and method for their use Grant 6,127,097 - Bantu , et al. October 3, 2	2000-10-03
Process for manufacturing a circuit with filled holes Grant 6,000,129 - Bhatt , et al. December 14, 1	1999-12-14
Via fill compositions for direct attach of devices and methods for applying same Grant 5,766,670 - Arldt , et al. June 16, 1	1998-06-16
Stabilization of conductive adhesive by metallurgical bonding Grant 5,542,602 - Gaynes , et al. August 6, 1	1996-08-06
Photoresist develop and strip solvent compositions and method for their use Grant 5,268,260 - Bantu , et al. December 7, 1	1993-12-07
Dielectric composition and solder interconnection structure for its use Grant 5,194,930 - Papathomas , et al. March 16, 1	1993-03-16

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